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Latest QFN Stories

2011-04-14 04:00:00

REDWOOD CITY, Calif., April 14, 2011 /PRNewswire/ -- EoPlex Technologies, Inc. announced that its new xLC(TM) substrate, for Quad Flat No Lead semiconductor packages(QFNs),enables packaging companies to produce a "super QFN" with hundreds of leads and multiple rows at a lower cost than conventional packages. QFNs are the fastest growing packaging segment; however, they cannot be used in many applications due to the limitations imposed by the metal leadframe that is used to build them. The...

2010-11-09 06:45:00

FREMONT, Calif., and MUNICH, Nov. 9, 2010 /PRNewswire/ -- electronica 2010 -- Exar Corporation (Nasdaq: EXAR), released two industry first UARTs with integrated level shifters. With a maximum data rate of 24 Mbps, the XR16M890 and XR20M1280 are the industry's fastest UARTs with 8-bit/VLIO and I2C/SPI interfaces, respectively. These devices are the latest additions to Exar's market proven 8-bit/VLIO and I2C/SPI family of products. These new offerings are targeted toward a cross-section of...

2010-10-14 04:00:00

REDWOOD CITY, Calif., Oct. 14 /PRNewswire/ -- EoPlex, Inc. today announced availability of its new high performance, clean-tech lead carrier for semiconductor packaging. The product, known as EoPlex xLC(TM), is a cost-effective replacement for the lead frames currently used in QFN (Quad Flat No Lead) type packages. QFNs are the fastest growing packaging segment, because they typically are the smallest and least expensive package. However, conventional QFN lead frames are limited in...

2010-09-22 05:00:00

OAKLAND, Calif., Sept. 22 /PRNewswire/ -- RJR Polymers, a leading developer of high performance semiconductor packaging, announced today that it will maintain a high profile at this year's European Microwave Week, the leading conference in Europe for microwave, RF, wireless and radar technology held September 28 through October 1 at CNIT in Paris. As part of its plans, the company will exhibit the latest advances in its revolutionary Liquid Crystal Polymer (LCP) semiconductor packaging...

2010-05-24 07:00:00

OAKLAND, Calif., May 24 /PRNewswire/ -- RJR Polymers, a leading developer of high performance air cavity semiconductor packaging, announced today the newest generation of its innovative Liquid Crystal Polymer (LCP) technology. Offering a low-cost, highly flexible alternative to traditional ceramic and over molded packaging options, RJR's LCP air cavity packaging technology delivers a high degree of electrical isolation to the silicon die in a modular assembly process that supports the use...

2010-03-11 04:00:00

REDWOOD CITY, Calif., March 11 /PRNewswire/ -- EoPlex Technologies, the company that produces complex electronic components in a high-speed, low-cost, clean tech process, has co-authored a paper with its customer, STMicroelectronics, the world's fifth largest semi-conductor company. The paper, entitled "High Performance and Cost Effective Molded Array Package Substrate," was presented yesterday by EoPlex Vice President, Philip Rogren, for the Annual Device Packaging Conference of IMAPS...

2009-07-20 06:00:00

HONG KONG, DONGGUAN, China and MILPITAS, Calif., July 20 /PRNewswire-FirstCall/ -- ASAT Limited, a subsidiary of ASAT Holdings Limited (OTC Bulletin Board: ASTTY), a global provider of semiconductor package design, assembly and test services, today announced that it has entered into a cross licensing agreement with Unisem (M) Berhad that will allow each company to manufacture and market the other company's key advanced leadless packaging technologies. The packaging technologies included in...

2009-06-15 08:00:00

Single-chip SWIFT(TM) point-of-load device for telecom and computing systems supports up to 17 V; 60 percent smaller package than multi-chip converters DALLAS, June 15 /PRNewswire/ -- Extending its family of easy-to-use SWIFT(TM) power management integrated circuits (ICs), Texas Instruments (TI) (NYSE: TXN) today introduced the industry's smallest single-chip, 6-A, 17-V step-down synchronous switcher with integrated FETs. The high-performance TPS54620 is 60 percent smaller than today's...

2008-10-14 09:00:14

Semtech Corp. (Nasdaq: SMTC), a leading supplier of analog and mixed-signal semiconductors, today announced the SX1501 platform of GPIO expanders that come in 4-, 8-, and 16-channels of I/Os operating with a VDD range of 1.2V to 5.5V. The devices connect easily to today's low core voltage chipsets in battery powered handheld applications without the need for level translating circuits. Each channel of the true bi-directional style of I/O offers mask programmable interrupts, programmable...


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