Latest MEMS Stories

EV Group Launches New Flagship Model in Its GEMINIÂ® FB Family of Fusion Wafer Bonding Systems to Enhance Throughput and Automation Performance

2011-09-07 09:06:00

TAIPEI, Taiwan, Sept. 7, 2011 /PRNewswire/ -- SEMICON Taiwan -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is launching a new flagship model in its field-proven GEMINI FB fusion wafer bonding family that increases system throughput to up to 20 wafers per hour. The upgrade includes enhanced automation capabilities to enable customers to achieve higher levels of manufacturing...

SPTS Technologies Takes 900th Order for Deep Reactive Ion Etch (DRIE) Module

2011-09-06 21:00:00

NEWPORT, Wales and SEMICON, Taiwan, September 7, 2011 /PRNewswire/ -- SPTS Technologies, a leading manufacturer of etch, deposition, and thermal processing equipment for the semiconductor and related industries today announced it has received an order for its 900th DRIE process module. The module will be shipped to one of Asia's foundries for use in micro-electromechanical systems (MEMS) manufacturing. This milestone confirms SPTS' market-leading position in DRIE. The...

poLight Selects SVTC Technologies as their Next Generation Actuator Commercialization Partner

2011-09-06 12:00:00

Partnership to migrate poLight Optical MEMs to large volume production Horton, Norway (PRWEB) September 06, 2011 poLight, the world leader in reflowable autofocus actuated lenses, today announced that it has entered a partnership agreement with SVTC Technologies, the leading development and manufacturing services provider for new, emerging silicon-based technologies in areas such as novel transistors, microfluidics, MEMS, photovoltaics and other nanotechnologies. This agreement will...

EV Group Breaks Ground for Headquarters Expansion Due to Increased Customer Demand

2011-07-27 13:37:00

ST. FLORIAN, Austria, July 27, 2011 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it broke ground on expanding the company's manufacturing capacity at its headquarters in Austria earlier this month. This expansion is the latest example of the company's continued steady growth since its foundation more than 30 years ago. In addition, the company has witnessed a 40 percent...

Vuzix and Fraunhofer Announce Strategic Alliance for Display Technology Development

2011-07-14 08:45:00

ROCHESTER, N.Y., July 14, 2011 /PRNewswire/ -- Vuzix Corporation (TSX-V: VZX, OTC:BB: VUZI, FMB: V7X) ("Vuzix" or the "Company") formally announced today a strategic technology development partnership with the Fraunhofer Institute for Photonic Microsystems (IPMS). Vuzix and Fraunhofer IPMS have been engaged in the development of MEMS devices optimized for augmented and virtual wearable display solutions. This partnership will produce a key component that integrates both the display and...

Jeff Sherman Joins Block Engineering as Vice President of Worldwide Sales

2011-07-13 08:11:00

MARLBOROUGH, Mass., July 13, 2011 /PRNewswire/ -- Block Engineering, a leading developer of MEMS, laser and FTIR spectroscopy sensors, announced today that Jeff Sherman has joined the company as its new Vice President of Worldwide Sales. Jeff will lead all sales activities at Block, as the company aggressively pursues the introduction of its Quantum Cascade Lasers (QCLs) based handheld and portable spectrometers for detection and identification of chemical threats. Petros Kotidis, CEO of...

Tanaka Precious Metals and SUSS MicroTec to Jointly Develop Sub-micron Gold Particle Pattern Transfer and Bonding Technology

2011-07-12 00:35:01

Fine patterns formed at once enable the creation of low-temperature wafer bonding that is highly heat resistance and highly reliable, and can be applied to advanced MEMS, high-brightness LEDs and small-sized chip electronic componentsTokyo, July 12, 2011 - (ACN Newswire) - Tanaka Kikinzoku Kogyo K.K.(1) and SUSS MicroTec KK will begin joint development of pattern transfer and bonding technology using sub-micron sized (1/10,000mm) gold particles.This joint development...

EV Group Unveils Industry's First Wafer Bonding System for 450-mm Silicon-on-Insulator Semiconductor Wafers

2011-07-11 08:00:00

SAN FRANCISCO, Calif., July 11, 2011 /PRNewswire/ -- SEMICON WEST -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the semiconductor industry's first bonding system for 450-mm-diameter wafers manufactured from silicon-on-insulator (SOI) substrates. Building on EVG's leadership in SOI wafer bonding, the new system - dubbed the EVG850SOI/450 mm - was created to support and facilitate the...

Qualtre Gains $10M in Funding With Demonstration of First Silicon MEMS BAW Gyroscope

2011-07-08 09:00:00

MARLBOROUGH, Mass., July 8, 2011 /PRNewswire/ -- Consumer electronics focused motion sensor supplier, Qualtre Inc., announced that with their successful demonstration of the world's first tri-axial solid-state silicon BAW (bulk-acoustic wave) gyroscope, their investors have injected an additional $10M in capital. The new funding will enable the company's product launch, expansion of sales and supply chain infrastructure, and development of next-generation products based on their...

Audio Pixels Holdings Limited Signs Joint Development Agreement with Sony Corporation of Japan

2011-07-08 07:00:00

SYDNEY, July 8, 2011 /PRNewswire-Asia/ -- Audio Pixels Holdings Limited (ASX: AKP; OTC: ADPXY) is pleased to announce that it has signed a Joint Development Agreement with Sony Corporation of Japan for the development of its patented low cost micro-electro mechanical ("MEMS") digital speakers. Sony Corporation is one of the world's foremost consumer electronic and semiconductor conglomerates. As previously announced the joint development partner, Sony Corporation is funding the majority of...