Latest Multigate device Stories

Synopsys Uniquely Proven for the Emerging New Wave of FinFET-based Process Technology MOUNTAIN VIEW, Calif., May 13, 2013 /PRNewswire/ -- Highlights Achronix standardizes on Synopsys' IC Complier for design, and IC Validator for verification Synopsys tools used in production for first commercial FinFET-based design Latest tool enhancements enable support for all emerging FinFET requirements Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used...

HSINCHU, Taiwan and CAMBRIDGE, England, April 2, 2013 /PRNewswire/ -- ARM and TSMC (TWSE: 2330, NYSE: TSM) today announced the first tape-out of an ARM® Cortex(TM)-A57 processor on FinFET process technology. The Cortex-A57 processor is ARM's highest performing processor, designed to further extend the capabilities of future mobile and enterprise computing, including compute intensive applications such as high-end computer, tablet and server products. This is the first milestone in...

Early results using novel materials and processes achieves milestone toward low-power tunnel transistor electronics Researchers at Rochester Institute of Technology, international semiconductor consortium SEMATECH and Texas State University have demonstrated that use of new methods and materials for building integrated circuits can reduce power—extending battery life to 10 times longer for mobile applications compared to conventional transistors. The key to the breakthrough is a...

MOUNTAIN VIEW, Calif., Jan. 22, 2013 /PRNewswire/ -- Highlights: Includes proven implementation and manufacturing tools, as well as IP for designing with FinFET devices In production use by early adopters of FinFET technology and key foundries Includes foundry-endorsed embedded memory and logic library IP Synopsys, Inc. (Nasdaq:SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced immediate...

New design for a basic component of all computer chips boasts the highest 'carry mobility' yet measured Almost all computer chips use two types of transistors: one called p-type, for positive, and one called n-type, for negative. Improving the performance of the chip as a whole requires parallel improvements in both types. At the IEEE's International Electron Devices Meeting (IEDM) in December, researchers from MIT's Microsystems Technology Laboratories (MTL) presented a p-type...

MOUNTAIN VIEW, Calif., Dec. 20, 2012 /PRNewswire/ -- Highlights: Milestone helps accelerate adoption of FinFET technology for faster and more power efficient Systems on Chips (SoC)s Collaboration delivers foundation for 3D device modeling and physical design rule support Test chip qualifies FinFET process and Synopsys(®) DesignWare(®) Embedded Memories Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips...

LEUVEN, Belgium, and MOUNTAIN VIEW, Calif., Dec. 12, 2012 /PRNewswire/ -- Imec, the Belgian nanoelectronics research center, and Synopsys, Inc. (Nasdaq:SNPS), a global leader accelerating innovation in the design, verification and manufacturing of chips and systems, today announced that they have expanded their collaboration in the field of Technology Computer Aided Design (TCAD) to next-generation FinFET technology at 10 nm. The collaboration builds on extensive work done at 14 nm...

HSINCHU, Taiwan and CAMBRIDGE, UK, July 23, 2012 /PRNewswire/ -- TSMC (TWSE: 2330, NYSE: TSM) and ARM today announced a multi-year agreement extending their collaboration beyond 20-nanometer (nm) technology to deliver ARM processors on FinFET transistors, enabling the fabless industry to extend its market leadership in application processors. The collaboration will optimize the next generation of 64-bit ARM® processors based on the ARMv8 architecture, ARM Artisan® physical...

ST. PETERS, Mo., July 6, 2012 /PRNewswire/ -- MEMC Electronic Materials, Inc. (NYSE: WFR) announced today the introduction of MEMC FOX-Si, an innovative and cost-effective silicon wafer designed specifically for delivering advanced FinFET technology with oxide dielectric isolation (FOX). A key approach for designing transistors below 32 nanometers is a "fin-based" multigate design, or FinFET, in which the conducting channel is wrapped by a thin silicon "fin" forming the body of the...

HSINCHU, Taiwan, June 29, 2012 /PRNewswire-Asia/ -- United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that it has licensed IBM technology to expedite the development of the foundry's next generation 20nm CMOS process with FinFET 3D transistors. Under the terms of the agreement, IBM will license its 20nm process design kit and FinFET technology to UMC so the foundry can use these technologies in order to...