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Latest Integrated circuits Stories

2014-06-24 08:38:55

Production-Ready DesignWare IP for TSMC 28HPC Process Enables Designers to Reduce Power Consumption and Area for Mobile and Ultra Low-Power IoT Designs MOUNTAIN VIEW, Calif., June 24, 2014 /PRNewswire/ -- Highlights: -- Synopsys DesignWare® IP portfolio for TSMC 28HPC includes interface, analog, embedded memory and logic library IP -- Production-ready IP portfolio enables fast time-to-market by leveraging compatibility with silicon-proven DesignWare IP for TSMC...

2014-06-24 08:32:33

Accuracy, Low power along with small form factor size SANTA CLARA, Calif., June 24, 2014 /PRNewswire-iReach/ -- PixArt Imaging Inc., a leading provider of human-machine interface (HMI) solutions, today announces the release of its Heart Rate Monitor sensor for smart phones and wearable device platforms. The market for wearable computing devices is driven by a growing range of wireless connected wearable sports, fitness and well-being devices. The key product attributes of the current wearable...

2014-06-23 08:35:21

New Program Provides Prototypers with Daughter Boards and Services from Synopsys-Approved Third Party Providers MOUNTAIN VIEW, Calif., June 23, 2014 /PRNewswire/ -- Highlights: -- HAPS Connect Program enables prototypers to leverage proven solutions from hardware and service vendors for fast prototype bring-up -- Network of approved third party hardware and service vendors provides daughter boards that are optimized for HAPS systems -- The initial partners of...

2014-06-17 12:32:42

Feature Low Drop-out Voltage, Low Output Noise Voltage, Low Inrush Current IRVINE, Calif., June 17, 2014 /PRNewswire/ -- Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced two new additions to its TCR3D series of 300mA single output CMOS-LDO regulator ICs. The new TCR3DMxx is housed in a small DFN4 (1.0×1.0×0.58mm) package; and the TCR3DFxx comes in a general purpose...

2014-06-12 23:05:24

The total System in Package (SiP) market is estimated to reach $18.10 billion by 2020 at a higher single digit CAGR from 2013 to 2020. (http://www.marketsandmarkets.com/Market-Reports/System-In-Package-SIP-Market-Chip-Stack-Multi-Chip-Module-MCM-Market-625.html) (PRWEB) June 12, 2014 According to a new market research report "System in Package (SiP) Market by Technology (2D, 2.5D & 3D), Type (BGA, SMT, QFP, SOP), Interconnection Technology (Flip-Chip & Wire-bond),...

2014-06-10 16:30:07

DUBLIN, June 10, 2014 /PRNewswire/ -- Research and Markets (http://www.researchandmarkets.com/research/pg7cp6/system_in_package) has announced the addition of the "System in Package (SIP) Market by Technology, Type, Interconnection Technology, Applications and Geography - Global Trends & Forecasts to - 2014 - 2020" report to their offering. http://photos.prnewswire.com/prnh/20130307/600769 The semiconductor packaging industry in the past decade has seen the emergence of System in...

2014-06-05 04:22:00

SHANGHAI, June 5, 2014 /PRNewswire/ -- Brite Semiconductor (Shanghai) Corporation ("Brite"), a leading IC design and turnkey service provider, and Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981), China's largest and most advanced semiconductor foundry, today jointly announced the launch of their first innovative network services platform SMIC-ASIC.com. Established by Brite and supported by SMIC and Brite, the key purpose of the platform is to build a...

2014-06-03 08:41:26

New Formal Verification, Clock Domain Crossing and Low Power Static Checking Products Offer 3X to 5X Performance and Capacity, Ease-of-use and Advanced Debug Needed for Complex SoC Verification MOUNTAIN VIEW, Calif., June 3, 2014 /PRNewswire/ -- Highlights: -- Next-generation static and formal verification technology now available as part of the Verification Compiler(TM) product and as standalone solutions -- Solutions provide 3X to 5X better performance and...

2014-06-02 12:32:50

FinFET-ready Silicon-proven Tools and IP Available for Immediate Design of SoCs MOUNTAIN VIEW, Calif., June 2, 2014 /PRNewswire/ -- Highlights: -- Galaxy Design Platform certified for Samsung's 14-nm FinFET process, including Process Design Kit (PDK) for Samsung's foundry customers -- Silicon-proven DesignWare IP available now for Samsung's 14-nm FinFET process -- Design and IP solution deployed on 14-nm FinFET SoC product designs...

2014-06-01 23:00:47

System in Package market research report categorizes the “System in Package Market” on the basis of different packaging technology, packaging type, interconnection technology, applications, and geographical analysis, forecasting revenue, and analyzing trends in the market. (http://www.marketsandmarkets.com/Market-Reports/System-In-Package-SIP-Market-Chip-Stack-Multi-Chip-Module-MCM-Market-625.html) (PRWEB) June 01, 2014 According to a new market research report "System in Package...


Latest Integrated circuits Reference Libraries

24_4ef309736f760441603afe03433e193d
2010-09-02 16:42:23

A chip, also known as an integrated circuit, is a miniaturized electronic circuit consisting mainly of semiconductor devices and passive components, that has been manufactured in the surface of a thin substrate of semiconductor material. There are many different types of chips: microcircuit, microchip, silicon chip, etc. Integrated circuits are regularly used in present-day electronic equipment and have modernized the world of electronics. Computers, cellular phones, and other electronic...

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Word of the Day
negawatt
  • A unit of saved energy.
Coined by Amory Lovins, chairman of the Rocky Mountain Institute as a contraction of negative watt on the model of similar compounds like megawatt.