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Latest Integrated circuit Stories

IBM 'Thinks' Big, Invests $3 Billion In Chip Research And Develoment
2014-07-10 12:28:19

Peter Suciu for redOrbit.com - Your Universe Online IBM has been around for more than a 100 years and it has redefined its business many times to meet changing demand for its products. While the company also known as Big Blue touted its motto "Think" as it lead the desktop PC in the late 1970s and throughout the 1980s the company now finds itself at a crossroads. On Wednesday, a week before its second quarterly earnings will be released, IBM announced it is spending $3 billion over the...

2014-07-03 04:22:30

ESPOO, Finland, July 3, 2014 /PRNewswire/ -- Picosun Oy, the leading manufacturer of high quality Atomic Layer Deposition (ALD) equipment for global industries, presents a range of novel metallization processes for electronics industry. (Logo: http://photos.prnewswire.com/prnh/20140528/689557 ) The trend towards more and more compact and miniaturized electronics has forced the manufacturers to invent new methods for packing, stacking, and connecting the...

2014-07-02 12:25:44

DALLAS, July 2, 2014 /PRNewswire/ -- According to a new market research report "Heterogeneous Mobile Processing and Computing Market by Component (processor, GPU, DSP, connectivity), Technology Node (45nm-5nm), Application (Consumer, Tele-communication, Automotive, MDA, Medical), and Geography - Forecast and Analysis to 2014-2020", published by MarketsandMarkets, the total Heterogeneous Mobile Processing & Computing Market is expected to reach $61.70 Billion by 2020,...

2014-06-22 23:03:07

Over the five years to 2019, the Semiconductor and Circuit Manufacturing industry is expected to recover slowly from the recession due to the continued demand for new semiconductor technology used in increasingly complex computer systems; nonetheless, increased offshoring of US industry companies is expected to further restrain revenue growth. For these reasons, industry research firm IBISWorld has updated a report on the Semiconductor and Circuit Manufactuing industry in its growing...

2014-06-19 09:51:28

USC Viterbi When it comes to electronics, silicon will now have to share the spotlight. In a paper recently published in Nature Communications, researchers from the USC Viterbi School of Engineering describe how they have overcome a major issue in carbon nanotube technology by developing a flexible, energy-efficient hybrid circuit combining carbon nanotube thin film transistors with other thin film transistors. This hybrid could take the place of silicon as the traditional transistor...

2014-06-13 08:26:01

NEW TAIPEI CITY, June 13, 2014 /PRNewswire/ -- Kingyoup Optronics Co., Ltd. ("Kingyoup") during the IEEE Electronics Components and Technology Conference (ECTC) held at Orlando, Florida USA, in May 2014 show-cased their temporary bonding and debonding equipment developed in collaboration with IBM (NYSE:IBM). This equipment is specially designed to meet the microelectronics miniaturization needs of today's smart, mobile, consumer electronics devices. Specifically, it enables 3D...

2014-06-12 23:05:24

The total System in Package (SiP) market is estimated to reach $18.10 billion by 2020 at a higher single digit CAGR from 2013 to 2020. (http://www.marketsandmarkets.com/Market-Reports/System-In-Package-SIP-Market-Chip-Stack-Multi-Chip-Module-MCM-Market-625.html) (PRWEB) June 12, 2014 According to a new market research report "System in Package (SiP) Market by Technology (2D, 2.5D & 3D), Type (BGA, SMT, QFP, SOP), Interconnection Technology (Flip-Chip & Wire-bond),...

2014-06-09 08:36:32

PHOENIX, June 9, 2014 /PRNewswire/ -- FlipChip International - (FCI), the global technology leader in flip chip bumping and wafer level packaging, announced that their CTO, Ted Tessier, will be presenting a collaborative paper with Fujikura Limited entitled "Enabling Wearable Electronics: Innovation Through Miniaturization" at the TechSearch International Packaging and Assembly Considerations in Wearable Electronics Workshop to be held in Austin, Texas on June 11(th) and 12(th),...

2014-06-01 23:00:47

System in Package market research report categorizes the “System in Package Market” on the basis of different packaging technology, packaging type, interconnection technology, applications, and geographical analysis, forecasting revenue, and analyzing trends in the market. (http://www.marketsandmarkets.com/Market-Reports/System-In-Package-SIP-Market-Chip-Stack-Multi-Chip-Module-MCM-Market-625.html) (PRWEB) June 01, 2014 According to a new market research report "System in Package...

2014-05-21 23:11:15

System in Package (SiP) Market research report categorizes global market on the basis of different packaging technology, packaging type, interconnection technology, applications, and geographical analysis, forecasting revenue, and analyzing trends in the market. (http://www.marketsandmarkets.com/Market-Reports/System-In-Package-SIP-Market-Chip-Stack-Multi-Chip-Module-MCM-Market-625.html) (PRWEB) May 21, 2014 According to a new market research report "System in Package (SiP) Market by...


Latest Integrated circuit Reference Libraries

24_4ef309736f760441603afe03433e193d
2010-09-02 16:42:23

A chip, also known as an integrated circuit, is a miniaturized electronic circuit consisting mainly of semiconductor devices and passive components, that has been manufactured in the surface of a thin substrate of semiconductor material. There are many different types of chips: microcircuit, microchip, silicon chip, etc. Integrated circuits are regularly used in present-day electronic equipment and have modernized the world of electronics. Computers, cellular phones, and other electronic...

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