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Latest Silicon on insulator Stories

2010-10-19 08:00:00

DRESDEN, Germany, Oct. 19 /PRNewswire/ -- SEMICON EUROPA -- EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced the latest addition to its industry-leading EVG500 Series of permanent wafer bonding systems. The new three-chamber EVG520L3 wafer bonding system builds on the series' proven strengths in temperature control, piston force...

2010-10-13 10:56:00

COPENHAGEN, Denmark, Oct. 13 /PRNewswire/ -- NNT CONFERENCE -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled a new technology capability that enables ultra-high-resolution patterning of features down to 12.5 nm: Soft Molecular Scale Nanoimprint Lithography (SMS-NIL). Based on EVG's proven UV-NIL systems, SMS-NIL provides customers with a repeatable, cost-effective process for producing...

2010-09-09 11:06:00

BERNIN, France, September 9, 2010 /PRNewswire-FirstCall/ -- Soitec (Euronext Paris), the world's leading supplier of silicon-on-insulator (SOI) and advanced solutions for the electronics and energy industries, announced today that the company has appointed Francis Taroni to the position of Senior Vice President, Industrial Operations. In keeping with the group's continuing growth and expanding operations, Taroni will develop and implement the most appropriate industrial organization for...

2010-08-23 08:14:00

DALLAS, August 23, 2010 /PRNewswire/ -- The Global Silicon-on-Insulator (SOI) Market ( http://www.marketsandmarkets.com/Market-Reports/global-silicon-on-insulator-m arket-158.html) (2010 -2015) report sizes and analyzes the global markets for SOI wafers types and applications over the period 2010-2015. The report studies the major market drivers, restraints, and opportunities for the global SOI market. Browse comprehensive market data tables and in-depth TOC on Global SOI Market....

2010-07-13 00:03:00

SEMICON WEST TRADE SHOW, SAN FRANCISCO, July 13, 2010 /PRNewswire-FirstCall/ -- The Soitec Group (Euronext Paris), the world's leading supplier of engineered substrates for the microelectronics industry, announced today that the company is ready with the Ultra-Thin Buried Oxide (UTBOX) extension to its Ultra-Thin (UT) silicon-on-insulator (SOI) platform, thereby providing a robust substrate solution for chip designers tackling the performance, power and density challenges of mobile...

2010-07-12 08:00:00

ST. FLORIAN, Austria, July 12 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has introduced the EVG560HBL wafer bonder -- the industry's first fully automated wafer bonding system for high-brightness light emitting diode (HB-LED) manufacturing. The system features a new design for multi-substrate bonding and is capable of throughput rates of an unprecedented 160...

2010-05-31 08:00:00

ST. FLORIAN, Austria, May 31 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that world-renowned research institute, Fraunhofer IZM-ASSID, has placed an order for two EVG temporary bonding and debonding (TB/DB) systems for thin-wafer handling and processing for 3D ICs. ASSID (All Silicon System Integration Dresden), a new project group of Fraunhofer IZM, will use EVG's...

2010-03-30 09:33:00

ST. FLORIAN, Austria, March 30 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Morocco-based wafer-level camera manufacturer Nemotek Technologie has placed a repeat order for EVG's bonding and UV nanoimprint lithography (UV-NIL) systems - the EVG520IS and IQ Aligner. Nemotek will use these systems to address its production demands for CMOS image sensors and...

2010-03-16 02:03:00

BERNIN, France, March 16, 2010 /PRNewswire-FirstCall/ -- The Soitec Group (Euronext Paris), the world's leading supplier of engineered substrates for the microelectronics industry, announced today that the company has entered into an agreement to supply silicon-on-insulator (SOI) substrates to CSMC Technologies Corporation ("CSMC"), a leading pure-play specialty analog foundry based in China. Soitec is sampling SOI substrates for High Voltage (HV) and CMOS applications initially aimed at...

2010-03-02 08:00:00

St. Florian, Austria, March 2 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has shipped two wafer bonding systems to the University of Michigan's Lurie Nanofabrication Facility (LNF)--a leading center for MEMS and microsystems research and an integral member of the National Nanotechnology Infrastructure Network (NNIN), which is supported by the National Science...


Word of the Day
attercop
  • A spider.
  • Figuratively, a peevish, testy, ill-natured person.
'Attercop' comes from the Old English 'atorcoppe,' where 'atter' means 'poison, venom' and‎ 'cop' means 'spider.' 'Coppa' is a derivative of 'cop,' top, summit, round head, or 'copp,' cup, vessel, which refers to 'the supposed venomous properties of spiders,' says the OED. 'Copp' is still found in the word 'cobweb.'
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