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Latest Integrated circuits Stories

2014-09-01 12:22:14

LONDON, Sept. 1, 2014 /PRNewswire/ -- Reportbuyer.com has added a new market research report: Flip-Chip Technologies and Global Markets https://www.reportbuyer.com/product/1941933/Flip-Chip-Technologies-and-Global-Markets.html INTRODUCTIONFlip chip technology has enabled electronics technology to reach new levels of performance, while fueling the growth of global markets for semiconductors, electronic devices and a host of industrial and consumer products.This market research...

2014-08-30 23:01:31

System in Package market research report describes the value chain for SiP market by considering all the major stakeholders in the market and their role analysis & provides a detailed scrutiny of Porter’s five force analysis for the market. (http://www.marketsandmarkets.com/Market-Reports/System-In-Package-SIP-Market-Chip-Stack-Multi-Chip-Module-MCM-Market-625.html) (PRWEB) August 30, 2014 According to a new market research report "System in Package (SiP) Market by Technology...

2014-08-18 16:25:06

LONDON, Aug. 18, 2014 /PRNewswire/ -- Reportbuyer.com has added a new market research report:The GaAs IC Markethttps://www.reportbuyer.com/product/2244714/The-GaAs-IC-Market.htmlThe biggest enabler of the mobile data increase and the most important driver of the GaAs RF IC market is the handset segment. Much of the content of a handset is silicon-based, but power amplifiers (PAs) and switches in the front-end of the phone use GaAs devices. This report investigates the technology...

2014-08-11 08:33:27

SEOUL, South Korea and CUPERTINO, Calif., Aug. 11, 2014 /PRNewswire/ -- MagnaChip Semiconductor Corporation ("MagnaChip") (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that it has signed a joint development agreement with Yield Microelectronics Corporation (YMC) to develop a family of embedded 0.18um standard Multiple Time Programmable (MTP) IP solutions. The MTP-IP joint development agreement covers a variety...

2014-08-05 12:36:06

DUBLIN, Aug. 5, 2014 /PRNewswire/ -- Research and Markets has announced the addition of the "3DIC & 2.5D TSV Interconnect for Advanced Packaging - 2014 Business Update" report to their offering. http://photos.prnewswire.com/prnh/20130307/600769 Through Silicon Vias (TSV) technology was adopted in production a few years ago for MEMS and CMOS Image Sensors (CIS). Driven by consumer applications such as smartphones and tablets, this market is expected to continue to grow over the next...

2014-08-04 23:04:15

Market research report analyzes the Microcontroller, DPS, and IP core chip’s individual value chain, giving a bird’s eye-view of all the major and allied segments to the industry. http://www.marketsandmarkets.com/Market-Reports/microcontrollers-market-108837146.html (PRWEB) August 04, 2014 According to a new market research report "Microcontrollers, DSP, & IP-Core Chip Market by Type, Application (Automotive & Transportation, Consumer Electronics, Industrial,...

2014-08-04 23:01:07

IC Design and Embedded Software Company Grows San Jose Team San Diego, CA (PRWEB) August 04, 2014 Today, Encore Semi announced the recent addition of William Ruby as vice president for sales and technology solutions. Ruby has more than 20 years of experience in the semiconductor and electronic design automation (EDA) industry, most recently as senior director at Apache Design where he successfully led worldwide customer engagements for low power EDA technology. His career includes...

2014-08-04 20:23:40

Highlights: SAN JOSE, Calif., Aug. 4, 2014 /PRNewswire/ -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today introduced Cadence® Voltus(TM)-Fi Custom Power Integrity Solution, a transistor-level electromigration and IR-drop (EMIR) solution that delivers foundry-certified SPICE-level accuracy in power signoff to create the fastest path to design closure. The new solution is enabled by Cadence Spectre® Accelerated Parallel Simulator signoff...

2014-08-04 04:22:17

SHANGHAI, Aug. 4, 2014 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) and CEC Huada Electronic Design Co., Ltd. ("HED") jointly announced today that HED has launched China's first 55nm smart card chip based on SMIC's 55nm LL (low leakage) eFlash (embedded flash) platform. With the benefits of being smaller in size, lower power consumption and faster performance, it has been put into mass production and is being widely recognized by...

2014-07-28 08:35:08

ReportsnReports.com offers "Microcontrollers, DSP, & IP Core Chip Market by Type, Applications (Automotive & Transportation, Consumer Electronics, Industrial, Communications, Security, and Medical & Healthcare) and Geography (Americas, Europe, APAC & ROW) - Analysis & Forecast to 2014 - 2020" global research report in its store. DALLAS, July 28, 2014 /PRNewswire-iReach/ -- A microcontroller contains a processor core, memory, and programmable input/output peripherals, which means...


Latest Integrated circuits Reference Libraries

24_4ef309736f760441603afe03433e193d
2010-09-02 16:42:23

A chip, also known as an integrated circuit, is a miniaturized electronic circuit consisting mainly of semiconductor devices and passive components, that has been manufactured in the surface of a thin substrate of semiconductor material. There are many different types of chips: microcircuit, microchip, silicon chip, etc. Integrated circuits are regularly used in present-day electronic equipment and have modernized the world of electronics. Computers, cellular phones, and other electronic...

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