Latest Integrated circuits Stories
Feature Low Drop-out Voltage, Low Output Noise Voltage, Low Inrush Current IRVINE, Calif., June 17, 2014 /PRNewswire/ -- Toshiba
The total System in Package (SiP) market is estimated to reach $18.10 billion by 2020 at a higher single digit CAGR from 2013 to 2020.
DUBLIN, June 10, 2014 /PRNewswire/ -- Research and Markets (http://www.researchandmarkets.com/research/pg7cp6/system_in_package)
SHANGHAI, June 5, 2014 /PRNewswire/ -- Brite Semiconductor (Shanghai) Corporation ("Brite"), a leading IC design and turnkey service provider, and Semiconductor Manufacturing International Corporation
New Formal Verification, Clock Domain Crossing and Low Power Static Checking Products Offer 3X to 5X Performance and Capacity, Ease-of-use and Advanced Debug Needed for Complex SoC Verification MOUNTAIN
FinFET-ready Silicon-proven Tools and IP Available for Immediate Design of SoCs MOUNTAIN VIEW, Calif., June 2, 2014 /PRNewswire/ -- Highlights:
System in Package market research report categorizes the “System in Package Market” on the basis of different packaging technology, packaging type, interconnection technology, applications,
MOUNTAIN VIEW, Calif., May 29, 2014 /PRNewswire/ -- Synopsys, Inc.
Collaboration enables mutual customers to achieve faster design closure, minimize costs and maximize manufacturing yield PITTSBURGH and NEWPORT BEACH, Calif., May 29, 2014 /PRNewswire/
SANTA CLARA, Calif., May 28, 2014 /PRNewswire/ -- NanGate, Inc.
A chip, also known as an integrated circuit, is a miniaturized electronic circuit consisting mainly of semiconductor devices and passive components, that has been manufactured in the surface of a thin substrate of semiconductor material. There are many different types of chips: microcircuit, microchip, silicon chip, etc. Integrated circuits are regularly used in present-day electronic equipment and have modernized the world of electronics. Computers, cellular phones, and other electronic...
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