Latest Integrated circuits Stories
Cloud-based semiconductor infrastructure enables SUTD and NTU collaboration SIngapore (PRWEB) October 03, 2014 Silicon Cloud International (SCI), a provider
FELDKIRCHEN, Germany, Oct. 2, 2014 /PRNewswire/ -- Cadence Design Systems, Inc.
In the upcoming 2014 IEEE S3S conference (October 6-9), MonolithIC 3D will unveil a breakthrough flow that is game-changing for 3D IC technology. San Jose, CA
News Highlights: SANTA CLARA, Calif., Oct.
ROME, Sept. 30, 2014 /PRNewswire/ -- EUROPEAN MICROWAVE WEEK - Peregrine Semiconductor Corp.
Collaboration Enables Best Practices for Custom Implementation Productivity with FinFET Devices MOUNTAIN VIEW, Calif., Sept.
10nm FinFET Process Collaboration Enables Immediate Early Customer Design Starts SAN JOSE, Calif., Sept. 26, 2014 /PRNewswire/ -- Cadence Design Systems, Inc.
Dean Woodman, early investor and former chairman of GoPro Inc.
GaN-on-Si enables GaN power electronics, will LED transition as well? LONDON, Sept.
A chip, also known as an integrated circuit, is a miniaturized electronic circuit consisting mainly of semiconductor devices and passive components, that has been manufactured in the surface of a thin substrate of semiconductor material. There are many different types of chips: microcircuit, microchip, silicon chip, etc. Integrated circuits are regularly used in present-day electronic equipment and have modernized the world of electronics. Computers, cellular phones, and other electronic...
- Growing in low tufty patches.