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Latest FOUP Stories

2012-07-03 08:20:01

TDK developed and launched a high-performance FOUP model compatible with next-generation 450 mm wafers and a new model for 300 mm wafers that offers enhanced cost competitivenessTokyo,

2011-07-11 08:00:00

SAN FRANCISCO, Calif., July 11, 2011 /PRNewswire/ -- SEMICON WEST -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the semiconductor industry's first bonding system for 450-mm-diameter wafers manufactured from silicon-on-insulator (SOI) substrates.

2008-06-23 06:00:27

Samsung Electronics and Germany's Siltronic have opened a $1 billion joint venture 300mm silicon wafers plant in Singapore, named Siltronic Samsung Wafer. The 300mm wafers are currently the most advanced and largest diameter silicon wafers in commercial mass production.


Word of the Day
ultimo
  • In the month which preceded the present; in the last month, as distinguished from the current or present month and all others.
  • In the month which preceded the present; in the last month, as distinguished from the current or present month and all others.
The word 'ultimo' comes from the Latin phrase 'ultimo mense', 'in the last month'.
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