Latest Flip chip Stories

More New Thermal Interface Material Characterization Tools SANTA CLARA, Calif., April 16, 2013 /PRNewswire/ -- Thermal Engineering Associates, Inc. (TEA) announces the availability of a new family of Thermal Interface Material (TIM) characterization tools that offer flexibility, standardization, and low cost. The tools are comprised of the popular TEA Thermal Test Chip (TTC) in sizes ranging from 2.5mm square to 12.8mm square mounted on a variety of popular packages including BGA,...

“Flip-Chip Market and Technology Trends” new market research report added to ReportsnReports.com store. Dallas, Texas (PRWEB) April 14, 2013 Over the next five years, an incredible 3x wafer growth is expected for the Flip-Chip platform, which will reach 40M+ of 12’’eq wspy by 2018! Despite its high 19% CAGR, Flip-chip is not new -- in fact, it was first introduced by IBM over 30 years ago! As such, it would be easy to consider it an old, uninteresting, mature technology. But this...

PHOENIX, March 18, 2013 /PRNewswire/ -- FlipChip International (FCI), the global technology leader in flip chip bumping and Wafer Level Packaging announced today its Elite(TM) OPM technology which provides a wider process window for copper wire bonding to support the growing transition of customer products away from costly gold wire. OPM technology will be available from FlipChip Millennium Shanghai facility (FCMS), a subsidiary of FCI, and will provide an integral landing pad...

PHOENIX, Aug. 1, 2012 /PRNewswire/ -- FlipChip International - (FCI), the global technology leader in Wafer Level Packaging and flip chip bumping announced today the appointment of Weng Kay Lui as Asian Sales Director. Weng Kay Lui will be based in Shanghai and be responsible for Sales and Marketing in Asia, offering all FCI Global Services to the Semiconductor Industry, including the expanded Wafer Level Package capability being installed at FlipChip Millennium (Shanghai) - (FCMS),...

BILLERICA, Mass., July 10, 2012 /PRNewswire/ -- TEL NEXX, Inc., (TEL NEXX), a wholly owned subsidiary of Tokyo Electron U.S. Holdings and a leading supplier of advanced wafer packaging solutions, announces that a world leader in innovative High Performance LED technology has purchased an Apollo physical vapor deposition (PVD) system for an Asian manufacturing facility. The Apollo tool will help reduce the manufacturing costs of the supplier's unique LED structures and control overall...

SANTA CLARA, Calif., July 10, 2012 /PRNewswire/ -- Microsanj announces the availability of a new high performance product in the Thermoreflectance Nanotherm Series. The NT220A, featured at the IPFA-2012 Conference in Singapore, adds near-Infrared capability to support Through-the-Substrate thermal imaging. This feature enables accurate high resolution thermal mapping and analysis of flip-chip assemblies. With a 1300 nm LED source, the NT220A provides micron spatial resolution at the...

PHOENIX, July 9, 2012 /PRNewswire/ -- FlipChip International - (FCI), a global technology leader in Wafer Level Packaging and flip chip wafer bumping, announced today the acquisition of Millennium Microtech Holdings Corporation (MMH) of the Cayman Islands through a strategic Merger with FCI's Cayman Island entity. FCI's acquisition of MMH results in FCI securing controlling interest in Millennium Microtech (Shanghai) (MMS), located in the Zhang Jiang Hi- Tech Park, Pudong New Area,...

BILLERICA, Mass., July 5, 2012 /PRNewswire/ -- TEL NEXX, Inc., a wholly owned subsidiary of Tokyo Electron U.S. Holdings, is pleased to announce a new multi-year joint development program in 3D semiconductor packaging with IBM. TEL NEXX has collaborated with IBM R&D for many years (as NEXX Systems) to develop new concepts for interposers, lead-free bumping, microbumps, and other cutting-edge interconnect solutions. Now denser packaging and more energy conscious requirements are...

CARLSBAD, Calif., July 3, 2012 /PRNewswire-iReach/ -- Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the company will be exhibiting live demonstrations on the 3800 Die Bonder and 8000 Wire Bonder at SEMICON West 2012, July 10-12 in San Francisco, CA, in booth #6157. (Photo: http://photos.prnewswire.com/prnh/20120703/CG33742) The 3800 Die Bonder demonstration will reveal a fully automated...

WINDACH, Germany, June 20, 2012 /PRNewswire/ -- - New adhesive for RFID applications The worldwide RFID market is gaining ground. IDTechEx forecasts that the industry will grow by 2.4 to a total of 125 billion RFID tags by 2020*. Manufacturers of RFID labels focus on reasonably priced production. At the same time, the tag chip must be fixed in a reliable way. The new DELOMONOPOX AD268 epoxy resin copes with these requirements. It enables extremely fast production...