Latest Silicon on insulator Stories
BERNIN, France, February 4, 2013 /PRNewswire/ -- Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, has estimated that its engineered substrates used in manufacturing semiconductors for mobile communications are incorporated in at least 50 percent of smart phones and internet-connected tablet computers being produced today. The widespread use of Soitec's materials technology in...
SAN DIEGO, December 20, 2012 /PRNewswire/ -- Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, announced today the grand opening of its North American solar manufacturing facility in San Diego. Less than one year after the facility was acquired by Soitec, the factory is equipped with a state-of-the-art automated production line and is operational. The concentrator photovoltaic...
BERNIN, France, October 9, 2012 /PRNewswire/ -- New Agreement Expands Global SOI Wafer Supply To Meet Growing Market Demand In Consumer Applications Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, and Shin-Etsu Handotai Co., Ltd (SEH), the world leader in the manufacturing of silicon wafers today announced a Smart Cut(TM) licensing extension and expanded technology...
ST. FLORIAN, Austria, Oct. 9, 2012 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Shenyang Silicon Technology Co. Ltd. (SST) has successfully installed an EVG850LT 300-mm, low-temperature automated production bonding system for silicon-on-insulator (SOI) materials. The China-U.S. joint-venture SOI wafer provider selected the 300-mm bonder as a follow-on to its...
SAN FRANCISCO, July 10, 2012 /PRNewswire/ -- SEMICON West -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that its GEMINI(®) Automated Wafer Bonding System has become the first product to pass a systematic, rigorous Equipment Maturity Assessment (EMA) implemented within SEMATECH's 3D Interconnect program and ISMI's EMA team. The assessments of several critical 3D tools, announced...
BERNIN, France and CHONGQING, China, July 9, 2012 /PRNewswire/ -- Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, and Chongqing Silian Optoelectronics Science & Technology Co., Ltd. (Silian), an established supplier of materials, devices and systems for the lighting industry, have partnered to jointly develop gallium nitride (GaN) template wafers using hydride vapor phase...
ST. PETERS, Mo., July 6, 2012 /PRNewswire/ -- MEMC Electronic Materials, Inc. (NYSE: WFR) announced today the introduction of MEMC FOX-Si, an innovative and cost-effective silicon wafer designed specifically for delivering advanced FinFET technology with oxide dielectric isolation (FOX). A key approach for designing transistors below 32 nanometers is a "fin-based" multigate design, or FinFET, in which the conducting channel is wrapped by a thin silicon "fin" forming the body of the...
ST. FLORIAN, Austria, July 3, 2012 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG(®)850TB/DB automated temporary bonding and debonding system built on the company's new XT Frame platform, which has been optimized to support thin-wafer processing for high-volume 3D IC and TSV (through silicon via) manufacturing. A combination of hardware and software...
ST. FLORIAN, Austria, May 24, 2012 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that for the first time, its customers have ranked EVG as one of VLSIresearch's top five 10 BEST Focused Suppliers of Chip Making Equipment companies in the market research firm's extensive customer satisfaction survey results for 2012. EVG was also awarded third place in...
BERNIN, France and PEABODY, Massachusetts, April 16, 2012 /PRNewswire/ -- With chip makers racing to develop the next generation of faster, more power-efficient processors - and the market demanding they do it more quickly than ever despite soaring development costs - Soitec (Euronext) announced today [http://soitec.com/en/news/press-releases ] a comprehensive product roadmap centered on fully depleted (FD) silicon technology starting at 28nm and extending down to the 10nm...
