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2012-12-11 05:02:28

December 18th workshop provides step-by-step methodology for integrating lean tools with product development. Quincy, IL (PRWEB) December 10, 2012 The

2012-03-07 04:20:01

3D Chip Packaging Expected to be a Major Inflection Point for the Semiconductor Industry, Allowing Smaller Packages, Lower Power Consumption and Higher Data BandwidthSingapore,

2011-05-25 04:35:01

Singapore, May 25, 2011 - (ACN Newswire) - The Institute of Microelectronics (IME), an institute of the Agency for Science, Technology and Research (A*STAR) have announced today their cooperation with TowerJazz, the global specialty foundry leader, on breakthrough projects in micro-electro-mechanical systems (MEMS), packaging and application-specific integrated circuits (ASICs).IME seeks to advance research and development (R&D) in microelectronics in the area of MEMS, packaging and IC...

2011-05-17 02:00:00

HSINCHU, Taiwan, R.O.C., May 17, 2011 /PRNewswire/ -- TSMC (TWSE: 2330, NYSE: TSM) today announced the winner of the TSMC Europractice Innovation award for the most innovative mixed signal or RF (Radio Frequency) design submitted by a European university through the Europractice IC service coordinated by imec.

2011-04-13 04:35:01

Joint facility will develop new tools and integration schemes for growing wafer-level packaging marketSingapore, Apr 13, 2011 - (ACN Newswire) - Applied Materials, Inc., the global leader in providing manufacturing solutions for the semiconductor, flat panel display and solar photovoltaic industries, today signed an agreement with the Institute of Microelectronics (IME), a world-renowned research institute under the Agency for Science, Technology and Research (A*STAR), to set up a Center of...


Word of the Day
cowpooling
  • The practice of two or more parties jointly purchasing all or part of a butchered cow and dividing the meat between them.
The word 'cowpooling' was formed on the model of 'carpooling'.