Latest Integrated circuits Stories
FinFET-ready Silicon-proven Tools and IP Available for Immediate Design of SoCs MOUNTAIN VIEW, Calif., June 2, 2014 /PRNewswire/ -- Highlights:
System in Package market research report categorizes the “System in Package Market” on the basis of different packaging technology, packaging type, interconnection technology, applications,
MOUNTAIN VIEW, Calif., May 29, 2014 /PRNewswire/ -- Synopsys, Inc.
Collaboration enables mutual customers to achieve faster design closure, minimize costs and maximize manufacturing yield PITTSBURGH and NEWPORT BEACH, Calif., May 29, 2014 /PRNewswire/
SANTA CLARA, Calif., May 28, 2014 /PRNewswire/ -- NanGate, Inc.
Silicon Success of DesignWare USB 3.0 femtoPHY, Logic Libraries and Embedded Memories in TSMC 16-nm FinFET Process Verifies Robustness of Both IP and Process MOUNTAIN VIEW, Calif., May 27,
TAIPEI, May 27, 2014 /PRNewswire/ -- Grain Media Technology Inc., the leading provider of surveillance SoC solutions, formally announced today its 4Kx2K IPcam SoC series - GM8139/GM8138/GM8138S.
System in Package (SiP) Market research report categorizes global market on the basis of different packaging technology, packaging type, interconnection technology, applications, and geographical
MarketResearchReports.biz added deep and professional market research reports on "Global And China CMOS Camera Modules Industry Report 2013-2014" analysis and overview. (PRWEB)
LONDON, May 19, 2014 /PRNewswire/ -- Reportbuyer.com has added a new market research report:
A chip, also known as an integrated circuit, is a miniaturized electronic circuit consisting mainly of semiconductor devices and passive components, that has been manufactured in the surface of a thin substrate of semiconductor material. There are many different types of chips: microcircuit, microchip, silicon chip, etc. Integrated circuits are regularly used in present-day electronic equipment and have modernized the world of electronics. Computers, cellular phones, and other electronic...
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