Latest MEMS Stories

Product Redesign Provides R&D Institutions and Universities with Superior Wafer Bonding Technology at an Affordable Cost ST. FLORIAN, Austria, June 9 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has launched an all-new EVG501 wafer bonding system to address rising cost burdens for its university and R&D customers. Redesigned based on customer feedback,...

Company Makes Continued Inroads in High-Volume Manufacturing Market ST. FLORIAN, Austria, June 4 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that EPCOS - a leading electronic components, modules and systems manufacturer - selected EVG's fully automated GEMINI wafer bonder for high-volume RF components production at EPCOS's production facility based in Munich, Germany....

SINGAPORE, June 3 /PRNewswire/ -- The field of microelectromechanical systems (MEMS) has grown exponentially since its inception four decades ago. MEMS technology has gradually evolved with an array of applications across diverse end-user segments. The market has witnessed considerable growth in the consumer, automotive, and industrial sectors. (Logo: http://www.newscom.com/cgi-bin/prnh/20081117/FSLOGO) New analysis from Frost & Sullivan (http://www.sensors.frost.com), Analysis of the...

European researchers believe they have achieved what has remained an almost impossible dream in the wireless world: powerful mobile services that work simply, seamlessly and intuitivelyEuropean researchers have developed a mobile services platform that is generating a lot of excitement among fellow researchers and developers. It already works with Windows Mobile and Symbian, two leading mobile phone operating systems.Now there are advanced discussions about porting the system to the iPhone....

Prestigious Research Institute a Strategic Win for EV Group St. Florian, Austria, May 12 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Fraunhofer Institute for Applied Optics and Precision Engineering IOF--one of 57 institutes of the Fraunhofer-Gesellschaft dedicated to applied optics and precision applications-oriented research--selected EVG's UV-based nanoimprint...

MARLBOROUGH, Mass., April 28 /PRNewswire/ -- Block Engineering announced today that it has been awarded a total of $3,300,000 in contracts from several DoD agencies to develop next generation, ultra-miniaturized infrared spectrometers, based on the company's Microelectromechanical (MEMS) and Quantum Cascade Lasers (QCLs) technologies. "These awards are the result of our focused efforts to demonstrate to our customers the powerful potential of our MEMS and lasers technologies," said Dr....

NEWPORT, Wales, April 7 /PRNewswire/ -- Surface Technology Systems plc (STS), a leader in plasma process technologies for manufacturing MEMS and advanced semiconductor devices, today announced that they have sold two ICP systems to the UNAM, a new Institute of Materials Science and Nanotechnology, based at Bilkent University in Turkey (http://www.nano.org.tr). The Inductively Coupled Plasma (ICP) etch tools will be used for a wide range of applications including deep reactive ion etching...

-- Paladin Capital Group leads the round of financing as WiSpry's newest investment partner -- IRVINE, Calif., April 7 /PRNewswire/ -- WiSpry, Inc., the leader in programmable radio frequency (RF) semiconductor products for the wireless industry, today announced its first closing for a Series C financing of $10 million dollars. The round was led by a new investor in the company, Paladin Capital Group, which is also gaining a seat on WiSpry's board of directors, as well as existing...

ST. FLORIAN, Austria, April 1 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has entered a joint development program (JDP) with CEA/Leti -- one of Europe's renowned research labs focusing on microelectronics and nanotechnology. EVG, an early leader in through-silicon-via (TSV) and 3D integration technology, will provide CEA/Leti with its world-class, 300-mm temporary...

GENEVA, March 30 /PRNewswire-FirstCall/ -- STMicroelectronics (NYSE: STM), the leading supplier of motion-sensing chips for consumer and portable applications(1), has expanded its portfolio of ultra-compact, high-performance MEMS (Micro Electro-Mechanical System) sensors with a 3-axis accelerometer with absolute analog output. Able to operate with any supply voltage in the range of 2.16V to 3.6V and extremely stable over temperature and time, ST's LIS352AX is a perfect fit for...