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Last updated on April 16, 2014 at 17:34 EDT

Latest SSMC Stories

2010-04-13 12:30:00

SAN JOSE, Calif., April 13 /PRNewswire-FirstCall/ -- Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) announced today at its 2010 Technology Symposium that it will skip the 22nm manufacturing process node and move directly to a 20nm technology. The move is value driven to make advanced technology a more viable alternative for its customers. During his address to nearly 1,500 TSMC customers and third party alliances, Dr. Shang-yi Chiang, TSMC Senior Vice President,...

2010-04-06 03:30:00

HSINCHU, Taiwan, R.O.C., April 6 /PRNewswire-FirstCall/ -- Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) has made available several unified and interoperable electronic design automation (EDA) technology files for its 65 nanometer (nm), 40nm and 28nm process nodes. The design technology file suite includes interoperable process design kit (iPDK), interoperable design rule check (iDRC), layout-versus-schematic (iLVS), and interoperable interconnect extraction...

2010-02-23 02:30:00

KIRCHHEIM/TECK, Germany and HSINCHU, Taiwan, R.O.C., Feb. 23 /PRNewswire-FirstCall/ -- Dialog Semiconductor plc (FWB: DLG), a leading provider of highly integrated innovative power management semiconductor solutions, today announced that the company is working closely with foundry partner Taiwan Semiconductor Manufacturing Company (TWSE: 2330, NYSE: TSM) on a bipolar-CMOS-DMOS (BCD) technology specifically tailored to high-performance power management ICs for portable devices. The...

2010-02-21 18:30:00

VELDHOVEN, Netherlands and HSINCHU, Taiwan, R.O.C., Feb. 21 /PRNewswire-FirstCall/ -- ASML Holding NV (ASML) today announced that Taiwan Semiconductor Manufacturing Company (TWSE: 2330, NYSE: TSM) will take delivery of a TWINSCAN NXE:3100 extreme ultra-violet (EUV) lithography system. This tool represents one of six NXE:3100 EUV systems for ASML's worldwide partners and customers. TSMC is expected to be the first dedicated foundry conducting on-site EUV development and will install the...

2010-01-28 01:00:00

HSIN-CHU, Taiwan, Jan. 28 /PRNewswire-Asia-FirstCall/ -- TSMC (TAIEX: 2330; NYSE: TSM) today announced consolidated revenue of NT$92.09 billion, net income of NT$32.67 billion, and diluted earnings per share of NT$1.26 (US$0.19 per ADS unit) for the fourth quarter ended December 31, 2009. Year-over-year, fourth quarter revenue increased 42.6% while net income increased 162.5% and diluted EPS increased 162.7%. Compared to third quarter of 2009, fourth quarter results represent a 2.4%...

2010-01-06 02:00:00

HSINCHU, Taiwan, Jan. 6 /PRNewswire-FirstCall/ -- Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC) (TWSE: 2330, NYSE: TSM) today announced that LSI Corporation achieved over 25% overall leakage reduction in a next generation product by implementing TSMC's PowerTrim power optimization technology on the company's 65nm low power (LP) process. PowerTrim is a first-of-its-kind technology that blends a layer of design technology with advanced semiconductor processing to optimize a...

2009-11-27 02:00:00

HSINCHU, Taiwan, R.O.C., Nov. 27 /PRNewswire-FirstCall/ -- Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that it plans to launch the automotive industry's first process qualification specification and service package for automotive-grade semiconductor manufacturing at the China IC Design Conference being held in Xiamen on December 2. The company also announced that its Fab 10, located in Shanghai, is prepared to manufacture automotive grade...

2009-11-05 00:30:00

NEUBIBERG, Germany and HSINCHU, Taiwan, R.O.C., Nov. 5 /PRNewswire-FirstCall/ -- Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Taiwan Semiconductor Manufacturing Company (TWSE: 2330, NYSE: TSM) today announced that they are extending their development and production partnership to a 65nanometer (nm) embedded flash (eFlash) process technology targeting next generation automotive, chip card and security applications. Based on the agreement, Infineon and TSMC will jointly develop...

2009-08-26 23:01:00

TOKYO and HSIN-CHU, Taiwan, Aug. 27 /PRNewswire-FirstCall/ -- Fujitsu Microelectronics Limited and Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that they have agreed to collaborate on 28-nanometer (nm) process technology targeted for foundry production of Fujitsu Microelectronics' 28nm logic ICs and to jointly develop an enhanced 28nm high-performance process technology by utilizing TSMC's advanced technology platform. Previously, both companies...

2009-08-24 03:15:00

HSINCHU, Taiwan, R.O.C., Aug. 24 /PRNewswire-FirstCall/ -- Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) has become the first foundry not only to achieve 28nm functional 64Mb SRAM yield, but also to achieve it across all three 28nm nodes. "Achieving 64Mb SRAM yield across all three 28nm process nodes is striking. It is particularly noteworthy because this achievement demonstrates the manufacturing benefits of the gate-last approach that we developed for the...