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Latest Semiconductor device fabrication Stories

2014-10-21 08:44:06

SmartNIL(TM) large-area soft nanoimprint lithography process for high-volume manufacturing provides unmatched throughput and cost-of-ownership advantages over competing NIL approaches ST. FLORIAN, Austria, Oct. 21, 2014 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced its SmartNIL(TM) large-area nanoimprint lithography (NIL) process. Available on all EV Group NIL platforms,...

2014-10-21 08:42:09

DUBLIN, Oct. 21, 2014 /PRNewswire/ -- Research and Markets has announced the addition of the "Global 3D IC Market 2014-2018" report to their offering. http://photos.prnewswire.com/prnvar/20130307/600769 A 3D IC is an IC with multiple layers (more than two) of active electronic components which are integrated into a single circuit. These layers are integrated both vertically and horizontally. 3D ICs are the perfect solution for meeting the growing demand to minimize the size and reduce the...

2014-10-21 08:41:11

System Will Be Used To Support Major Capacity Expansion BEVERLY, Mass., Oct. 21, 2014 /PRNewswire/ -- Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced a new order for the Company's Purion XE(TM) single wafer, high energy implanter from a prominent chipmaker in the Asia Pacific region. The Purion XE will be used in high volume production of DRAM devices. The system is scheduled to ship in...

2014-10-21 08:41:01

ZHUHAI, China, Oct. 21, 2014 /PRNewswire/ -- Actions Semiconductor® Co., Ltd. (Nasdaq: ACTS), one of China's leading fabless semiconductor companies that provides comprehensive portable multimedia and mobile internet system-on-a-chip (SoC) solutions for portable consumer electronics, today announced that it debuted its latest innovative 28nm process based quad-core application processor offering for the tablet and OTT set-top box markets at Global Sources' China Sourcing Fair -...

2014-10-20 08:37:11

Acquisition Enables GLOBALFOUNDRIES to Become a World Leader in Semiconductor Foundry Technology; ARMONK, N.Y. and SANTA CLARA, Calif., Oct. 20, 2014 /PRNewswire/ -- IBM (NYSE: IBM) and GLOBALFOUNDRIES today announced that they have signed a Definitive Agreement under which GLOBALFOUNDRIES plans to acquire IBM's global commercial semiconductor technology business, including intellectual property, world-class technologists and technologies related to IBM Microelectronics, subject to...

2014-10-14 16:22:42

LONDON, Oct. 14, 2014 /PRNewswire/ -- The global chemical vapor deposition (CVD) market is expected to increase from $5 billion in 2014 to nearly $6.8 billion by the end of 2019, a compound annual growth rate (CAGR) of 6.3% for the five-year period, 2014 to 2019. This report provides:An overview of the global markets for thin-layer deposition technologies, including chemical vapor deposition (CVD), ion implementation and epitaxy.Analyses of global market trends, with data from 2013,...

2014-10-14 08:41:25

Extends copper wire production into high reliability applications including automotive and industrial DALLAS, Oct. 14, 2014 /PRNewswire/ -- Texas Instruments (TI) (NASDAQ: TXN) today announced it has shipped more than 22 billion units of copper wire bonding technology from its internal assembly sites and is now in production for major high reliability applications including automotive and industrial. The majority of TI's existing analog and CMOS silicon technology nodes have been qualified...

2014-10-13 20:22:22

LONDON, Oct. 13, 2014 /PRNewswire/ -- Flip chips are appearing in a plethora of high-volume consumer products such as mobile phones, digital cameras, MP3 players, and computer peripherals. Wafer-level packaging (WLP), the fabrication of the package directly on the wafer, is experiencing exceptional growth and stands out as one of the bright growth areas in electronics today. WLP offers lower cost, a smaller package, higher performance and added functionality compared to older methods....

2014-10-09 16:29:47

DALLAS, October 9, 2014 /PRNewswire/ -- The wafer foundry market experienced a wavy development, jumping by 39.4% in 2010 following a 7.9% decline in 2009. And the growth rate first shrank to 8.7% in 2011, then expanded to 21.7% in 2012, and fell back to 6.8% in 2013. It is projected that the growth rate will stand at 15.6% in 2014 and 6.0% in 2015. The fluctuation in the wafer foundry market will begin to present an increasingly small growth rate, which is mainly because of...

2014-10-09 08:32:14

SAN JOSE, Calif., Oct. 9, 2014 /PRNewswire/-- Monolithic Power Systems (MPS) (Nasdaq: MPWR), a leading fabless manufacturer of high-performance analog and mixed-signal semiconductors, today announced plans to report its financial results for the third quarter ended September 30, 2014. MPS will host its quarterly teleconference on:Monday, October 27(th) at 2:00 p.m. PT / 5:00 p.m. ET This call will be webcast live for all investors and archived on the company's website at...


Latest Semiconductor device fabrication Reference Libraries

24_4ef309736f760441603afe03433e193d
2010-09-02 16:42:23

A chip, also known as an integrated circuit, is a miniaturized electronic circuit consisting mainly of semiconductor devices and passive components, that has been manufactured in the surface of a thin substrate of semiconductor material. There are many different types of chips: microcircuit, microchip, silicon chip, etc. Integrated circuits are regularly used in present-day electronic equipment and have modernized the world of electronics. Computers, cellular phones, and other electronic...

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Word of the Day
abrosia
  • Wasting away as a result of abstinence from food.
The word 'abrosia' comes from a Greek roots meaning 'not' and 'eating'.