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Latest Silicon on insulator Stories

2009-10-06 02:00:00

DRESDEN, Germany, Oct. 6 /PRNewswire/ -- SEMICON Europa 2009 -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has completed the installation of two automated fusion bonding systems for 300-mm wafers at a leading semiconductor foundry and at a major consumer electronics manufacturer. The GEMINI® FB automated production fusion bonding systems will be employed...

2009-09-18 09:13:00

EAST FISHKILL, N.Y., Sept. 18 /PRNewswire-FirstCall/ -- IBM (NYSE: IBM) has successfully developed a prototype of the semiconductor industry's smallest, densest and fastest on-chip dynamic memory device in next-generation, 32-nanometer, silicon-on-insulator (SOI) technology that can offer improved speed, power savings and reliability for products ranging from servers to consumer electronics. (Logo: http://www.newscom.com/cgi-bin/prnh/20090416/IBMLOGO ) IBM's SOI technology can provide...

2009-07-28 12:00:00

MARINA DEL REY, Calif., July 28 /PRNewswire/ -- The MOSIS Service, a leading provider of semiconductor fabrication solutions, today announced that it has expanded its relationship with IBM to now include silicon-on-insulator (SOI) technology at multiple advanced lithography nodes. MOSIS is offering IBM's 45-nm SOI technology on 300mm wafers and IBM's 180-nm SOI technology on 200mm wafers. MOSIS customers now have a low-cost route to prototyping and low-volume production with leading-edge...

2009-07-22 05:00:00

BOSTON, Massachusetts, July 22 /PRNewswire/ -- The SOI Industry Consortium (http://www.soiconsortium.org/) today announced the launch of SOI Simply Greener, an initiative encouraging broader application of the energy saving benefits of silicon-on-insulator (SOI) technology by the electronics industry. Semiconductor chips manufactured on SOI instead of traditional bulk silicon can realize energy savings of 30% or more when designed with the same feature size at equivalent performance....

2009-07-16 08:00:00

St. Florian, Austria, July 16 /PRNewswire/ -- EV Group (EVG) today announced a joint effort with Applied Materials, Inc. to develop wafer bonding processes for the manufacture of through-silicon vias (TSVs) in three-dimensional integrated circuit (3D IC) packaging applications. The two companies will be working together as members of the EMC-3D Semiconductor 3D Equipment and Materials Consortium. Growing consumer demand for smaller, lower-power electronic devices with greater...

2009-07-13 11:09:00

SAN FRANCISCO, July 13 /PRNewswire-FirstCall/ -- The Soitec Group (Euronext Paris), the world's leading supplier of silicon-on-insulator (SOI) and other engineered substrates for the microelectronics industry, announced today its strategy for solving technology challenges in the growing wafer-level 3D integration market with a family of proven processes and engineered substrates. The company has the combination of core technology know-how in wafer bonding and stacking, manufacturing...

2009-06-17 08:00:00

BOSTON, Massachusetts, June 17 /PRNewswire/ -- The SOI Industry Consortium, an international group aimed at accelerating broad adoption of silicon-on-insulator (SOI) materials technology across semiconductor markets, announced today that it is reinforcing its academic and research support with the additions of three prestigious universities at the forefront of SOI applied research. Stanford University, University of California, Berkeley and Ritsumeikan University, Kyoto, Japan have all...

2009-06-15 11:42:00

BERNIN, France, June 15 /PRNewswire/ -- The Soitec Group (Euronext Paris), the world's leading supplier of engineered substrates for the microelectronics industry, announced today that its 300mm ultra-thin SOI (UTSOI) wafer platform is qualified and ready to support fully depleted (FD) device applications scheduled on the industry's CMOS roadmaps for 22nm and beyond. Soitec introduced its 300mm UTSOI wafer platform, fabricated using the company's patented Smart Cut(TM) technology, at...

2009-06-09 08:00:00

Product Redesign Provides R&D Institutions and Universities with Superior Wafer Bonding Technology at an Affordable Cost ST. FLORIAN, Austria, June 9 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has launched an all-new EVG501 wafer bonding system to address rising cost burdens for its university and R&D customers. Redesigned based on customer feedback, the...

2009-06-04 12:00:00

Company Makes Continued Inroads in High-Volume Manufacturing Market ST. FLORIAN, Austria, June 4 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that EPCOS - a leading electronic components, modules and systems manufacturer - selected EVG's fully automated GEMINI wafer bonder for high-volume RF components production at EPCOS's production facility based in Munich, Germany....


Word of the Day
omphalos
  • The navel or umbilicus.
  • In Greek archaeology: A central boss, as on a shield, a bowl, etc.
  • A sacred stone in the temple of Apollo at Delphi, believed by the Greeks to mark the 'navel' or exact center-point of the earth.
'Omphalos' comes from the ancient Greek.
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