Latest Silicon on insulator Stories
HUDSON, N.H., Dec. 14 /PRNewswire/ -- Vectron International, a leader in the design, manufacture and marketing of Frequency Control, Sensor, and Hybrid Product solutions, today announced its new solution for the timing of ultra high-temperature electronics, the PX-420 crystal oscillator.
TOKYO, December 1 /PRNewswire-FirstCall/ -- The Soitec Group (Euronext, Paris), the world's leading supplier of engineered substrates for the microelectronics industry, and CEA-Leti, a leading global research center committed to creating and commercializing innovation in micro- and nanotechnologies, today announced plans to expand their collaboration on wafer-to-wafer 3D integration by offering customers a joint, comprehensive industrial solution.
BOSTON, Massuchessetts, November 12 /PRNewswire/ -- The SOI Industry Consortium, aimed at accelerating silicon-on-insulator (SOI) innovation into broad markets, announced today that Mentor Graphics Corporation (Nasdaq: MENT) has joined the worldwide organization.
BOSTON, Massachusetts, October 21 /PRNewswire/ -- The SOI Industry Consortium today announced the results of a silicon-on-insulator (SOI) and bulk FinFETs comparison study conducted by the organization with the support of some of its key members.
BOSTON, Massachusetts, October 13 /PRNewswire/ -- The SOI Industry Consortium today announced an initiative to deliver a silicon on insulator (SOI) educational event in conjunction with ARM TechCon3 to help the electronics industry reap the benefits of SOI.
DRESDEN, Germany, Oct.
EAST FISHKILL, N.Y., Sept.
MARINA DEL REY, Calif., July 28 /PRNewswire/ -- The MOSIS Service, a leading provider of semiconductor fabrication solutions, today announced that it has expanded its relationship with IBM to now include silicon-on-insulator (SOI) technology at multiple advanced lithography nodes.
BOSTON, Massachusetts, July 22 /PRNewswire/ -- The SOI Industry Consortium (http://www.soiconsortium.org/) today announced the launch of SOI Simply Greener, an initiative encouraging broader application of the energy saving benefits of silicon-on-insulator (SOI) technology by the electronics industry.
St. Florian, Austria, July 16 /PRNewswire/ -- EV Group (EVG) today announced a joint effort with Applied Materials, Inc. to develop wafer bonding processes for the manufacture of through-silicon vias (TSVs) in three-dimensional integrated circuit (3D IC) packaging applications.
- totally perplexed and mixed up.