Latest Laird Technologies Inc. Stories
Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced the launch of its T-flex(TM) 700 for use as a thermal interface material (TIM). The T-flex(TM) 700 is the next generation thermal pad in the T-flex(TM) gap filler line. It improves the thermal performance of the T-flex(TM) line by increasing the thermal conductivity to 5.0 W/mK. The soft material is...
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