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Last updated on April 21, 2014 at 1:20 EDT

Latest Integrated circuit packaging Stories

2014-04-11 23:03:02

The market for semiconductor and IC packaging materials in terms of revenue is expected to reach $26 million by 2019, growing at a CAGR of 4.5% from 2014 to 2019. (http://www.marketsandmarkets.com/Market-Reports/semiconductor-ic-packaging-materials-market-31363123.html) (PRWEB) April 11, 2014 The report defines and segments the "Semiconductor & IC Packaging Materials Market by Types (Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, and so on), Packaging...

2014-04-11 08:25:34

DUBLIN, April 11, 2014 /PRNewswire/ -- Research and Markets ( http://www.researchandmarkets.com/research/f4vpw3/highdensity) has announced the addition of the "High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends" [http://www.researchandmarkets.com/research/f4vpw3/highdensity ] report to their offering. <start_newscom> (Logo: http://photos.prnewswire.com/prnh/20130307/600769 ) High-density packaging offer a host of benefits...

2014-04-10 23:21:51

Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that it has achieved the stringent AEC-Q100 Grade 0 Automotive requirement for Elmos Semiconductor AG using Copper Wire in wide body leaded package. Ipoh, Malaysia (PRWEB) April 10, 2014 Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that it has achieved the stringent AEC-Q100 Grade 0 Automotive requirement for...

2014-04-04 12:31:11

DALLAS, April 4, 2014 /PRNewswire/ -- The report defines and segments the "Semiconductor & IC Packaging Materials Market by Types (Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, and so on), Packaging Technologies (SOP, GA, QFN, DFN, and others), and Geography - Regional Trends & Forecast to 2019", with an analysis and forecast of revenues of types such as organic substrates, bonding wires, leadframes, encapsulation resins, and so on) individually....

2014-01-23 23:20:29

GIA announces the release of a trend report on Flip-Chip. Market for Flip-Chip is projected to witness strong growth driven by growing demand for high speed, and high performance IC packaging solutions. San Jose, California (PRWEB) January 23, 2014 Follow us on LinkedIn – Flip-chip is one of the key packaging techniques for microelectronic circuits. The technique is finding rapid adoption in consumer and high-end applications. The adoption of flip-chip technique is primarily fueled by...

2013-09-24 16:28:36

Enhanced User Control for Automated Microelectronics Production CARLSBAD, Calif., Sept. 24, 2013 /PRNewswire-iReach/ -- Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced new product demos at IMAPS 2013. The 8000i Wire Bonder with Intelligent Interactive Graphical Interface(TM) (i(2)Gi(TM)) will be showcased through live demonstrations in booth #511 on October 1-2 at the Rosen Centre Hotel in Orlando,...

2013-09-17 23:27:23

The packaging company plans to surprise with innovative designs and groundbreaking new manufacturing technology. Chicago, IL (PRWEB) September 17, 2013 Each year, Pack Expo brings together some of the most innovative minds and largest manufacturers in the packaging industry for three days of exhibits, product launches and demonstrations. At this year's expo in Las Vegas, September 23-25, international packaging company Plastic Ingenuity plans to debut not only a new clamshell...

2013-07-29 23:20:40

The international packaging manufacturer hopes to make stock packaging safer and more consumer-friendly. Cross Plains, WI (PRWEB) July 29, 2013 Packaging manufacturer Plastic Ingenuity may be most famous for its custom packaging solutions for products like electronics and cosmetics, but the company recently debuted a new line of clear stock packaging that it thinks will redefine consumer expectations. PI has now launched its line of stock plastic food packaging, designed in response to...

New Plastic Electronics Can Greatly Reduce Food Waste Worldwide
2013-02-27 14:22:17

Eindhoven University of Technology Millions of tons of food are thrown away each year because the 'best before' date has passed. But this date is always a cautious estimate, which means a lot of still-edible food is thrown away. Wouldn't it be handy if the packaging could 'test' whether the contents are still safe to eat? Researchers at Eindhoven University of Technology, Universitá di Catania, CEA-Liten and STMicroelectronics have invented a circuit that makes this possible:...

2012-07-05 18:20:23

BILLERICA, Mass., July 5, 2012 /PRNewswire/ -- TEL NEXX, Inc., a wholly owned subsidiary of Tokyo Electron U.S. Holdings, is pleased to announce a new multi-year joint development program in 3D semiconductor packaging with IBM. TEL NEXX has collaborated with IBM R&D for many years (as NEXX Systems) to develop new concepts for interposers, lead-free bumping, microbumps, and other cutting-edge interconnect solutions. Now denser packaging and more energy conscious requirements are pushing...