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Latest Integrated circuits Stories

2013-08-19 08:33:49

Arteris NoC technology used by four of the top five Chinese fabless semiconductor OEMs SUNNYVALE, Calif., Aug. 19, 2013 /PRNewswire/ -- Arteris, Inc., the inventor and only supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, today announced that its interconnect fabric IP has been licensed and deployed in a majority of chips developed by China's leading semiconductor companies for applications including consumer electronics, smartphones, and tablets. Based...

2013-08-13 08:26:32

SUNNYVALE, Calif., Aug. 13, 2013 /PRNewswire/ -- Arteris, Inc., the inventor and leading supplier of network-on-chip (NoC) interconnect IP solutions, today announced that Allwinner Technology Co., Ltd. has selected Arteris(®) FlexNoC(®) interconnect IP as the backbone SoC interconnect for its new tablet and mobile device systems-on-chip (SoC) platforms. The Zhuhai, China-based, leading fabless design house will leverage the FlexNoC interconnect IP with its ARM-based single and...

2013-08-05 08:32:27

Synopsys' Synplify Pro Software Delivers Optimal Logic Synthesis Results for Users of Lattice Semiconductor FPGAs and CPLDs MOUNTAIN VIEW, Calif., Aug. 5, 2013 Highlights: Multi-year contract renewal provides Lattice FPGA and CPLD users with Synopsys' technology-leading Synplify Pro logic synthesis tool Synplify Pro has been optimized for Lattice Semiconductor devices to deliver optimal Quality of Results (QoR) and fast timing closure Seamless integration with Lattice Diamond...

2013-08-02 23:19:21

Hamamatsu’s Single-Chip Spectrometer Wins Product of the Year from Sangyo Times Cairo, Egypt (PRWEB) August 02, 2013 Si-Ware Systems (SWS), a premier provider of IC- and MEMS-based solutions for industrial and consumer applications, has provided enabling technology that has allowed Hamamatsu Photonics of Japan to win product of the year from Sangyo Times. Sangyo Times is a semiconductor industry periodical in Japan that gives yearly awards in the semiconductor industry, and this year...

2013-07-30 20:23:19

ROME, New York, July 30, 2013 /PRNewswire-USNewswire/ -- The Electrical Overstress (EOS) / Electrostatic Discharge (ESD) Association, also known as ESD Association, announces the 35(th) annual EOS/ESD Symposium. Register for the 35th Annual EOS/ESD Symposium September 8-13, 2013 held at the Rio All Suites Hotel in Las Vegas, NV, USA. Benchmark your company's operation against the practices of other companies. Solve business challenges in controlling ESD by networking with other ESD...

2013-07-23 08:34:48

Virtex-7 H580T FPGA recognized for its revolutionary contribution to the 3D IC industry SAN JOSE, Calif., July 23, 2013 /PRNewswire/ -- Xilinx, Inc. (NASDAQ: XLNX) today announced that its Virtex®-7 H580T FPGA, the world's first heterogeneous All Programmable 3D IC, won the "3D Products (Design/Process)" category in this year's 3D InCites Awards, which recognize the companies that are revolutionizing the 3D IC industry and which were presented last week by 3D InCites and...

2013-07-22 23:22:32

Collaboration with 3D-ICs.com provides group members the latest news and opinions about the field San Jose, CA (PRWEB) July 22, 2013 The 3D-IC LinkedIn Group announced today that it reached more than 2,000 members. Started as a discussion forum for 3D Integrated Circuits (3D-ICs) in July of 2011, the LinkedIn Group has seen a rapid growth of membership due to the industry’s high level of interest in the technology. At present, the 3D-IC LinkedIn group’s membership includes over 720...

2013-07-22 08:30:34

SEOUL, South Korea and CUPERTINO, Calif., July 22, 2013 /PRNewswire/ -- MagnaChip Semiconductor Corporation ("MagnaChip") (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, and the National Nano Fab Center ("NNFC") have entered into an SOI RF CMOS technology transfer agreement which combines MagnaChip's specialty manufacturing expertise with NNFC's robust RF technology. The two companies have targeted expansion into the...

2013-07-18 12:32:02

TI's new devices provide low power consumption, noise and distortion DALLAS, July 18, 2013 /PRNewswire/ -- Texas Instruments (TI) (NASDAQ: TXN) today expanded its high-speed amplifier portfolio with two new differential amplifiers that offer the industry's best power-to-performance ratio. The single-channel THS4531A and dual THS4532 achieve seven times the bandwidth with one-fourth of the input referred noise while also reducing power consumption by 80 percent, compared to the...

2013-07-16 08:32:16

Mobilicom leverages Xilinx's solution to speed product development and achieve lower bill-of-material (BOM) costs compared to multi-chip ASIC and ASSP designs in public safety end user terminals SAN JOSE, Calif., July 16, 2013 /PRNewswire/ -- Xilinx, Inc. (NASDAQ: XLNX) today announced that at the heart of Mobilicom's new MCU-30 software-defined radio (SDR) is Xilinx's Zynq®-7030 All Programmable System-on-a-Chip (SoC), a member of Xilinx's Zynq-7000 family. Mobilicom's MCU-30 SDR...


Latest Integrated circuits Reference Libraries

24_4ef309736f760441603afe03433e193d
2010-09-02 16:42:23

A chip, also known as an integrated circuit, is a miniaturized electronic circuit consisting mainly of semiconductor devices and passive components, that has been manufactured in the surface of a thin substrate of semiconductor material. There are many different types of chips: microcircuit, microchip, silicon chip, etc. Integrated circuits are regularly used in present-day electronic equipment and have modernized the world of electronics. Computers, cellular phones, and other electronic...

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