Quantcast

Latest Integrated circuit Stories

2014-06-13 08:26:01

NEW TAIPEI CITY, June 13, 2014 /PRNewswire/ -- Kingyoup Optronics Co., Ltd. ("Kingyoup") during the IEEE Electronics Components and Technology Conference (ECTC) held at Orlando, Florida USA, in May 2014 show-cased their temporary bonding and debonding equipment developed in collaboration with IBM (NYSE:IBM). This equipment is specially designed to meet the microelectronics miniaturization needs of today's smart, mobile, consumer electronics devices. Specifically, it enables 3D...

2014-06-12 23:05:24

The total System in Package (SiP) market is estimated to reach $18.10 billion by 2020 at a higher single digit CAGR from 2013 to 2020. (http://www.marketsandmarkets.com/Market-Reports/System-In-Package-SIP-Market-Chip-Stack-Multi-Chip-Module-MCM-Market-625.html) (PRWEB) June 12, 2014 According to a new market research report "System in Package (SiP) Market by Technology (2D, 2.5D & 3D), Type (BGA, SMT, QFP, SOP), Interconnection Technology (Flip-Chip & Wire-bond),...

2014-06-09 08:36:32

PHOENIX, June 9, 2014 /PRNewswire/ -- FlipChip International - (FCI), the global technology leader in flip chip bumping and wafer level packaging, announced that their CTO, Ted Tessier, will be presenting a collaborative paper with Fujikura Limited entitled "Enabling Wearable Electronics: Innovation Through Miniaturization" at the TechSearch International Packaging and Assembly Considerations in Wearable Electronics Workshop to be held in Austin, Texas on June 11(th) and 12(th),...

2014-06-01 23:00:47

System in Package market research report categorizes the “System in Package Market” on the basis of different packaging technology, packaging type, interconnection technology, applications, and geographical analysis, forecasting revenue, and analyzing trends in the market. (http://www.marketsandmarkets.com/Market-Reports/System-In-Package-SIP-Market-Chip-Stack-Multi-Chip-Module-MCM-Market-625.html) (PRWEB) June 01, 2014 According to a new market research report "System in Package...

2014-05-21 23:11:15

System in Package (SiP) Market research report categorizes global market on the basis of different packaging technology, packaging type, interconnection technology, applications, and geographical analysis, forecasting revenue, and analyzing trends in the market. (http://www.marketsandmarkets.com/Market-Reports/System-In-Package-SIP-Market-Chip-Stack-Multi-Chip-Module-MCM-Market-625.html) (PRWEB) May 21, 2014 According to a new market research report "System in Package (SiP) Market by...

2014-05-09 12:26:17

DUBLIN, May 9, 2014 /PRNewswire/ -- Research and Markets (http://www.researchandmarkets.com/research/39n9p4/photonic) has announced the addition of the "Photonic Integrated Circuit (IC) Market - Global Industry Analysis, Size, Share, Growth, Trends and Forecast, 2013 - 2019" report to their offering. http://photos.prnewswire.com/prnh/20130307/600769 Photonic Integrated Circuit (PIC) is a new technology similar to an electronic IC which integrates multiple photonic functions into one optical...

2014-05-06 16:38:10

MILPITAS, Calif., May 6, 2014 /PRNewswire/ -- Integrated Silicon Solution, Inc. (Nasdaq: ISSI), a leader in advanced memory and analog IC solutions, today announced that the Company will present at the 15(th) Annual B. Riley & Co. Investor Conference to be held at the Loews Santa Monica Beach Hotel in Santa Monica, CA. Scott D. Howarth, President and CEO, and John M. Cobb, Vice President and CFO, will present at 10:00 a.m. Pacific Time on Tuesday, May 20, 2014 and will be...

2014-05-05 23:09:23

Semiconductors Markets in China research report for TTL, HTL and CMOS Integrated Circuit, Hybrid circuit, Bipolar memory, Transistors, Diodes and rectifiers and Semiconductor devices analyzed. Dallas, Texas (PRWEB) May 05, 2014 China's demand for semiconductors has grown at a fast pace in the past decade. In the next five years, both production and demand will continue to grow. This new study examines China's economic trends, investment environment, industry development, supply...

2014-04-30 16:35:25

DALLAS, May 1, 2014 /PRNewswire/ -- According to a new market research report "System in Package (SiP) Market by Technology (2D, 2.5D & 3D), Type (BGA, SMT, QFP, SOP), Interconnection Technology (Flip-Chip & Wire-bond), Applications (Communications, Consumer, Automotive, Medical) and Geography (N. America, Europe, APAC & ROW) - Global Trends & Forecasts to - 2014 - 2020", published by MarketsandMarkets, the total System in Package (SiP) market is expected to...

2014-04-30 16:34:44

DUBLIN, April 30, 2014 /PRNewswire/ -- Research and Markets (http://www.researchandmarkets.com/research/fhhfv8/the) have announced the addition of the "The Multi-Component IC Packaging Market 2014 Edition" [http://www.researchandmarkets.com/research/fhhfv8/the ] report to their offering. (Logo: http://photos.prnewswire.com/prnh/20130307/600769 ) Complex multi-component packages have added a new dimension to high speed and small form factor, and have been game...


Latest Integrated circuit Reference Libraries

24_4ef309736f760441603afe03433e193d
2010-09-02 16:42:23

A chip, also known as an integrated circuit, is a miniaturized electronic circuit consisting mainly of semiconductor devices and passive components, that has been manufactured in the surface of a thin substrate of semiconductor material. There are many different types of chips: microcircuit, microchip, silicon chip, etc. Integrated circuits are regularly used in present-day electronic equipment and have modernized the world of electronics. Computers, cellular phones, and other electronic...

More Articles (1 articles) »
Word of the Day
lunula
  • A small crescent-shaped structure or marking, especially the white area at the base of a fingernail that resembles a half-moon.
This word is a diminutive of the Latin 'luna,' moon.
Related