Last updated on April 18, 2014 at 13:57 EDT

Latest NEXX Systems Stories

2012-02-23 05:00:00

BILLERICA, Mass., Feb. 23, 2012 /PRNewswire/ -- NEXX Systems, a leading provider of processing equipment for advanced wafer-level packaging applications, has been awarded a $42,765 Workforce Training Fund grant from the state of Massachusetts. The grant will provide training and professional development for more than 100 employees at NEXX Systems headquarters. NEXX will focus trainings on key areas like leadership and continuous process improvement. The leadership training will...

2012-01-02 05:00:00

BILLERICA, Mass. and HSIN-CHU, Taiwan, Jan. 2, 2012 /PRNewswire/ -- A leading advanced packaging equipment provider, NEXX Systems (NEXX) sold a 300mm Stratus electrochemical deposition (ECD) system to Powertech Technology (PTI), a major IC packaging and testing company headquartered in Taiwan. The Stratus will be used for copper pillar bumps and re-distribution layers in advanced packaging applications that enable portable intelligent devices, such as smart phones and tablet PCs. The...