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Latest Integrated circuits Stories

2013-08-02 23:19:21

Hamamatsu’s Single-Chip Spectrometer Wins Product of the Year from Sangyo Times Cairo, Egypt (PRWEB) August 02, 2013 Si-Ware Systems (SWS), a premier provider of IC- and MEMS-based solutions for industrial and consumer applications, has provided enabling technology that has allowed Hamamatsu Photonics of Japan to win product of the year from Sangyo Times. Sangyo Times is a semiconductor industry periodical in Japan that gives yearly awards in the semiconductor industry, and this year...

2013-07-30 20:23:19

ROME, New York, July 30, 2013 /PRNewswire-USNewswire/ -- The Electrical Overstress (EOS) / Electrostatic Discharge (ESD) Association, also known as ESD Association, announces the 35(th) annual EOS/ESD Symposium. Register for the 35th Annual EOS/ESD Symposium September 8-13, 2013 held at the Rio All Suites Hotel in Las Vegas, NV, USA. Benchmark your company's operation against the practices of other companies. Solve business challenges in controlling ESD by networking with other ESD...

2013-07-23 08:34:48

Virtex-7 H580T FPGA recognized for its revolutionary contribution to the 3D IC industry SAN JOSE, Calif., July 23, 2013 /PRNewswire/ -- Xilinx, Inc. (NASDAQ: XLNX) today announced that its Virtex®-7 H580T FPGA, the world's first heterogeneous All Programmable 3D IC, won the "3D Products (Design/Process)" category in this year's 3D InCites Awards, which recognize the companies that are revolutionizing the 3D IC industry and which were presented last week by 3D InCites and...

2013-07-22 23:22:32

Collaboration with 3D-ICs.com provides group members the latest news and opinions about the field San Jose, CA (PRWEB) July 22, 2013 The 3D-IC LinkedIn Group announced today that it reached more than 2,000 members. Started as a discussion forum for 3D Integrated Circuits (3D-ICs) in July of 2011, the LinkedIn Group has seen a rapid growth of membership due to the industry’s high level of interest in the technology. At present, the 3D-IC LinkedIn group’s membership includes over 720...

2013-07-22 08:30:34

SEOUL, South Korea and CUPERTINO, Calif., July 22, 2013 /PRNewswire/ -- MagnaChip Semiconductor Corporation ("MagnaChip") (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, and the National Nano Fab Center ("NNFC") have entered into an SOI RF CMOS technology transfer agreement which combines MagnaChip's specialty manufacturing expertise with NNFC's robust RF technology. The two companies have targeted expansion into the...

2013-07-18 12:32:02

TI's new devices provide low power consumption, noise and distortion DALLAS, July 18, 2013 /PRNewswire/ -- Texas Instruments (TI) (NASDAQ: TXN) today expanded its high-speed amplifier portfolio with two new differential amplifiers that offer the industry's best power-to-performance ratio. The single-channel THS4531A and dual THS4532 achieve seven times the bandwidth with one-fourth of the input referred noise while also reducing power consumption by 80 percent, compared to the...

2013-07-16 08:32:16

Mobilicom leverages Xilinx's solution to speed product development and achieve lower bill-of-material (BOM) costs compared to multi-chip ASIC and ASSP designs in public safety end user terminals SAN JOSE, Calif., July 16, 2013 /PRNewswire/ -- Xilinx, Inc. (NASDAQ: XLNX) today announced that at the heart of Mobilicom's new MCU-30 software-defined radio (SDR) is Xilinx's Zynq®-7030 All Programmable System-on-a-Chip (SoC), a member of Xilinx's Zynq-7000 family. Mobilicom's MCU-30 SDR...

2013-07-09 08:34:42

Custom DSP Reduces Power Consumption by 20 Percent Compared to Other Commercially-Available DSP IP MOUNTAIN VIEW, Calif., July 9, 2013 /PRNewswire/ Highlights Synopsys Processor Designer(TM) tool enables rapid exploration of processor architectures to optimize for performance, power and area Fujitsu Laboratories created a custom DSP with Processor Designer for multi-mode 3G/LTE modem that delivers higher performance than general purpose DSPs with 20 percent lower power...

2013-06-26 08:34:13

Process Qualification Vehicle Tapeout Validates UMC 14-nm FinFET Process Using Synopsys DesignWare IP and StarRC Parasitic Extraction Tool HSINCHU, Taiwan and MOUNTAIN VIEW, Calif., June 26, 2013 /PRNewswire/ -- Highlights First collaboration milestone speeds validation of IP and design correlation on UMC's 14-nm FinFET process Process qualification vehicle validates key process and IP test structures Tapeout helps accelerate adoption of the UMC FinFET process for faster and...

2013-06-24 08:31:53

Synopsys Brings its Expertise in 3D-IC Solutions to Singapore's A*STAR IME-Led 2.5D Through-Silicon Interposer Consortium MOUNTAIN VIEW, Calif. and SINGAPORE, June 24, 2013 /PRNewswire/ -- Collaboration will provide the framework for heterogeneous 2.5D/3D-IC systems Will optimize silicon interposer technology for lower cost and higher performance Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic...


Latest Integrated circuits Reference Libraries

24_4ef309736f760441603afe03433e193d
2010-09-02 16:42:23

A chip, also known as an integrated circuit, is a miniaturized electronic circuit consisting mainly of semiconductor devices and passive components, that has been manufactured in the surface of a thin substrate of semiconductor material. There are many different types of chips: microcircuit, microchip, silicon chip, etc. Integrated circuits are regularly used in present-day electronic equipment and have modernized the world of electronics. Computers, cellular phones, and other electronic...

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