Latest Printed circuit board Stories
The article describes new techniques that combine laser fabrication with conductive nanoparticle materials, allowing further miniaturization of electronic devices among other benefits. (PRWEB) May 22, 2013 Micro-hole drilling expert Potomac Photonics was recently featured in PCB Magazine's May issue that was centered on small hole formation and processing. Potomac's article Looking Outside the Hole: the Evolution of Via Drilling explained a new laser fabrication process developed...
Custom-made surface-mount and insert-mount lead frames from Photofabrication Engineering (PEI) are flexible, strong, burr-free and stress-free. Single- and double-sided lead frames that are too complex to be manufactured by traditional metal stamping methods can be fabricated quickly and easily using photochemical machining. Milford, MA (PRWEB) May 21, 2013 Photofabrication Engineering (PEI) manufactures a complete line of custom, photochemically-etched surface-mount and insert-mount...
New Offerings to the High Reliability Hermetic Seal Series Provides Wider Temperature Margin GREENVILLE, S.C., May 14, 2013 /PRNewswire/ -- KEMET Corporation (NYSE: KEM), a leading manufacturer of tantalum, ceramic, aluminum, film, paper and electrolytic capacitors, today announced the expansion of its High Reliability Hermetic Seal product line to include the high temperature solder option. This option indicates an internal construction solder with a minimum melting point of +221...
The High Density Packaging (HDP) User Group headquartered in the United States announces that Elite Material Co., Ltd. (EMC) has become its newest member. Cave Creek, AZ (PRWEB) May 08, 2013 The High Density Packaging (HDP) User Group headquartered in the United States announces that Elite Material Co., Ltd. (EMC) has become its newest member. EMC is committed to developing innovative Printed Circuit Board (PCB) base materials with its halogen-free technology which are in line with future...
Today, Pcbaclone.com, the company specializing in reverse research technology, has been given the rank among the topmost companies in the reverse technology industry. (PRWEB) May 02, 2013 Today, Pcbaclone.com, the company specializing in reverse research technology, has been given the rank among the topmost companies in the reverse technology industry. The company is known for offering high end PCB designing and cloning services. It can develop electronic devices copy, chip crack and copy...
Kyzen has joined High Density Packaging User Group and is collaborating on the Electro-Chemical Migration (ECM) project. The ECM project is focusing on increasing reliability of electronic products by improving cleanliness test methods used in the assembly process. Cave Creek, Arizona (PRWEB) March 23, 2013 The High Density Packaging (HDP) User Group headquartered in the United States announces that Kyzen Corporation has become its newest member. Kyzen has committed to developing new and...
An alloy that may improve high-temperature electronics in oil and geothermal wells was really a solution in search of a problem. Sandia National Laboratories first investigated the gold-silver-germanium alloy about 15 years ago as a possible bonding material in a new neutron tube product. But a design change forced Sandia to shelve the material, said Paul Vianco, who has worked in soldering and brazing technology at Sandia for 26 years. Then a few years ago, researchers working on other...
Jim will be overseeing Prime’s engineering group, including facilities, manufacturing and front end (quoting, documentation control). Suwanee, GA (PRWEB) March 12, 2013 Prime Technological Services, a leading contract manufacturer of high mix, high complexity, printed circuit boards and electronic assemblies, is pleased to announce the hiring of Jim Liptak as Engineering Manager. Jim comes to Prime with over 30 years of experience in technology, electronics and electronics assembly....
Tramonto Circuits, a worldwide provider of flexible and rigid printed circuit boards & assembly has expanded its assembly department due to increased business. (PRWEB) February 14, 2013 The newly renovated space is three times larger than the previous space, allowing for increased staff and equipment. John Talbot, Director of Sales & Engineering, says “Growth and improvement prompted us to make the change. We added staff in 2012 to accommodate the growth in the assembly portion...
LEHIGH VALLEY, Pa., Feb. 11, 2013 /PRNewswire/ -- Air Products (NYSE: APD) will highlight advances in its proprietary electron attachment (EA) technology for soldering applications at the IPC APEX Expo in San Diego, Calif., from February 19-21. IPC APEX attendees can stop by Air Products Booth #2708 to learn about the advantages of EA activated hydrogen over plasma-based and flux-based processes for cleaning soldering surfaces during electronics assembly and packaging. These...
