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Latest Small-outline integrated circuit Stories

2014-06-12 23:05:24

The total System in Package (SiP) market is estimated to reach $18.10 billion by 2020 at a higher single digit CAGR from 2013 to 2020. (http://www.marketsandmarkets.com/Market-Reports/System-In-Package-SIP-Market-Chip-Stack-Multi-Chip-Module-MCM-Market-625.html) (PRWEB) June 12, 2014 According to a new market research report "System in Package (SiP) Market by Technology (2D, 2.5D & 3D), Type (BGA, SMT, QFP, SOP), Interconnection Technology (Flip-Chip & Wire-bond),...

2014-06-01 23:00:47

System in Package market research report categorizes the “System in Package Market” on the basis of different packaging technology, packaging type, interconnection technology, applications, and geographical analysis, forecasting revenue, and analyzing trends in the market. (http://www.marketsandmarkets.com/Market-Reports/System-In-Package-SIP-Market-Chip-Stack-Multi-Chip-Module-MCM-Market-625.html) (PRWEB) June 01, 2014 According to a new market research report "System in Package...

2014-05-21 23:11:15

System in Package (SiP) Market research report categorizes global market on the basis of different packaging technology, packaging type, interconnection technology, applications, and geographical analysis, forecasting revenue, and analyzing trends in the market. (http://www.marketsandmarkets.com/Market-Reports/System-In-Package-SIP-Market-Chip-Stack-Multi-Chip-Module-MCM-Market-625.html) (PRWEB) May 21, 2014 According to a new market research report "System in Package (SiP) Market by...

2014-04-30 16:35:25

DALLAS, May 1, 2014 /PRNewswire/ -- According to a new market research report "System in Package (SiP) Market by Technology (2D, 2.5D & 3D), Type (BGA, SMT, QFP, SOP), Interconnection Technology (Flip-Chip & Wire-bond), Applications (Communications, Consumer, Automotive, Medical) and Geography (N. America, Europe, APAC & ROW) - Global Trends & Forecasts to - 2014 - 2020", published by MarketsandMarkets, the total System in Package (SiP) market is expected to...

2013-12-18 23:01:27

The FT25C08A and FT25C32A are Two New Members of the Serial Peripheral Interface Family of Serial EEPROM Integrated Circuits Fremont, CA (PRWEB) December 18, 2013 Fremont Micro Devices USA Inc. today announced the FT25C08A and FT25C32A Serial EEPROM integrated circuits. The 8k-bit and 32k-bit devices are two additional members of the Family of Serial Peripheral Interface (SPI) non volatile memories which includes the FT25C16A and FT25C64A, 16k-bit and 64k-bit memory densities. The SPI...

2013-10-01 23:04:26

The FT25160A and FT25640A are the First Two Members of the Serial Peripheral Interface Family of Serial EEPROM Integrated Circuits Fremont, CA (PRWEB) October 01, 2013 Fremont Micro Devices USA Inc. today announced the FT25160A and FT25640A Serial EEPROM integrated Circuits. They are the first two members of the Family of Serial Peripheral Interface (SPI) non volatile memories which will include memory densities from 2k-bit to 512k-bit arrays. The new devices are specified to operate...

2011-06-09 16:58:00

IEPER, Belgium, June 9, 2011 /PRNewswire-FirstCall/ -- Melexis, the pioneer in programmable linear Hall sensors launches its third product generation. This new family breaks with the conventional "single-in-line-package" (SIP) approach since they require more careful design consideration to avoid mounting, space, EMI, reliability and cost penalties at the system level. The new Melexis programmable linear Hall ICs are surface-mount devices (SMD) supporting the trend for improved...


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  • A blustering, bullying fellow; a pot-valiant braggart; a bully.
This word is named for Draw-Can-Sir, a character in George Villiers' 17th century play The Rehearsal.
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