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Last updated on April 15, 2014 at 21:23 EDT

Latest Integrated circuits Stories

2014-04-15 12:34:10

Full certification enables customers to tape out 16nm FinFET designs using Cadence tools SAN JOSE, Calif., April 15, 2014 /PRNewswire/ -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced its digital, custom and signoff tools have received V1.0 Design Rule Manual (DRM) and SPICE certification for TSMC's 16nm FinFET process, enabling joint customers to begin taping out FinFET-based designs using Cadence® tools. Cadence's...

2014-04-12 12:20:12

ChinaMarketResearchReports.com adds Latest Report on "Research Report on China Integrated Circuit (IC) Industry, 2014-2018" to its store. DALLAS, April 12, 2014 /PRNewswire-iReach/ -- The growth rate of China integrated circuit industry ranks the first in the world after China joined WTO. The average annual growth rate of the production volume and sales revenue of integrated circuits exceeded 20% in 20012012. The proportion of domestic industry scale in the global industry scale increased...

2014-04-11 23:25:22

ChinaMarketResearchReports.com adds Latest Report on “Global and China Display Driver & Touch IC Industry Report, 2013-2014” to its store. Inquire before buying this report at http://www.chinamarketresearchreports.com/contacts/inquire-before-buy.php?name=114781 Dallas, TX (PRWEB) April 11, 2014 Global and China Display Driver & Touch IC Industry Report, 2013-2014 involves the followings:     Introduction to Display Driver IC and Touch IC...

2014-04-11 08:26:05

DUBLIN, April 11, 2014 /PRNewswire/ -- Research and Markets ( http://www.researchandmarkets.com/research/f5zjtc/the_gaas_ic_market) has announced the addition of the "The GaAs IC Market" [http://www.researchandmarkets.com/research/f5zjtc/the_gaas_ic_market ] report to their offering. <start_newscom> (Logo: http://photos.prnewswire.com/prnh/20130307/600769 ) The biggest enabler of the mobile data increase and the most important driver of the GaAs RF IC market...

2014-04-11 08:25:34

DUBLIN, April 11, 2014 /PRNewswire/ -- Research and Markets ( http://www.researchandmarkets.com/research/f4vpw3/highdensity) has announced the addition of the "High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends" [http://www.researchandmarkets.com/research/f4vpw3/highdensity ] report to their offering. <start_newscom> (Logo: http://photos.prnewswire.com/prnh/20130307/600769 ) High-density packaging offer a host of benefits...

2014-04-07 23:00:31

Semiconductor IP market research report market analyzes the semiconductor IP industry’s value chain, giving a bird’s eye-view of all the major and allied industry segments to the semiconductor IP industry. (http://www.marketsandmarkets.com/Market-Reports/semiconductor-silicon-intellectual-property-ip-market-651.html) (PRWEB) April 08, 2014 According to a new market research report of "Semiconductor (Silicon) IP Market by Form Factor (Integrated Circuit IP, SOC IP), Design...

2014-04-03 16:25:31

Hard programming option enables cost saving for high volume production FREMONT, Calif., April 3, 2014 /PRNewswire/ -- Exar Corporation (NYSE: EXAR), a leading supplier of high performance analog mixed-signal components and data management solutions, today introduced the XRP7720 quad-output, synchronous step-down, universal PMIC, which has the ability to be programmed to meet the needs of nearly all systems. In development, an I(2)C interface allows Exar's PowerArchitect(TM) design...

2014-03-24 08:34:45

Industry Leaders Collaborate with Synopsys to Bring New Technology into Production Use MOUNTAIN VIEW, Calif., March 24, 2014 /PRNewswire/ -- Highlights: -- 10X faster design planning, 5X faster implementation, 2X larger capacity - all lead to 10X faster throughput -- Built on completely new scalable infrastructure, timer and analytical optimization engines -- Already contributing to production tapeouts at established and emerging technology nodes...

2014-03-23 23:01:19

3D IC Chip and TSV interconnect market research report categorizes the global market on the basis of the different manufacturing approaches, use of these ICs in different end-products, use of these in various applications and geographical analysis; forecasting revenue and analyzing trends in the market. (http://www.marketsandmarkets.com/Market-Reports/3D-IC-Chip-and-TSV-Interconnect-Market-117.html) (PRWEB) March 23, 2014 According to a new market research report “Three-dimensional...

2014-03-18 08:39:08

Successful Collaboration on Design Planning Automation is a Pivotal Contributor MOUNTAIN VIEW, Calif., March 18, 2014 /PRNewswire/ -- Highlights: -- MediaTek is deploying IC Compiler extensively for hierarchical system on a chip (SoC) design -- Close collaboration on hierarchical design planning technologies and methodology is key to success -- Enabling technologies in IC Compiler include data flow analysis, large design handling, support for multiple...


Latest Integrated circuits Reference Libraries

24_4ef309736f760441603afe03433e193d
2010-09-02 16:42:23

A chip, also known as an integrated circuit, is a miniaturized electronic circuit consisting mainly of semiconductor devices and passive components, that has been manufactured in the surface of a thin substrate of semiconductor material. There are many different types of chips: microcircuit, microchip, silicon chip, etc. Integrated circuits are regularly used in present-day electronic equipment and have modernized the world of electronics. Computers, cellular phones, and other electronic...

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