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Latest Smart Cut Stories

2010-11-30 12:27:00

BERNIN, France and TOKYO, November 30, 2010 /PRNewswire-FirstCall/ -- Soitec, the world's leading supplier of engineered substrates and Sumitomo Electric Industries, Ltd., a leading worldwide provider of compound semiconductor materials, announced today they are working together to develop engineered gallium nitride (GaN) substrates. The alliance will draw on Sumitomo Electric's sophisticated GaN wafer manufacturing technology and Soitec's unique Smart Cut(TM) layer transfer technology by...

2010-11-03 16:28:00

BERNIN, France, November 3, 2010 /PRNewswire-FirstCall/ -- - Confirmation That MEMC Infringed one Soitec's SOI Patent - Ruling Supportive to Overall Claim Against MEMC Soitec successfully obtained confirmation from Court that MEMC did infringe one of Soitec's SOI patents from end of 2004 until mid 2006 and now believes it has adequate grounds to claim for compensation. Concurrently, the Court ruled that only 15 early-stage Soitec prototype BSOI wafers did infringe one claim...

2010-09-09 11:06:00

BERNIN, France, September 9, 2010 /PRNewswire-FirstCall/ -- Soitec (Euronext Paris), the world's leading supplier of silicon-on-insulator (SOI) and advanced solutions for the electronics and energy industries, announced today that the company has appointed Francis Taroni to the position of Senior Vice President, Industrial Operations. In keeping with the group's continuing growth and expanding operations, Taroni will develop and implement the most appropriate industrial organization for...

2010-07-13 00:03:00

SEMICON WEST TRADE SHOW, SAN FRANCISCO, July 13, 2010 /PRNewswire-FirstCall/ -- The Soitec Group (Euronext Paris), the world's leading supplier of engineered substrates for the microelectronics industry, announced today that the company is ready with the Ultra-Thin Buried Oxide (UTBOX) extension to its Ultra-Thin (UT) silicon-on-insulator (SOI) platform, thereby providing a robust substrate solution for chip designers tackling the performance, power and density challenges of mobile...

2010-03-16 02:03:00

BERNIN, France, March 16, 2010 /PRNewswire-FirstCall/ -- The Soitec Group (Euronext Paris), the world's leading supplier of engineered substrates for the microelectronics industry, announced today that the company has entered into an agreement to supply silicon-on-insulator (SOI) substrates to CSMC Technologies Corporation ("CSMC"), a leading pure-play specialty analog foundry based in China. Soitec is sampling SOI substrates for High Voltage (HV) and CMOS applications initially aimed at...

2010-02-16 11:00:00

BERNIN, France, February 16, 2010 /PRNewswire-FirstCall/ -- The Soitec Group (Euronext Paris), the world's leading supplier of engineered substrates for the microelectronics industry, announced today volume production of its new generation of state-of-the-art high-resistivity (HR) silicon-on-insulator (SOI) substrates to serve the growing cellular phone and Wi-Fi markets. Soitec recently completed qualification at major customers for volume production in response to their rapidly growing...

2009-12-01 01:36:00

TOKYO, December 1 /PRNewswire-FirstCall/ -- The Soitec Group (Euronext, Paris), the world's leading supplier of engineered substrates for the microelectronics industry, and CEA-Leti, a leading global research center committed to creating and commercializing innovation in micro- and nanotechnologies, today announced plans to expand their collaboration on wafer-to-wafer 3D integration by offering customers a joint, comprehensive industrial solution. The global offer envisioned by the...

2009-07-13 11:09:00

SAN FRANCISCO, July 13 /PRNewswire-FirstCall/ -- The Soitec Group (Euronext Paris), the world's leading supplier of silicon-on-insulator (SOI) and other engineered substrates for the microelectronics industry, announced today its strategy for solving technology challenges in the growing wafer-level 3D integration market with a family of proven processes and engineered substrates. The company has the combination of core technology know-how in wafer bonding and stacking, manufacturing...

2009-06-15 11:42:00

BERNIN, France, June 15 /PRNewswire/ -- The Soitec Group (Euronext Paris), the world's leading supplier of engineered substrates for the microelectronics industry, announced today that its 300mm ultra-thin SOI (UTSOI) wafer platform is qualified and ready to support fully depleted (FD) device applications scheduled on the industry's CMOS roadmaps for 22nm and beyond. Soitec introduced its 300mm UTSOI wafer platform, fabricated using the company's patented Smart Cut(TM) technology, at...

2009-05-13 12:59:00

ST and Soitec cooperation will lead to backside-illumination (BSI) product manufacturing for mobile consumer markets GRENOBLE, France, May 13 /PRNewswire-FirstCall/ -- STMicroelectronics (NYSE: STM), one of the world's leading semiconductor companies and a world leader in CMOS imaging technology, and Soitec (Euronext: SOI), the world's leading supplier of engineered substrates, today announced an exclusive joint cooperation between the two companies that will lead to the development of...


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