Latest IMEC Stories
HSINCHU, Taiwan, R.O.C., May 17, 2011 /PRNewswire/ -- TSMC (TWSE: 2330, NYSE: TSM) today announced the winner of the TSMC Europractice Innovation award for the most innovative mixed signal or RF (Radio Frequency) design submitted by a European university through the Europractice IC service coordinated by imec.
Joint facility will develop new tools and integration schemes for growing wafer-level packaging marketSingapore, Apr 13, 2011 - (ACN Newswire) - Applied Materials, Inc., the global leader in providing manufacturing solutions for the semiconductor, flat panel display and solar photovoltaic industries, today signed an agreement with the Institute of Microelectronics (IME), a world-renowned research institute under the Agency for Science, Technology and Research (A*STAR), to set up a Center of...
PARIS, September 29, 2010 /PRNewswire/ -- Set up in December 2001 as a spin-off of IMEC, Photovoltech has the backing of its shareholders TOTAL and GDF SUEZ.
ST. FLORIAN, Austria, Sept.
LONDON, May 18 /PRNewswire/ -- A group of industry leaders throughout the electronics industry today announced the launch of the Hardware Intrinsic Security (HIS) Initiative -- an educational forum dedicated to reduce barriers and advance the adoption of HIS solutions.
GENEVA, May 6 /PRNewswire-FirstCall/ -- STMicroelectronics, the leader of the MEDEA+ FOREMOST "Integration of 45nm CMOS technology" Advanced R&D project, today announced that FOREMOST has been short-listed as one of three finalists for the 2010 EUREKA Innovation Award. The EUREKA German Chairmanship invited one member from each of the three short-listed projects at the EUREKA stand at the Hannover Messe (April 19-20,) in Germany.
CATANIA, Italy, April 1 /PRNewswire-FirstCall/ -- The partners in a new EU-funded research project today announced details of the multinational/multidisciplinary program: "THERMINATOR -- Modeling, Control and Management of Thermal Effects in Electronic Circuits of the Future".
IRVINE, Calif., March 22 /PRNewswire/ -- WiSpry, Inc., the leader in programmable radio frequency (RF) semiconductor products for the wireless industry, today announced that President & COO, Jeff Hilbert will be a featured presenter at the IEEE Components, Packaging and Manufacturing Technology Society Monthly Luncheon Speaker Series to be held March 25, 2010 in Santa Clara, Calif.
MOUNTAIN VIEW, Calif., March 9 /PRNewswire-FirstCall/ -- Synopsys, Inc.