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Latest Integrated circuits Stories

2014-06-17 12:32:42

Feature Low Drop-out Voltage, Low Output Noise Voltage, Low Inrush Current IRVINE, Calif., June 17, 2014 /PRNewswire/ -- Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced two new additions to its TCR3D series of 300mA single output CMOS-LDO regulator ICs. The new TCR3DMxx is housed in a small DFN4 (1.0×1.0×0.58mm) package; and the TCR3DFxx comes in a general purpose...

2014-06-12 23:05:24

The total System in Package (SiP) market is estimated to reach $18.10 billion by 2020 at a higher single digit CAGR from 2013 to 2020. (http://www.marketsandmarkets.com/Market-Reports/System-In-Package-SIP-Market-Chip-Stack-Multi-Chip-Module-MCM-Market-625.html) (PRWEB) June 12, 2014 According to a new market research report "System in Package (SiP) Market by Technology (2D, 2.5D & 3D), Type (BGA, SMT, QFP, SOP), Interconnection Technology (Flip-Chip & Wire-bond),...

2014-06-10 16:30:07

DUBLIN, June 10, 2014 /PRNewswire/ -- Research and Markets (http://www.researchandmarkets.com/research/pg7cp6/system_in_package) has announced the addition of the "System in Package (SIP) Market by Technology, Type, Interconnection Technology, Applications and Geography - Global Trends & Forecasts to - 2014 - 2020" report to their offering. http://photos.prnewswire.com/prnh/20130307/600769 The semiconductor packaging industry in the past decade has seen the emergence of System in...

2014-06-05 04:22:00

SHANGHAI, June 5, 2014 /PRNewswire/ -- Brite Semiconductor (Shanghai) Corporation ("Brite"), a leading IC design and turnkey service provider, and Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981), China's largest and most advanced semiconductor foundry, today jointly announced the launch of their first innovative network services platform SMIC-ASIC.com. Established by Brite and supported by SMIC and Brite, the key purpose of the platform is to build a...

2014-06-03 08:41:26

New Formal Verification, Clock Domain Crossing and Low Power Static Checking Products Offer 3X to 5X Performance and Capacity, Ease-of-use and Advanced Debug Needed for Complex SoC Verification MOUNTAIN VIEW, Calif., June 3, 2014 /PRNewswire/ -- Highlights: -- Next-generation static and formal verification technology now available as part of the Verification Compiler(TM) product and as standalone solutions -- Solutions provide 3X to 5X better performance and...

2014-06-02 12:32:50

FinFET-ready Silicon-proven Tools and IP Available for Immediate Design of SoCs MOUNTAIN VIEW, Calif., June 2, 2014 /PRNewswire/ -- Highlights: -- Galaxy Design Platform certified for Samsung's 14-nm FinFET process, including Process Design Kit (PDK) for Samsung's foundry customers -- Silicon-proven DesignWare IP available now for Samsung's 14-nm FinFET process -- Design and IP solution deployed on 14-nm FinFET SoC product designs...

2014-06-01 23:00:47

System in Package market research report categorizes the “System in Package Market” on the basis of different packaging technology, packaging type, interconnection technology, applications, and geographical analysis, forecasting revenue, and analyzing trends in the market. (http://www.marketsandmarkets.com/Market-Reports/System-In-Package-SIP-Market-Chip-Stack-Multi-Chip-Module-MCM-Market-625.html) (PRWEB) June 01, 2014 According to a new market research report "System in Package...

2014-05-29 08:35:57

MOUNTAIN VIEW, Calif., May 29, 2014 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, together with its partners, will host a number of special events at the Design Automation Conference (DAC) 2014 in San Francisco, Calif. The events will feature speakers from leading semiconductor companies, IP providers and foundries, as well as Synopsys. These technology experts will...

2014-05-29 08:34:38

Collaboration enables mutual customers to achieve faster design closure, minimize costs and maximize manufacturing yield PITTSBURGH and NEWPORT BEACH, Calif., May 29, 2014 /PRNewswire/ -- ANSYS, Inc. (NASDAQ: ANSS) and TowerJazz (NASDAQ/TASE: TSEM), the global specialty foundry leader, announced today a collaboration to deliver comprehensive power noise and reliability sign-off flow for mutual customers. With increased use of analog and radio frequency (RF) integrated circuits (ICs)...

2014-05-28 08:36:09

SANTA CLARA, Calif., May 28, 2014 /PRNewswire/ -- NanGate, Inc. today announced that the company will co-present with SMIC, at the 51st Design Automation Conference, a highly efficient library development flow used for the creation of SMIC's 28nm standard cell library IPs. The joint presentation will take place on Wednesday June 4th, from 10:30 to 11:00 AM-PDT in the Moscone Center, San Francisco, booth #413. By utilizing NanGate's automated layout development and layout migration...


Latest Integrated circuits Reference Libraries

24_4ef309736f760441603afe03433e193d
2010-09-02 16:42:23

A chip, also known as an integrated circuit, is a miniaturized electronic circuit consisting mainly of semiconductor devices and passive components, that has been manufactured in the surface of a thin substrate of semiconductor material. There are many different types of chips: microcircuit, microchip, silicon chip, etc. Integrated circuits are regularly used in present-day electronic equipment and have modernized the world of electronics. Computers, cellular phones, and other electronic...

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Cthulhu
  • A gigantic fictional humanoid alien god being described with a head resembling an octopus and dragon wings and claws, around whom an insane cult developed.
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This word was invented in 1926 by H.P. Lovecraft for his short story, 'The Call of Cthulhu.' 'Cthulhu' may be based on the word 'chthonic,' which in Greek mythology refers to the underworld.
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