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Last updated on April 17, 2014 at 17:30 EDT

Latest Fujikura Ltd. Stories

2012-06-12 10:25:54

PHOENIX, June 12, 2012 /PRNewswire/ -- FlipChip International, LLC (FCI) of Phoenix, Arizona (President: Bob Forcier) and Fujikura Ltd. (President: Yoichi Nagahama) today announced conclusion of a Joint Strategic Sales and Business Development Agreement. This agreement will allow both parties to combine technology development, design, sales and marketing for their recently launched ChipletT(TM) and ChipsetT(TM) ultra low profile embedded semiconductor package product lines based on both the...

2011-12-09 14:00:00

Court denied AFLâs request for a preliminary injunction against SurplusEQ.com. Phoenix, AZ (PRWEB) December 09, 2011 A preliminary injunction sought by AFL Telecommunications was denied by the court in the ongoing lawsuit filed by AFL v SurplusEQ.com, Fed. Dist. Ct. of AZ, CV 11-01086-PHX-FJM. SurplusEQ.com won the first round. The court denied AFL request preliminary injunction on September 13, 2011. SurplusEQ.com, Inc. is a global supplier and trader of new, used, and surplus...

2011-11-10 07:00:00

PHOENIX, Nov. 10, 2011 /PRNewswire/ -- FlipChip International, LLC USA (FCI) and Fujikura Ltd. (President: Yoichi Nagahama) today announced ChipletT(TM) and ChipsetT(TM) embedded die packages for single die or multi-die semiconductor packaging applications. ChipletT and ChipsetT package products are based on Fujikura's flex-based laminate embedded die technology "WABE Technology(TM)" and will provide breakthrough cost-effective, ultra low profile packages by leveraging roll to roll...