Latest FOUP Stories
TDK developed and launched a high-performance FOUP model compatible with next-generation 450 mm wafers and a new model for 300 mm wafers that offers enhanced cost competitivenessTokyo,
SAN FRANCISCO, Calif., July 11, 2011 /PRNewswire/ -- SEMICON WEST -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the semiconductor industry's first bonding system for 450-mm-diameter wafers manufactured from silicon-on-insulator (SOI) substrates.
EIN HAROD, Israel, Nov.
Samsung Electronics and Germany's Siltronic have opened a $1 billion joint venture 300mm silicon wafers plant in Singapore, named Siltronic Samsung Wafer. The 300mm wafers are currently the most advanced and largest diameter silicon wafers in commercial mass production.