Latest Integrated circuits Stories
SAN JOSE, Calif., Jan. 30, 2013 /PRNewswire/ -- Xilinx, Inc. (NASDAQ: XLNX) today announced three major milestones in the execution and introduction of its next generation 20nm All Programmable Devices. The 20nm portfolio builds upon Xilinx breakthroughs proven at 28nm to provide an extra generation of system performance, lower power and programmable system integration. The 20nm portfolio will address a wide range of next generation systems and provides the most compelling...
SUNNYVALE, Calif., Jan. 29, 2013 /PRNewswire/ -- Arteris Inc., the inventor and leading supplier of network-on-chip (NoC) interconnect IP solutions, today announced that MegaChips Corporation of Osaka, Japan, has selected Arteris FlexNoC fabric IP for use within next-generation imaging SoCs. MegaChips previously licensed Arteris' inter-chip link IP products for chip-to-chip connectivity. They chose Arteris' FlexNoC interconnect fabric IP to support the small size and low power...
HSINCHU, Taiwan, Jan. 29, 2013 /PRNewswire/ -- STATS ChipPAC Ltd. (SGX-ST: STATSChP), a leading semiconductor advanced packaging and test service provider, and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced the world's first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem collaboration. The 3D chip stack, consisting of a Wide I/O memory test chip stacked upon...
SUNNYVALE, Calif., Jan. 22, 2013 /PRNewswire/ -- Arteris, Inc., the inventor and only supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, today announced that Open-Silicon implemented the Arteris(®) FlexNoC(TM) interconnect IP as the backbone SoC interconnect in a high-performance ARM(®)-based networking SoC design. (Logo: http://photos.prnewswire.com/prnh/20120831/SF66149LOGO) In 2011, Open-Silicon licensed the Arteris NoC interconnect IP...
MOUNTAIN VIEW, Calif., Jan. 22, 2013 /PRNewswire/ -- Highlights: Includes proven implementation and manufacturing tools, as well as IP for designing with FinFET devices In production use by early adopters of FinFET technology and key foundries Includes foundry-endorsed embedded memory and logic library IP Synopsys, Inc. (Nasdaq:SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced immediate...
HSINCHU, Taiwan, Jan. 22, 2013 /PRNewswire/ -- Faraday Technology Corporation (TWSE: 3035), a leading ASIC and silicon IP provider, and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that they have produced customer system-on-chip (SoC) ICs with a density of over 300 million gates. The successful fabrication of the communication infrastructure ICs demonstrates the two companies' ability to deliver...
Linear Dimensions Semiconductor Inc. today introduces the industry’s lowest power, smallest form factor line of high voltage multiple channel MEMsiics(R) devices, enabling the driving and interface of emerging microelectromechanical machine products. Las Vegas, NV (PRWEB) January 10, 2013 Linear Dimensions Semiconductor Inc. today introduced its MEMsiics® line of microelectromechanical drivers and high voltage interface ICs (integrated circuits). MEMsiics® represent the state...
SEOUL, South Korea and CUPERTINO, Calif., Jan. 7, 2013 /PRNewswire/ -- MagnaChip Semiconductor Corporation ("MagnaChip") (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it now offers a second generation 0.35-micron BCD (Bipolar/CMOS/DMOS) high voltage process technology. This next generation process supports applications from 3.3V to 65V making it ideally suited for DC-DC converters and regulators,...
New design for a basic component of all computer chips boasts the highest 'carry mobility' yet measured Almost all computer chips use two types of transistors: one called p-type, for positive, and one called n-type, for negative. Improving the performance of the chip as a whole requires parallel improvements in both types. At the IEEE's International Electron Devices Meeting (IEDM) in December, researchers from MIT's Microsystems Technology Laboratories (MTL) presented a p-type...
M31 announced its USB 3.0 PHY IP passed the verification for TSMC’s 40nm process, and completed the TSMC9000 quality assessment. Hsinchu, Taiwan (PRWEB) December 22, 2012 M31 Technology announced today that it has joined the TSMC IP Alliance. In addition, M31 announced its USB 3.0 PHY (physical layer) IP passed the high and low temperature tests and reliability verification for TSMC’s 40nm process, and completed the TSMC9000 quality assessment. The TSMC9000 library and IP quality...
Latest Integrated circuits Reference Libraries
A chip, also known as an integrated circuit, is a miniaturized electronic circuit consisting mainly of semiconductor devices and passive components, that has been manufactured in the surface of a thin substrate of semiconductor material. There are many different types of chips: microcircuit, microchip, silicon chip, etc. Integrated circuits are regularly used in present-day electronic equipment and have modernized the world of electronics. Computers, cellular phones, and other electronic...
