Latest Immersion lithography Stories
New metrology and inspection tools facilitate advanced patterning techniques for manufacturing sub-20nm memory and microprocessor chips MILPITAS, Calif., Feb. 25, 2013 /PRNewswire/ -- At the SPIE Advanced Lithography conference, KLA-Tencor Corporation (NASDAQ: KLAC) announced its SpectraShape(TM) 9000 optical critical dimension (CD) metrology system and BDR300(TM) backside defect inspection and review module. The SpectraShape 9000 is a new metrology system capable of monitoring the...
MILPITAS, Calif., Sept. 5, 2012 /PRNewswire/ -- Today KLA-Tencor Corporation (NASDAQ: KLAC) announced the Archer(TM) 500, a new overlay metrology system for leading-edge chip manufacturers. Designed to address the complex overlay challenges associated with single- and multi-patterning lithography techniques at advanced design nodes, the Archer 500 measures and characterizes overlay error with improved precision, accuracy and measurement speed compared to its predecessor, the widely...
SAN DIEGO, July 9, 2012 /PRNewswire/ -- Cymer, Inc. (Nasdaq: CYMI), the world's leading supplier of light sources used by chipmakers to pattern advanced semiconductor chips, today announced its focus drilling technology for ArF immersion light sources has been adopted by leading chipmakers since its introduction in March 2011. Designed to support the extension of 193nm immersion lithography, focus drilling customers are currently using the technology to improve depth of focus...
MILPITAS, Calif., April 23, 2012 /PRNewswire/ -- Today KLA-Tencor Corporation (NASDAQ: KLAC), announced a new, high-throughput defect inspection / metrology / review system for leading-edge chip manufacturers: the CIRCL(TM) suite. Designed for operation in lithography, outgoing quality control (OQC) and other process modules, this new cluster tool monitors the front side, back side and edge of the wafer for defects and, in parallel, measures wafer edge profile, edge bead...
KAWASAKI, Japan, April 26 /PRNewswire/ --Technology consortium, the Extreme Ultraviolet Lithography System Development Association (EUVA), today announced that its extreme ultraviolet (EUV) light source has achieved a power output of 104 Watts at the intermediate focus (IF), at which EUV is effectively radiated. Supported by the New Energy and Industrial Technology Development Organization (NEDO), the EUVA has been working on the development of laser produced plasma (LPP) light sources for...
OYAMA, Japan, April 26 /PRNewswire/ -- Gigaphoton Inc., a major lithography light source manufacturer for the global semiconductor industry, today announced that an extreme ultraviolet (EUV) light source developed by the technology consortium Extreme Ultraviolet Lithography System Development Association has achieved the world's highest output--104 Watts. Today's milestone marks an industry first and signals a significant step forward in the realization of the first volume-production-worthy...
SAN JOSE, Calif., Feb. 23 /PRNewswire/ -- D2S(TM), an emerging design and software company, today announced its new design for e-beam (DFEB) mask technology for the production of advanced optical photomasks with circular and curvilinear shapes. Used in conjunction with currently available e-beam mask writing equipment, D2S DFEB mask technology reduces the write times for masks containing complex or curvilinear features to enable the extension of 193-nm immersion lithography to the 22-nm...
SAN JOSE, Calif., Feb. 23 /PRNewswire/ -- The eBeam Initiative, a forum dedicated to the education and promotion of a new design-to-manufacturing approach known as design for e-beam (DFEB), today announced that six additional companies spanning the entire semiconductor value chain have joined the Initiative to support the new DFEB mask roadmap for high-volume applications. The roadmap incorporates new innovations to e-beam mask making using DFEB in conjunction with e-beam mask writing...
VELDHOVEN, Netherlands and HSINCHU, Taiwan, R.O.C., Feb. 21 /PRNewswire-FirstCall/ -- ASML Holding NV (ASML) today announced that Taiwan Semiconductor Manufacturing Company (TWSE: 2330, NYSE: TSM) will take delivery of a TWINSCAN NXE:3100 extreme ultra-violet (EUV) lithography system. This tool represents one of six NXE:3100 EUV systems for ASML's worldwide partners and customers. TSMC is expected to be the first dedicated foundry conducting on-site EUV development and will install the new...
MILPITAS, Calif., Feb. 18 /PRNewswire-FirstCall/ -- Today KLA-Tencor Corporation (Nasdaq: KLAC), the world's leading supplier of process control and yield management solutions for the semiconductor and related industries, introduced the latest generation of their PROLITH virtual lithography tool. PROLITH X3.1 enables researchers at leading-edge chipmakers, consortia and equipment makers to quickly and cost-effectively troubleshoot challenging issues in EUV and double patterning lithography...
