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Latest Integrated circuits Stories

2014-04-30 16:35:25

DALLAS, May 1, 2014 /PRNewswire/ -- According to a new market research report "System in Package (SiP) Market by Technology (2D, 2.5D & 3D), Type (BGA, SMT, QFP, SOP), Interconnection Technology (Flip-Chip & Wire-bond), Applications (Communications, Consumer, Automotive, Medical) and Geography (N. America, Europe, APAC & ROW) - Global Trends & Forecasts to - 2014 - 2020", published by MarketsandMarkets, the total System in Package (SiP) market is expected to...

2014-04-30 16:34:44

DUBLIN, April 30, 2014 /PRNewswire/ -- Research and Markets (http://www.researchandmarkets.com/research/fhhfv8/the) have announced the addition of the "The Multi-Component IC Packaging Market 2014 Edition" [http://www.researchandmarkets.com/research/fhhfv8/the ] report to their offering. (Logo: http://photos.prnewswire.com/prnh/20130307/600769 ) Complex multi-component packages have added a new dimension to high speed and small form factor, and have been game...

2014-04-30 08:41:19

Delivers 3X Higher Test Compression and Ease-of-Deployment MOUNTAIN VIEW, Calif., April 30, 2014 /PRNewswire/ -- Highlights: -- Dialog deployed DFTMAX Ultra on a mixed-signal IC in less than a day -- The device was manufactured and successfully tested for silicon defects -- Test time reduced by more than 3X Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that...

2014-04-25 23:05:36

3D printing report presents a detailed overview of the overall market by enveloping all the major market segments with a detailed qualitative analysis at each and every aspect of the segmentation. (PRWEB) April 25, 2014 According to a market research report on "3D Printing Market by Technology, Materials, Application & Geography -(2013-2020)" published by MarketsandMarkets, the 3D Printing Market is expected to grow at a CAGR of 23% from 2013 to 2020, and reach $8.41 billion...

2014-04-23 08:41:11

Prototyping Automation and Debug Software for HAPS FPGA-based Prototyping Systems Improves Prototyping Performance MOUNTAIN VIEW, Calif., April 23, 2014 /PRNewswire/ -- Highlights: -- ProtoCompiler software and integrated HAPS hardware accelerate time to prototype bring-up and improve prototype performance -- Automated partitioning capability across multiple FPGAs decreases runtime from hours to minutes for up to 250 million ASIC gate designs -- Enables...

2014-04-23 08:40:05

Collaboration Also Enables In-Design Physical Verification with IC Compiler MOUNTAIN VIEW, Calif. and HSINCHU, Taiwan, April 23, 2014 /PRNewswire/ -- Highlights: -- UMC extends existing support for Synopsys(®) IC Validator physical verification to 28 nm -- UMC support includes In-Design physical verification within Synopsys' IC Compiler((TM)) place-and-route tool, enabling advanced design techniques -- IC Validator DRC and LVS decks are available for immediate...

2014-04-22 23:11:49

ResearchMoz.us include new market research report "Research Report on China Integrated Circuit (IC) Industry, 2014 - 2018: Indsutry Size, Shares, Growth, Analysis, Trends And Forecast" to its huge collection of research reports. Browse Full Report with TOC at: http://www.researchmoz.us/research-report-on-china-integrated-circuit-ic-industry-2014-2018-report.html. Albany, NY (PRWEB) April 22, 2014 The growth rate of China integrated circuit industry ranks the first in the world...

2014-04-16 16:33:39

MegaChips Corporation announces the MegaChips new generation LDO, a new line of products jointly developed with Texas-based semiconductor company, Vidatronic, Inc. OSAKA, Japan, April 16, 2014 /PRNewswire/ -- MegaChips, one of the world's largest application-specific integrated circuit (ASIC) solution providers, introduces MegaChips' new generation LDO, a new line of low dropout (LDO) linear voltage regulators offering superior performance over traditional LDO products. MegaChips...

2014-04-16 04:22:59

Patented Techniques to Minimize the Die Area, Optimize the Performance, and Raise the Yield Rate HSINCHU and SANTA CLARA, Calif., April 16, 2014 /PRNewswire/ -- Faraday Technology Corporation (TAIEX: 3035), a leading fabless ASIC/SoC and IP provider, today announced the availability of its complete set of cell libraries and memory compilers in UMC 28nm HPM (High Performance for Mobile) and HLP (High-Performance Low Power) processes. Faraday's complete set of 28nm solutions satisfies...

2014-04-15 12:34:10

Full certification enables customers to tape out 16nm FinFET designs using Cadence tools SAN JOSE, Calif., April 15, 2014 /PRNewswire/ -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced its digital, custom and signoff tools have received V1.0 Design Rule Manual (DRM) and SPICE certification for TSMC's 16nm FinFET process, enabling joint customers to begin taping out FinFET-based designs using Cadence® tools. Cadence's...


Latest Integrated circuits Reference Libraries

24_4ef309736f760441603afe03433e193d
2010-09-02 16:42:23

A chip, also known as an integrated circuit, is a miniaturized electronic circuit consisting mainly of semiconductor devices and passive components, that has been manufactured in the surface of a thin substrate of semiconductor material. There are many different types of chips: microcircuit, microchip, silicon chip, etc. Integrated circuits are regularly used in present-day electronic equipment and have modernized the world of electronics. Computers, cellular phones, and other electronic...

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  • A landsman who is making his first voyage at sea; a novice who enters naval service from rural life.
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