Quantcast

Latest Quad Flat Package Stories

2011-02-08 14:00:00

BRISTOL, Pa. Feb. 8, 2011 /PRNewswire/ -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers a line of adapters which convert TSSOP, QFP and other fine pitch devices to any other fine-pitch bumped package or routing configuration down to 0.4mm pitch. (Photo: http://photos.prnewswire.com/prnh/20110208/PH44366 ) These unique Fine Pitch Bump Adapters are mounted to the existing PCB via raised pads up to 0.010" (0.25...

2008-11-10 15:00:22

ASAT Holdings, a provider of semiconductor package design, assembly and test services, has entered into an agreement to license Amkor's FusionQuad package technology. This agreement will enable ASAT to manufacture packages based on Amkor's FusionQuad technology platform. Jim Fusaro, corporate vice president of wirebond products at Amkor, said: "The market has been seeking a low cost package technology to better serve applications in the 150 to 350 pin count range. We believe FusionQuad...


Word of the Day
snash
  • To talk saucily.
  • Insolent, opprobrious language; impertinent abuse.
This word is Scots in origin and probably imitative.