Latest Smart Cut Stories

2011-07-11 08:00:00

SAN FRANCISCO, Calif., July 11, 2011 /PRNewswire/ -- SEMICON WEST -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the semiconductor industry's first bonding system for 450-mm-diameter wafers manufactured from silicon-on-insulator (SOI) substrates. Building on EVG's leadership in SOI wafer bonding, the new system - dubbed the EVG850SOI/450 mm - was created to support and facilitate the...

2011-02-22 11:06:00

BERNIN, France, February 22, 2011 /PRNewswire-FirstCall/ -- Soitec (Euronext Paris), the world's leading supplier of silicon-on-insulator (SOI) and advanced solutions for the electronics and energy industries, today announced the appointment of Steve Longoria to Senior Vice President Worldwide Strategic Business Development. An industry veteran with extensive experience and a proven track record primarily at IBM Microelectronics, Longoria joins Soitec's leadership team with responsibility...

2010-11-30 12:27:00

BERNIN, France and TOKYO, November 30, 2010 /PRNewswire-FirstCall/ -- Soitec, the world's leading supplier of engineered substrates and Sumitomo Electric Industries, Ltd., a leading worldwide provider of compound semiconductor materials, announced today they are working together to develop engineered gallium nitride (GaN) substrates. The alliance will draw on Sumitomo Electric's sophisticated GaN wafer manufacturing technology and Soitec's unique Smart Cut(TM) layer transfer technology by...

2010-11-03 16:28:00

BERNIN, France, November 3, 2010 /PRNewswire-FirstCall/ -- - Confirmation That MEMC Infringed one Soitec's SOI Patent - Ruling Supportive to Overall Claim Against MEMC Soitec successfully obtained confirmation from Court that MEMC did infringe one of Soitec's SOI patents from end of 2004 until mid 2006 and now believes it has adequate grounds to claim for compensation. Concurrently, the Court ruled that only 15 early-stage Soitec prototype BSOI wafers did infringe one claim...

Word of the Day
  • Having so marked an appearance as easily to be recognized.
This word may come from the Swedish 'kanspak,' quick at recognizing persons or things, or else from confusion with 'conspicuous.'