Quantcast

Latest Integrated circuits Stories

2014-10-22 12:21:15

Cadence Incisive platform enhanced with new fault injection verification management for functional safety compliance SAN JOSE, Calif., Oct. 22, 2014 /PRNewswire/ -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global design innovation, today introduced its new automotive functional safety verification solution, which reduces the effort required by automotive designers to prepare for ISO 26262 compliance by up to 50 percent. An expansion to the Cadence(®)...

2014-10-21 08:44:43

28-nm Runset Availability Enables Signoff Physical Verification for Mutual Customers MOUNTAIN VIEW, Calif., Oct. 21, 2014 /PRNewswire/ -- Highlights: -- Fully qualified 28-nm signoff physical verification runsets are available from SMIC for DRC, LVS and metal fill -- Certified runsets enable SMIC and Synopsys' mutual customers to leverage IC Validator In-Design physical verification and transistor-level parasitic extraction with StarRC -- Ongoing...

2014-10-21 08:43:08

New Multi-Memory Bus Processor Cuts Test Logic in Half While Maintaining High Performance for Networking SoC MOUNTAIN VIEW, Calif., Oct. 21, 2014 /PRNewswire/ -- Highlights: -- Marvell achieved silicon success for networking SoC using the multi-memory bus (MMB) processor in the Synopsys DesignWare STAR Memory System for embedded test and repair -- Reduced area and power with a single MMB processor providing common test and repair logic for all memory...

2014-10-21 08:42:09

DUBLIN, Oct. 21, 2014 /PRNewswire/ -- Research and Markets has announced the addition of the "Global 3D IC Market 2014-2018" report to their offering. http://photos.prnewswire.com/prnvar/20130307/600769 A 3D IC is an IC with multiple layers (more than two) of active electronic components which are integrated into a single circuit. These layers are integrated both vertically and horizontally. 3D ICs are the perfect solution for meeting the growing demand to minimize the size and reduce the...

2014-10-21 08:41:19

Partnership Supports Delivery of Sonics NoCs in Broadest Range of Customer Tool Environments MILPITAS, Calif., Oct. 21, 2014 /PRNewswire/ -- Sonics, Inc., the world's foremost supplier of on-chip network (NoC) technologies and services, and Magillem, the leading provider of front-end design Extensible Markup Language (XML) solutions that reduce the global cost of complex, system-on-chip (SoC) and field programmable gate array (FPGA) platforms, today announced their partnership on SoC...

2014-10-20 12:35:05

Cadence Digital Solution Enabled GUC to Improve System Performance by 2X and Deliver 180 Million Gate SoC Design SAN JOSE, Calif., Oct. 20, 2014 /PRNewswire/ -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, and Global Unichip Corporation (GUC), the Flexible ASIC Leader(TM), today announced that GUC used the Cadence® Encounter® Digital Implementation System to tape out its first production high performance computation ASIC design on TSMC's 16nm...

2014-10-20 08:40:21

DesignWare STAR Memory System for Embedded Flash Reduces Test Cost by 20 Percent and Enables In-Field Diagnostics for IoT and Automotive SoCs MOUNTAIN VIEW, Calif., Oct. 20, 2014 /PRNewswire/ -- Highlights: -- Extends the award-winning DesignWare STAR Memory System to support embedded flash memories -- Provides comprehensive test coverage and in-field diagnostics of the failure mechanisms associated with embedded flash memories -- Eliminates the need for...

2014-10-20 08:39:09

Standardizes on DFTMAX Ultra for Designs with Few Test Pins MOUNTAIN VIEW, Calif., Oct. 20, 2014 /PRNewswire/ -- Highlights: -- DFTMAX(TM) Ultra compression technology deliver 11X higher compression and reduced test time -- Higher test quality with shorter test time drove VIA's standardization on DFTMAX Ultra for pin-limited designs -- Deployment of DFTMAX Ultra, built into Synopsys' Design Compiler(®) RTL Synthesis solution, was done within a week...

2014-10-15 16:25:59

LONDON, Oct. 15, 2014 /PRNewswire/ -- REPORT HIGHLIGHTSGlobal sales for System-in-Package (SiP)-based chipsets totaled nearly $15 billion in 2012. This market is expected to grow at a compound annual growth rate (CAGR) of 6.7% from nearly $16.3 billion forecast for 2013 to $22.5 billion forecast for 2018. This report provides:An overview of the global market for System-in-Package (SiP) chipsets.Analyses of global market trends, with data from 2012, estimates for 2013, and projections...

2014-10-14 08:41:11

MOUNTAIN VIEW, Calif., Oct. 14, 2014 /PRNewswire/ -- Highlights: -- Verdi, the industry's open debug platform, now provides innovative planning and coverage technology integrated across all debug views, which allows users to quickly analyze and cross-probe holes identified through coverage analysis -- Provides the ability to quickly generate verification plans and link them to specification and requirements documents to ensure that projects...


Latest Integrated circuits Reference Libraries

24_4ef309736f760441603afe03433e193d
2010-09-02 16:42:23

A chip, also known as an integrated circuit, is a miniaturized electronic circuit consisting mainly of semiconductor devices and passive components, that has been manufactured in the surface of a thin substrate of semiconductor material. There are many different types of chips: microcircuit, microchip, silicon chip, etc. Integrated circuits are regularly used in present-day electronic equipment and have modernized the world of electronics. Computers, cellular phones, and other electronic...

More Articles (1 articles) »
Word of the Day
negawatt
  • A unit of saved energy.
Coined by Amory Lovins, chairman of the Rocky Mountain Institute as a contraction of negative watt on the model of similar compounds like megawatt.