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Latest Integrated circuits Stories

2014-10-20 12:35:05

Cadence Digital Solution Enabled GUC to Improve System Performance by 2X and Deliver 180 Million Gate SoC Design SAN JOSE, Calif., Oct. 20, 2014 /PRNewswire/ -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, and Global Unichip Corporation (GUC), the Flexible ASIC Leader(TM), today announced that GUC used the Cadence® Encounter® Digital Implementation System to tape out its first production high performance computation ASIC design on TSMC's 16nm...

2014-10-20 08:40:21

DesignWare STAR Memory System for Embedded Flash Reduces Test Cost by 20 Percent and Enables In-Field Diagnostics for IoT and Automotive SoCs MOUNTAIN VIEW, Calif., Oct. 20, 2014 /PRNewswire/ -- Highlights: -- Extends the award-winning DesignWare STAR Memory System to support embedded flash memories -- Provides comprehensive test coverage and in-field diagnostics of the failure mechanisms associated with embedded flash memories -- Eliminates the need for...

2014-10-20 08:39:09

Standardizes on DFTMAX Ultra for Designs with Few Test Pins MOUNTAIN VIEW, Calif., Oct. 20, 2014 /PRNewswire/ -- Highlights: -- DFTMAX(TM) Ultra compression technology deliver 11X higher compression and reduced test time -- Higher test quality with shorter test time drove VIA's standardization on DFTMAX Ultra for pin-limited designs -- Deployment of DFTMAX Ultra, built into Synopsys' Design Compiler(®) RTL Synthesis solution, was done within a week...

2014-10-15 16:25:59

LONDON, Oct. 15, 2014 /PRNewswire/ -- REPORT HIGHLIGHTSGlobal sales for System-in-Package (SiP)-based chipsets totaled nearly $15 billion in 2012. This market is expected to grow at a compound annual growth rate (CAGR) of 6.7% from nearly $16.3 billion forecast for 2013 to $22.5 billion forecast for 2018. This report provides:An overview of the global market for System-in-Package (SiP) chipsets.Analyses of global market trends, with data from 2012, estimates for 2013, and projections...

2014-10-14 08:41:11

MOUNTAIN VIEW, Calif., Oct. 14, 2014 /PRNewswire/ -- Highlights: -- Verdi, the industry's open debug platform, now provides innovative planning and coverage technology integrated across all debug views, which allows users to quickly analyze and cross-probe holes identified through coverage analysis -- Provides the ability to quickly generate verification plans and link them to specification and requirements documents to ensure that projects...

2014-10-13 08:32:06

MOUNTAIN VIEW, Calif., Oct. 13, 2014 /PRNewswire/ -- Synopsys, Inc. (Nasdaq:SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, will showcase advances in its comprehensive synthesis-based test solution during the International Test Conference (ITC) 2014 in Seattle Washington. Kick off the conference by joining Synopsys at its annual Test Special Interest Group (SIG) event, hear a plenary keynote speech from Synopsys...

2014-10-07 08:40:21

From True DC to X-band, Peregrine's UltraCMOS® Technology Enables the Intelligent Integration of RF, Digital and Analog Components Onto a Single Die SAN DIEGO and ROME, Oct. 7, 2014 /PRNewswire/ -- EUROPEAN MICROWAVE WEEK -- Peregrine Semiconductor Corp. (NASDAQ: PSMI), founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, announces the expansion of its integrated product portfolio into DC and X-band frequencies. Today, Peregrine introduces two new integrated...

2014-10-06 08:32:57

CHANDLER, Ariz., Oct. 6, 2014 /PRNewswire/ -- Cactus Semiconductor(TM) has updated its microprocessor evaluation board for its application-specific standard product (ASSP) medical chip to provide new microcontroller unit (MCU) packaging for easier manufacturability, new inductors for a lower profile, and more. The EB1CSI021(TM) evaluation board is ideal for electronics engineers seeking to develop battery-powered neurostimulation medical applications. The MCU for the EB1CSI021 now...

2014-10-03 23:07:21

Cloud-based semiconductor infrastructure enables SUTD and NTU collaboration SIngapore (PRWEB) October 03, 2014 Silicon Cloud International (SCI), a provider of secure and private cloud computing infrastructure, announced today successful pilot program launch of its semiconductor workflow platform in Singapore. The pilot program included trials by the Singapore University of Technology and Design (SUTD) and Nanyang Technological University (NTU) on a collaborative design with remotely...

2014-10-02 12:35:30

FELDKIRCHEN, Germany, Oct. 2, 2014 /PRNewswire/ -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global design innovation, today announced it plans to exhibit its advanced verification technologies and methodologies at the first Design and Verification Conference (DVCon) Europe in Munich, Germany. The conference is focused on the application of Electronic Design Automation (EDA) standards, languages and methodologies for the design and verification of electronic systems...


Latest Integrated circuits Reference Libraries

24_4ef309736f760441603afe03433e193d
2010-09-02 16:42:23

A chip, also known as an integrated circuit, is a miniaturized electronic circuit consisting mainly of semiconductor devices and passive components, that has been manufactured in the surface of a thin substrate of semiconductor material. There are many different types of chips: microcircuit, microchip, silicon chip, etc. Integrated circuits are regularly used in present-day electronic equipment and have modernized the world of electronics. Computers, cellular phones, and other electronic...

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Word of the Day
reremouse
  • A bat.
The word 'reremouse' comes from Middle English reremous, from Old English hrēremūs, hrērmūs ("bat"), equivalent to rear (“to move, shake, stir”) +‎ mouse.
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