Latest Silicon on insulator Stories

2009-07-28 12:00:00

MARINA DEL REY, Calif., July 28 /PRNewswire/ -- The MOSIS Service, a leading provider of semiconductor fabrication solutions, today announced that it has expanded its relationship with IBM to now include silicon-on-insulator (SOI) technology at multiple advanced lithography nodes.

2009-07-22 05:00:00

BOSTON, Massachusetts, July 22 /PRNewswire/ -- The SOI Industry Consortium (http://www.soiconsortium.org/) today announced the launch of SOI Simply Greener, an initiative encouraging broader application of the energy saving benefits of silicon-on-insulator (SOI) technology by the electronics industry.

2009-07-16 08:00:00

St. Florian, Austria, July 16 /PRNewswire/ -- EV Group (EVG) today announced a joint effort with Applied Materials, Inc. to develop wafer bonding processes for the manufacture of through-silicon vias (TSVs) in three-dimensional integrated circuit (3D IC) packaging applications.

2009-07-13 11:09:00

SAN FRANCISCO, July 13 /PRNewswire-FirstCall/ -- The Soitec Group (Euronext Paris), the world's leading supplier of silicon-on-insulator (SOI) and other engineered substrates for the microelectronics industry, announced today its strategy for solving technology challenges in the growing wafer-level 3D integration market with a family of proven processes and engineered substrates.

2009-06-17 08:00:00

BOSTON, Massachusetts, June 17 /PRNewswire/ -- The SOI Industry Consortium, an international group aimed at accelerating broad adoption of silicon-on-insulator (SOI) materials technology across semiconductor markets, announced today that it is reinforcing its academic and research support with the additions of three prestigious universities at the forefront of SOI applied research.

2009-06-15 11:42:00

BERNIN, France, June 15 /PRNewswire/ -- The Soitec Group (Euronext Paris), the world's leading supplier of engineered substrates for the microelectronics industry, announced today that its 300mm ultra-thin SOI (UTSOI) wafer platform is qualified and ready to support fully depleted (FD) device applications scheduled on the industry's CMOS roadmaps for 22nm and beyond.

2009-06-09 08:00:00

Product Redesign Provides R&D Institutions and Universities with Superior Wafer Bonding Technology at an Affordable Cost ST.

2009-06-04 12:00:00

Company Makes Continued Inroads in High-Volume Manufacturing Market ST.

2009-05-13 12:59:00

ST and Soitec cooperation will lead to backside-illumination (BSI) product manufacturing for mobile consumer markets GRENOBLE, France, May 13 /PRNewswire-FirstCall/ -- STMicroelectronics (NYSE: STM), one of the world's leading semiconductor companies and a world leader in CMOS imaging technology, and Soitec (Euronext: SOI), the world's leading supplier of engineered substrates, today announced an exclusive joint cooperation between the two companies that will lead to the development of...

2009-04-08 11:00:00

BERNIN, France, April 8 /PRNewswire/ -- Soitec (Euronext Paris), the world's leading supplier of silicon-on insulator (SOI) wafers and other engineered substrates used for the microelectronics industry, today announced that the company has made key appointments to its sales team, who will drive its worldwide strategy and focus more closely on customer collaboration. Thomas Piliszczuk was named senior vice-president of worldwide sales, and Christophe Maleville was promoted to vice-president,...

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