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Latest Semiconductor device fabrication Stories

2014-10-29 12:24:20

Global Adhesive Pastes and Films Market in Semiconductor Packaging Industry 2012-2017: Trends, Forecast, and Opportunity Analysis IRVING, Texas, Oct. 29, 2014 /PRNewswire-iReach/ -- Adhesive pastes and films are used for three basic applications in semiconductor devices: dicing, back-grinding, and die-attachment. The Asia Pacific region is expected to be the largest region of the global adhesive pastes and films market in the semiconductor packaging industry by 2017. Integrated circuits are...

2014-10-28 08:40:44

High voltage ICs provide robust performance for land-line applications used in home and office HSINCHU, Taiwan, MUNICH and NEUBIBERG, Germany, Oct. 28, 2014 /PR Newswire/ -- United Microelectronics Corporation (NYSE: UMC; TSE: 2303) ("UMC"), a leading global semiconductor foundry, and Lantiq, a leading supplier of broadband access and home networking technologies, today announced that UMC has entered volume production for Lantiq's SPT170 high voltage Power Management ICs (PMIC) used...

2014-10-27 08:34:17

SHANGHAI, Oct. 27, 2014 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) the largest and most advanced pure-play foundry provider in China, and ASML Holding N.V. ("ASML"), the world's leading provider of lithography systems, announce the signing of a volume purchase agreement (VPA) that will provide SMIC with lithography systems from ASML. The VPA which is worth approximately 450 million Euros and is part of a strategic partnership...

2014-10-24 23:00:13

With ValuSeal IonX ions are bygones in semiconductor and microelectronics manufacturining facilities. The ValuSeal IonX wiper is the perfect solution to protect applications from the dangers of ionic contamination. Great Barrington, MA (PRWEB) October 25, 2014 Berkshire Corporation, the world leader in contamination control products, is pleased to announce the release of the ValuSeal® IonX™ cleanroom wiper, designed to achieve the highest level of contamination containment in...

2014-10-23 04:23:06

Bluetooth RF IP silicon proven and in customer usage SHANGHAI, Oct. 23, 2014 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC", NYSE: SMI, SEHK: 981) and Maxscend Technologies Inc., a RF IP company based in China, announced that Maxscend Bluetooth RF IP has been silicon proven on SMIC's 55nm Low Leakage (LL) logic process. This IP has now been integrated into one of SMIC customers' product tape-out. The silicon proven Bluetooth RF IP is the result of a...

2014-10-21 08:44:06

SmartNIL(TM) large-area soft nanoimprint lithography process for high-volume manufacturing provides unmatched throughput and cost-of-ownership advantages over competing NIL approaches ST. FLORIAN, Austria, Oct. 21, 2014 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced its SmartNIL(TM) large-area nanoimprint lithography (NIL) process. Available on all EV Group NIL platforms,...

2014-10-21 08:42:09

DUBLIN, Oct. 21, 2014 /PRNewswire/ -- Research and Markets has announced the addition of the "Global 3D IC Market 2014-2018" report to their offering. http://photos.prnewswire.com/prnvar/20130307/600769 A 3D IC is an IC with multiple layers (more than two) of active electronic components which are integrated into a single circuit. These layers are integrated both vertically and horizontally. 3D ICs are the perfect solution for meeting the growing demand to minimize the size and reduce the...

2014-10-21 08:41:11

System Will Be Used To Support Major Capacity Expansion BEVERLY, Mass., Oct. 21, 2014 /PRNewswire/ -- Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced a new order for the Company's Purion XE(TM) single wafer, high energy implanter from a prominent chipmaker in the Asia Pacific region. The Purion XE will be used in high volume production of DRAM devices. The system is scheduled to ship in...

2014-10-21 08:41:01

ZHUHAI, China, Oct. 21, 2014 /PRNewswire/ -- Actions Semiconductor® Co., Ltd. (Nasdaq: ACTS), one of China's leading fabless semiconductor companies that provides comprehensive portable multimedia and mobile internet system-on-a-chip (SoC) solutions for portable consumer electronics, today announced that it debuted its latest innovative 28nm process based quad-core application processor offering for the tablet and OTT set-top box markets at Global Sources' China Sourcing Fair -...

2014-10-20 08:37:11

Acquisition Enables GLOBALFOUNDRIES to Become a World Leader in Semiconductor Foundry Technology; ARMONK, N.Y. and SANTA CLARA, Calif., Oct. 20, 2014 /PRNewswire/ -- IBM (NYSE: IBM) and GLOBALFOUNDRIES today announced that they have signed a Definitive Agreement under which GLOBALFOUNDRIES plans to acquire IBM's global commercial semiconductor technology business, including intellectual property, world-class technologists and technologies related to IBM Microelectronics, subject to...


Latest Semiconductor device fabrication Reference Libraries

24_4ef309736f760441603afe03433e193d
2010-09-02 16:42:23

A chip, also known as an integrated circuit, is a miniaturized electronic circuit consisting mainly of semiconductor devices and passive components, that has been manufactured in the surface of a thin substrate of semiconductor material. There are many different types of chips: microcircuit, microchip, silicon chip, etc. Integrated circuits are regularly used in present-day electronic equipment and have modernized the world of electronics. Computers, cellular phones, and other electronic...

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