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Latest Silicon on insulator Stories

2009-07-16 08:00:00

St. Florian, Austria, July 16 /PRNewswire/ -- EV Group (EVG) today announced a joint effort with Applied Materials, Inc. to develop wafer bonding processes for the manufacture of through-silicon vias (TSVs) in three-dimensional integrated circuit (3D IC) packaging applications. The two companies will be working together as members of the EMC-3D Semiconductor 3D Equipment and Materials Consortium. Growing consumer demand for smaller, lower-power electronic devices with greater...

2009-07-13 11:09:00

SAN FRANCISCO, July 13 /PRNewswire-FirstCall/ -- The Soitec Group (Euronext Paris), the world's leading supplier of silicon-on-insulator (SOI) and other engineered substrates for the microelectronics industry, announced today its strategy for solving technology challenges in the growing wafer-level 3D integration market with a family of proven processes and engineered substrates. The company has the combination of core technology know-how in wafer bonding and stacking, manufacturing...

2009-06-17 08:00:00

BOSTON, Massachusetts, June 17 /PRNewswire/ -- The SOI Industry Consortium, an international group aimed at accelerating broad adoption of silicon-on-insulator (SOI) materials technology across semiconductor markets, announced today that it is reinforcing its academic and research support with the additions of three prestigious universities at the forefront of SOI applied research. Stanford University, University of California, Berkeley and Ritsumeikan University, Kyoto, Japan have all...

2009-06-15 11:42:00

BERNIN, France, June 15 /PRNewswire/ -- The Soitec Group (Euronext Paris), the world's leading supplier of engineered substrates for the microelectronics industry, announced today that its 300mm ultra-thin SOI (UTSOI) wafer platform is qualified and ready to support fully depleted (FD) device applications scheduled on the industry's CMOS roadmaps for 22nm and beyond. Soitec introduced its 300mm UTSOI wafer platform, fabricated using the company's patented Smart Cut(TM) technology, at...

2009-06-09 08:00:00

Product Redesign Provides R&D Institutions and Universities with Superior Wafer Bonding Technology at an Affordable Cost ST. FLORIAN, Austria, June 9 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has launched an all-new EVG501 wafer bonding system to address rising cost burdens for its university and R&D customers. Redesigned based on customer feedback, the...

2009-06-04 12:00:00

Company Makes Continued Inroads in High-Volume Manufacturing Market ST. FLORIAN, Austria, June 4 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that EPCOS - a leading electronic components, modules and systems manufacturer - selected EVG's fully automated GEMINI wafer bonder for high-volume RF components production at EPCOS's production facility based in Munich, Germany....

2009-05-13 12:59:00

ST and Soitec cooperation will lead to backside-illumination (BSI) product manufacturing for mobile consumer markets GRENOBLE, France, May 13 /PRNewswire-FirstCall/ -- STMicroelectronics (NYSE: STM), one of the world's leading semiconductor companies and a world leader in CMOS imaging technology, and Soitec (Euronext: SOI), the world's leading supplier of engineered substrates, today announced an exclusive joint cooperation between the two companies that will lead to the development of...

2009-04-08 11:00:00

BERNIN, France, April 8 /PRNewswire/ -- Soitec (Euronext Paris), the world's leading supplier of silicon-on insulator (SOI) wafers and other engineered substrates used for the microelectronics industry, today announced that the company has made key appointments to its sales team, who will drive its worldwide strategy and focus more closely on customer collaboration. Thomas Piliszczuk was named senior vice-president of worldwide sales, and Christophe Maleville was promoted to...

2009-04-08 06:55:00

SAN JOSE, Calif., April 8 /PRNewswire/ -- WRS Materials President, Richard Mee, announces the acquisition of Isonics Semiconductor Group (Vancouver, WA). This acquisition makes WRS the only fully integrated secondary silicon materials manager in the U.S. Mr. Mee explains that the goal was only partly to gain economies of scale: "Our vision is to better serve the semiconductor and solar industries with the widest possible silicon inventory, to develop an expanded engineering and sales team,...

2009-04-01 08:00:00

ST. FLORIAN, Austria, April 1 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has entered a joint development program (JDP) with CEA/Leti -- one of Europe's renowned research labs focusing on microelectronics and nanotechnology. EVG, an early leader in through-silicon-via (TSV) and 3D integration technology, will provide CEA/Leti with its world-class, 300-mm temporary...


Word of the Day
Cthulhu
  • A gigantic fictional humanoid alien god being described with a head resembling an octopus and dragon wings and claws, around whom an insane cult developed.
  • Pertaining to the mythos of Cthulhu and additional otherworldly beings created by H. P. Lovecraft or inspired by his writings and imitators.
This word was invented in 1926 by H.P. Lovecraft for his short story, 'The Call of Cthulhu.' 'Cthulhu' may be based on the word 'chthonic,' which in Greek mythology refers to the underworld.
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