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Latest Silicon on insulator Stories

2010-11-03 16:28:00

BERNIN, France, November 3, 2010 /PRNewswire-FirstCall/ -- - Confirmation That MEMC Infringed one Soitec's SOI Patent - Ruling Supportive to Overall Claim Against MEMC Soitec successfully obtained confirmation from Court that MEMC did infringe one of Soitec's SOI patents from end of 2004 until mid 2006 and now believes it has adequate grounds to claim for compensation. Concurrently, the Court ruled that only 15 early-stage Soitec prototype BSOI wafers did infringe one claim...

2010-11-03 07:30:00

ST. PETERS, Mo., Nov. 3, 2010 /PRNewswire/ -- MEMC Electronic Materials, Inc. (NYSE: WFR) announced today that it has received a successful outcome in its litigation with Soitec regarding Silicon On Insulator (SOI) wafers. As a result, MEMC continues to have complete freedom to produce and sell SOI wafers using MEMC's current processes. "We are pleased with the court's ruling that MEMC's current SOI processes do not infringe on the Soitec patents asserted in this litigation," said Brad...

2010-10-19 08:00:00

DRESDEN, Germany, Oct. 19 /PRNewswire/ -- SEMICON EUROPA - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced receipt of its first order from the Fraunhofer Research Institution for Electronic Nano Systems ENAS (Chemnitz, Germany). Fraunhofer ENAS purchased an EVG6200NT automated mask aligner and an EVG540 automated wafer bonder, and will employ the flexible, multi-process EVG systems for...

2010-10-19 08:00:00

DRESDEN, Germany, Oct. 19 /PRNewswire/ -- SEMICON EUROPA -- EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced the latest addition to its industry-leading EVG500 Series of permanent wafer bonding systems. The new three-chamber EVG520L3 wafer bonding system builds on the series' proven strengths in temperature control, piston force...

2010-10-13 10:56:00

COPENHAGEN, Denmark, Oct. 13 /PRNewswire/ -- NNT CONFERENCE -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled a new technology capability that enables ultra-high-resolution patterning of features down to 12.5 nm: Soft Molecular Scale Nanoimprint Lithography (SMS-NIL). Based on EVG's proven UV-NIL systems, SMS-NIL provides customers with a repeatable, cost-effective process for producing...

2010-09-09 11:06:00

BERNIN, France, September 9, 2010 /PRNewswire-FirstCall/ -- Soitec (Euronext Paris), the world's leading supplier of silicon-on-insulator (SOI) and advanced solutions for the electronics and energy industries, announced today that the company has appointed Francis Taroni to the position of Senior Vice President, Industrial Operations. In keeping with the group's continuing growth and expanding operations, Taroni will develop and implement the most appropriate industrial organization for...

2010-08-23 08:14:00

DALLAS, August 23, 2010 /PRNewswire/ -- The Global Silicon-on-Insulator (SOI) Market ( http://www.marketsandmarkets.com/Market-Reports/global-silicon-on-insulator-m arket-158.html) (2010 -2015) report sizes and analyzes the global markets for SOI wafers types and applications over the period 2010-2015. The report studies the major market drivers, restraints, and opportunities for the global SOI market. Browse comprehensive market data tables and in-depth TOC on Global SOI Market....

2010-07-13 00:03:00

SEMICON WEST TRADE SHOW, SAN FRANCISCO, July 13, 2010 /PRNewswire-FirstCall/ -- The Soitec Group (Euronext Paris), the world's leading supplier of engineered substrates for the microelectronics industry, announced today that the company is ready with the Ultra-Thin Buried Oxide (UTBOX) extension to its Ultra-Thin (UT) silicon-on-insulator (SOI) platform, thereby providing a robust substrate solution for chip designers tackling the performance, power and density challenges of mobile...

2010-07-12 08:00:00

ST. FLORIAN, Austria, July 12 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has introduced the EVG560HBL wafer bonder -- the industry's first fully automated wafer bonding system for high-brightness light emitting diode (HB-LED) manufacturing. The system features a new design for multi-substrate bonding and is capable of throughput rates of an unprecedented 160...

2010-05-31 08:00:00

ST. FLORIAN, Austria, May 31 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that world-renowned research institute, Fraunhofer IZM-ASSID, has placed an order for two EVG temporary bonding and debonding (TB/DB) systems for thin-wafer handling and processing for 3D ICs. ASSID (All Silicon System Integration Dresden), a new project group of Fraunhofer IZM, will use EVG's...


Word of the Day
grass-comber
  • A landsman who is making his first voyage at sea; a novice who enters naval service from rural life.
According to the OED, a grass-comber is also 'a sailor's term for one who has been a farm-labourer.'