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Last updated on April 16, 2014 at 1:21 EDT

Latest SSMC Stories

2011-01-13 02:30:00

SANTA CLARA, Calif. and HSINCHU, Taiwan, Jan. 13, 2011 /PRNewswire/ -- NVIDIA (NASDAQ: NVDA) and TSMC (TWSE: 2330, NYSE: TSM) today celebrated the shipment of the one-billionth GeForce graphics processor designed by NVIDIA and manufactured by TSMC. Today's announcement is a testament to the popularity of GeForce graphics processors, which are recognized worldwide for exceptional performance in games, video, and nearly all forms of 3D content. Today nearly every major PC manufacturer...

2010-12-09 11:00:00

SAN JOSE, Calif., Dec. 9, 2010 /PRNewswire/ -- TSMC (TWSE: 2330, NYSE: TSM) will receive eSilicon Corporation's "Supplier of the Year Award" during a ceremony at an eSilicon-hosted dinner on December 9. eSilicon presents the award annually to their supply chain partner who has demonstrated excellence in collaborating with the company and its customers through industry-leading products, services and support. "eSilicon has been a long-time partner and a key VCA (Value Chain Aggregator)...

2010-10-05 03:30:00

HSINCHU, Taiwan, R.O.C., Oct. 5 /PRNewswire/ -- TSMC (TWSE: 2330, NYSE: TSM) today expanded its IP Alliance to incorporate a soft IP program that will improve soft IP readiness for advanced technology nodes and drive earlier time-to-market. TSMC is expected to provide specific design documents and technology information through the program so that partners can optimize their soft IP to TSMC's technology. TSMC will also collaborate with these companies to expedite soft IP readiness by...

2010-06-30 03:30:00

HSINCHU, Taiwan, R.O.C., June 30 /PRNewswire-FirstCall/ -- Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that its 0.25-micron One-Time-Programmable (OTP) IP now meets Automotive Electronics Council (AEC) standard AEC-Q100 specification. The IP is fully compatible with TSMC Bipolar-CMOS- DMOS (BCD), mixed signal/analog and standard CMOS logic processes and does not require additional processing steps, making it an ideal System-on-Chip (SoC)...

2010-06-15 04:00:00

HSINCHU, Taiwan, R.O.C., June 15 /PRNewswire-FirstCall/ -- Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today introduced the first Slim Library that reduces system-on-chip (SoC) routed logic block area by 15 percent compared to blocks routed through current standard cell libraries. The library targets TSMC's 65nm LP process technology and fits existing implementation flows for easy adoption. Designers can use the new Slim Library in existing or new designs...

2010-06-08 21:31:00

In the news release, TSMC Unveils Two New Reference Flows, issued 08-Jun-2010 by Taiwan Semiconductor Manufacturing Company, Ltd. over PR Newswire, we are advised by the company that the list of EDA partners in the ninth paragraph should include SpringSoft, which was inadvertently excluded when originally issued. The complete, corrected release follows: TSMC Unveils Two New Reference Flows Reference Flow 11.0 hosts systems level design methodology; AMS Reference Flow 1.0 Addresses Key...

2010-06-08 03:30:00

HSINCHU, Taiwan, June 8 /PRNewswire-FirstCall/ -- Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today introduced Reference Flow 11.0 and Analog/Mixed Signal (AMS) Reference Flow 1.0. Both are key collaborative components of TSMC's recently-announced extension of its Open Innovation Platform(TM). Reference Flow 11.0, focuses on Electronic System Level (ESL) design, SoC Interconnect Fabric, and two dimensional and three dimensional integrated circuits (2-D/3-D...

2010-06-07 03:30:00

HSINCHU, Taiwan, June 7 /PRNewswire-FirstCall/ -- Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today extended its Open Innovation Platform(TM) with another focus on system-level design, analog/mixed-signal (AMS)/RF design and two-dimensional/three-dimensional integrated circuit (2-D/3-D IC) implementation. At the same time the company introduced the first three initiatives from the new focus. TSMC originally launched the Open Innovation Platform in 2008 as an...

2010-05-26 19:50:00

HSINCHU, Taiwan, R.O.C., May 26 /PRNewswire-FirstCall/ --Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced the 0.18-micron automotive Embedded Flash IP as its second generation Embedded Flash IP that passed AEC-Q100 product qualification requirements for a wide range of automotive applications. TSMC's 0.18-micron automotive Embedded Flash IP macro features 27 percent area reduction compared to an equivalent 0.25-micron Embedded Flash IP. The 0.18um...

2010-04-21 03:30:00

HSINCHU, Taiwan, R.O.C., April 21 /PRNewswire-FirstCall/ -- Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that it has shipped nearly 600,000 8-inch 0.25-micron AEC-Q100 grade 1 qualified embedded flash (EmbFlash) wafers targeted at a wide variety of automotive applications, accounting for over 720 million microcontrollers (MCUs). Some customers have achieved less-than 0.1 parts per million field failure rate in 2009. The less than 0.1 ppm...