Latest Hybrid silicon laser Stories
Electrical engineers at The University of Texas at Arlington and at the University of Wisconsin-Madison have devised a new laser for on-chip optical connections that could give computers a huge boost in speed and energy efficiency.
SAN FRANCISCO, Calif., July 11, 2011 /PRNewswire/ -- SEMICON WEST -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the semiconductor industry's first bonding system for 450-mm-diameter wafers manufactured from silicon-on-insulator (SOI) substrates.
The Optical Society (OSA) is pleased to recognize the groundbreaking research presented yesterday at its topical meeting, Integrated Photonics Research, Silicon and Nano Photonics (IPR), by Intel Corporation.
In what promises to be an important advance, researchers at the University of California, Santa Barbara have developed a novel laser by bonding optical gain layers directly to a silicon laser cavity. This hybrid laser offers an alternative to silicon Raman lasers and is an order of magnitude shorter. The laser is optically pumped, operates in continuous wave mode, and only needs 30 mW of input pump power.
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- One of the upright handlebars on a traditional Inuit sled.