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Latest Integrated circuits Stories

2014-05-29 08:34:38

Collaboration enables mutual customers to achieve faster design closure, minimize costs and maximize manufacturing yield PITTSBURGH and NEWPORT BEACH, Calif., May 29, 2014 /PRNewswire/ -- ANSYS, Inc. (NASDAQ: ANSS) and TowerJazz (NASDAQ/TASE: TSEM), the global specialty foundry leader, announced today a collaboration to deliver comprehensive power noise and reliability sign-off flow for mutual customers. With increased use of analog and radio frequency (RF) integrated circuits (ICs)...

2014-05-28 08:36:09

SANTA CLARA, Calif., May 28, 2014 /PRNewswire/ -- NanGate, Inc. today announced that the company will co-present with SMIC, at the 51st Design Automation Conference, a highly efficient library development flow used for the creation of SMIC's 28nm standard cell library IPs. The joint presentation will take place on Wednesday June 4th, from 10:30 to 11:00 AM-PDT in the Moscone Center, San Francisco, booth #413. By utilizing NanGate's automated layout development and layout migration...

2014-05-27 08:34:58

Silicon Success of DesignWare USB 3.0 femtoPHY, Logic Libraries and Embedded Memories in TSMC 16-nm FinFET Process Verifies Robustness of Both IP and Process MOUNTAIN VIEW, Calif., May 27, 2014 /PRNewswire/ -- Highlights: -- Validated IP in TSMC 16-nm FinFET process accelerates 16-nm FinFET Plus (16FF+) IP development and reduces SoC integration risk -- Portfolio of IP under development for TSMC 16FF+ process includes DesignWare Interface, Logic Library and Embedded...

2014-05-27 04:22:38

TAIPEI, May 27, 2014 /PRNewswire/ -- Grain Media Technology Inc., the leading provider of surveillance SoC solutions, formally announced today its 4Kx2K IPcam SoC series - GM8139/GM8138/GM8138S. The newly-launched SoC series in UMC 40LP process, applying Grain Media's latest TrueColor(TM)( )ISP engine and Faraday's high-performance serial interface (MIPI/Sub-LVDS/HiSPi) technology, is targeted to the high-resolution 4Kx2K/5M/3M/1080P IPcam. Assembled with the TrueColor(TM) ISP,...

2014-05-21 23:11:15

System in Package (SiP) Market research report categorizes global market on the basis of different packaging technology, packaging type, interconnection technology, applications, and geographical analysis, forecasting revenue, and analyzing trends in the market. (http://www.marketsandmarkets.com/Market-Reports/System-In-Package-SIP-Market-Chip-Stack-Multi-Chip-Module-MCM-Market-625.html) (PRWEB) May 21, 2014 According to a new market research report "System in Package (SiP) Market by...

2014-05-19 23:06:40

MarketResearchReports.biz added deep and professional market research reports on "Global And China CMOS Camera Modules Industry Report 2013-2014" analysis and overview. (PRWEB) May 19, 2014 Global and China CMOS Camera Module Industry Report, 2013-2014 involves the following: Analysis on CMOS Image Sensor Industry Analysis on Lens Industry Analysis on CMOS Camera Module Industry Development Trends of OIS CMOS camera Module Downstream Market Seven CIS Vendors 15 Lens...

2014-05-19 12:26:31

LONDON, May 19, 2014 /PRNewswire/ -- Reportbuyer.com has added a new market research report:3D ICs (MEMS and sensors, RF SiP, Optoelectronics and imaging, Memories, Logic, HB LED) Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2013 - 2019http://www.reportbuyer.com/computing_electronics/manufacturing/3d_ics_mems_sensors_rf_sip_optoelectronics_imaging_memories_logic_hb_led_market_global_industry_analysis_size_share_growth_trends_forecast_2013_2019.html...

2014-05-19 08:31:59

New SonicsStudio® Director GUI Improves Designer Productivity and Quality of Results MILPITAS, Calif., May 19, 2014 /PRNewswire/ -- Sonics, Inc., the world's foremost supplier of on-chip network (NoC) technologies and services, today introduced its next-generation SonicsStudio development environment that addresses the integration challenges of complex system-on-chip (SoC) designs that include multiple processor and intellectual property (IP) cores. Central to this environment is...

2014-05-13 08:38:26

Virtex UltraScale Delivers Quality High-End Devices a Generation Ahead of its Competition SAN JOSE, Calif., May 13, 2014 /PRNewswire/ -- Xilinx, Inc. (NASDAQ: XLNX) today announced the first customer shipment of the Virtex® UltraScale(TM) VU095 All Programmable FPGA, and the expansion of the industry's only 20nm high-end family to enable single chip implementation of 400G and 500G applications. The Virtex UltraScale VU095 device provides unprecedented levels of performance, system...

2014-05-12 12:35:28

SAN JOSE, Calif., May 12, 2014 /PRNewswire/ -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that HiSilicon further expanded usage of the Cadence(®) Palladium(®) XP Verification Computing Platform as its emulation solution for mobile and digital media System-on-Chip (SoC) and ASIC development. http://photos.prnewswire.com/prnvar/20140102/SF39436LOGO HiSilicon provides ASICs and SoCs for communication network and...


Latest Integrated circuits Reference Libraries

24_4ef309736f760441603afe03433e193d
2010-09-02 16:42:23

A chip, also known as an integrated circuit, is a miniaturized electronic circuit consisting mainly of semiconductor devices and passive components, that has been manufactured in the surface of a thin substrate of semiconductor material. There are many different types of chips: microcircuit, microchip, silicon chip, etc. Integrated circuits are regularly used in present-day electronic equipment and have modernized the world of electronics. Computers, cellular phones, and other electronic...

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Word of the Day
toccata
  • In music, a work for a keyboard-instrument, like the pianoforte or organ, originally intended to utilize and display varieties of touch: but the term has been extended so as to include many irregular works, similar to the prelude, the fantasia, and the improvisation.
This word is Italian in origin, coming from the feminine past participle of 'toccare,' to touch.
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