Latest Smart Cut Stories
BERNIN, France, February 4, 2013 /PRNewswire/ -- Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, has estimated that its engineered substrates used in manufacturing semiconductors for mobile communications are incorporated in at least 50 percent of smart phones and internet-connected tablet computers being produced today. The widespread use of Soitec's materials technology in...
SAN DIEGO, December 20, 2012 /PRNewswire/ -- Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, announced today the grand opening of its North American solar manufacturing facility in San Diego. Less than one year after the facility was acquired by Soitec, the factory is equipped with a state-of-the-art automated production line and is operational. The concentrator photovoltaic...
BERNIN, France, October 9, 2012 /PRNewswire/ -- New Agreement Expands Global SOI Wafer Supply To Meet Growing Market Demand In Consumer Applications Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, and Shin-Etsu Handotai Co., Ltd (SEH), the world leader in the manufacturing of silicon wafers today announced a Smart Cut(TM) licensing extension and expanded technology...
SAN FRANCISCO, Calif., July 11, 2011 /PRNewswire/ -- SEMICON WEST -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the semiconductor industry's first bonding system for 450-mm-diameter wafers manufactured from silicon-on-insulator (SOI) substrates. Building on EVG's leadership in SOI wafer bonding, the new system - dubbed the EVG850SOI/450 mm - was created to support and facilitate the...
BERNIN, France, February 22, 2011 /PRNewswire-FirstCall/ -- Soitec (Euronext Paris), the world's leading supplier of silicon-on-insulator (SOI) and advanced solutions for the electronics and energy industries, today announced the appointment of Steve Longoria to Senior Vice President Worldwide Strategic Business Development. An industry veteran with extensive experience and a proven track record primarily at IBM Microelectronics, Longoria joins Soitec's leadership team with...
BERNIN, France and TOKYO, November 30, 2010 /PRNewswire-FirstCall/ -- Soitec, the world's leading supplier of engineered substrates and Sumitomo Electric Industries, Ltd., a leading worldwide provider of compound semiconductor materials, announced today they are working together to develop engineered gallium nitride (GaN) substrates. The alliance will draw on Sumitomo Electric's sophisticated GaN wafer manufacturing technology and Soitec's unique Smart Cut(TM) layer transfer technology...
BERNIN, France, November 3, 2010 /PRNewswire-FirstCall/ -- - Confirmation That MEMC Infringed one Soitec's SOI Patent - Ruling Supportive to Overall Claim Against MEMC Soitec successfully obtained confirmation from Court that MEMC did infringe one of Soitec's SOI patents from end of 2004 until mid 2006 and now believes it has adequate grounds to claim for compensation. Concurrently, the Court ruled that only 15 early-stage Soitec prototype BSOI wafers did infringe one...
BERNIN, France, September 9, 2010 /PRNewswire-FirstCall/ -- Soitec (Euronext Paris), the world's leading supplier of silicon-on-insulator (SOI) and advanced solutions for the electronics and energy industries, announced today that the company has appointed Francis Taroni to the position of Senior Vice President, Industrial Operations. In keeping with the group's continuing growth and expanding operations, Taroni will develop and implement the most appropriate industrial organization for...
SEMICON WEST TRADE SHOW, SAN FRANCISCO, July 13, 2010 /PRNewswire-FirstCall/ -- The Soitec Group (Euronext Paris), the world's leading supplier of engineered substrates for the microelectronics industry, announced today that the company is ready with the Ultra-Thin Buried Oxide (UTBOX) extension to its Ultra-Thin (UT) silicon-on-insulator (SOI) platform, thereby providing a robust substrate solution for chip designers tackling the performance, power and density challenges of mobile...
BERNIN, France, March 16, 2010 /PRNewswire-FirstCall/ -- The Soitec Group (Euronext Paris), the world's leading supplier of engineered substrates for the microelectronics industry, announced today that the company has entered into an agreement to supply silicon-on-insulator (SOI) substrates to CSMC Technologies Corporation ("CSMC"), a leading pure-play specialty analog foundry based in China. Soitec is sampling SOI substrates for High Voltage (HV) and CMOS applications initially aimed...
