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Latest FlipChip International LLC Stories

2014-03-10 04:21:49

PHOENIX, March 10, 2014 /PRNewswire/ -- FlipChip International - (FCI), the global technology leader in flip chip bumping and Wafer Level Packaging announced they will give the following paper at the IMAPS - 10(th) International Conference and Exhibition on Device Packaging 2014 in Scottsdale Arizona, USA. http://photos.prnewswire.com/prnvar/20120306/LA64593LOGO-a Dielectric Laser Via Drilling for Next Generation Wafer Level Processing Jim Zaccardi, FlipChip International (Guy...


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  • Color; hue; complexion.
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