Latest Integrated circuit Stories

In a paper published this week in Science, a Manchester team lead by Nobel laureates Professor Andre Geim and Professor Konstantin Novoselov has literally opened a third dimension in graphene research. Their research shows a transistor that may prove the missing link for graphene to become the next silicon. Graphene – one atomic plane of carbon – is a remarkable material with endless unique properties, from electronic to chemical and from optical to mechanical. One of many potential...

NEW YORK, Jan. 17, 2012 /PRNewswire/ -- Mitsubishi Heavy Industries, Ltd. (MHI), which fully owns Mitsubishi Heavy Industries America, Inc. (MHIA), has developed the world's first fully automated 300 millimeters (12-inch ) wafer bonding machine, dubbed the "Bond Meister MWB-12-ST," capable of producing 3-dimensionally integrated LSI (large-scale integration) circuits at room temperature. MHI delivered the first unit to the National Institute of Advanced Industrial Science and...

Silicon links shrink to atomic scale     The narrowest conducting wires in silicon ever produced are shown to have the same electrical current carrying capability as copper, as published in Science.     This means electrical interconnects in silicon can be shrunk to the atomic-scale without losing their functionality – Ohm's law holds true at the atomic-scale.     UNSW researchers will use these wires to address individual atoms – a key step in realizing a scalable quantum...

LOS ANGELES, Dec. 16, 2011 /PRNewswire/ -- The e-scrap reuse and recycling market was a nearly $6.8 billion market in 2010, and has been growing even larger in 2011. Cash for Electronic Scrap USA, a subsidiary of CJ Environmental, has experienced massive growth in buying bulk computer processors, computer chips, semiconductors, gold finger scrap, gold plated circuit board scrap, populated circuit boards, SIM scrap, smart card scrap, mixed scrap integrated circuits (IC chips), and...

PITTSBURGH, Dec. 7, 2011 /PRNewswire/ -- ANSYS (NASDAQ: ANSS) announced that Totem(TM) software -- from its subsidiary Apache Design, Inc. -- has been deployed by Fujitsu Semiconductor Limited to analyze and optimize all their custom integrated circuit (IC) designs. This includes analog, memory, high-speed I/O, PMIC (power management IC) and RF ICs that are used in wide variety of consumer, mobile and communications electronic products. As custom IC designs increase in complexity,...

Surpassing the physical limits of silicon After having revealed the electronic advantages of molybdenite, EPFL researchers have now taken the next definitive step. The Laboratory of Nanoscale Electronics and Structures (LANES) has made a chip, or integrated circuit, confirming that molybdenite can surpass the physical limits of silicon in terms of miniaturization, electricity consumption, and mechanical flexibility. "We have built an initial prototype, putting from two to six serial...

Berkeley Researchers Say Co-design May Be the Answer to Modeling Clouds and Other Big Problems As sophisticated as modern climate models are, one critical component continues to elude their precision—clouds. Simulating these fluffy puffs of water vapor is so computationally complex that even today’s most powerful supercomputers, working at quadrillions of calculations per second, cannot accurately model them. “Clouds modulate the climate. They reflect some sunlight back into...

ROSKILDE, Denmark, Nov. 28, 2011 /PRNewswire-iReach/ -- IPtronics, an industry innovator and leading provider of high speed integrated circuits for parallel optical interconnects, announced today the appointment of Dr. Martin Rofheart as its Chairman of the Board. Dr. Rofheart brings significant industry experience and leadership to help guide the board as the company continues to experience increased demand for its parallel optics semiconductor solutions. (Photo: <font...

Rensselaer Polytechnic Institute researchers use supercomputer to study effects of stacking graphene nanoribbons Copper's days are numbered, and a new study at Rensselaer Polytechnic Institute could hasten the downfall of the ubiquitous metal in smart phones, tablet computers, and nearly all electronics. This is good news for technophiles who are seeking smaller, faster devices. As new generations of computer chips continue to shrink in size, so do the copper pathways that transport...

ALISO VIEJO, Calif., Oct. 6, 2011 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today introduced the industry's smallest hermetic surface mount package for power transistors and diodes. Microsemi pioneered the development of the new industry-standard U4 package, which has achieved Defense Logistics Agency (DLA) qualification for a range of products. The devices assembled as...