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Latest SSMC Stories

2009-08-24 03:00:00

HSINCHU, Taiwan, R.O.C., Aug. 24 /PRNewswire-FirstCall/ -- Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that it is adding a low power process to its 28nm high-k metal gate (HKMG) road map. The new process is expected to enter risk production in the third quarter of 2010. TSMC's 28nm development and ramp has remained on schedule since the company announced the technology in September 2008. The new process' risk production follows the HKMG high...

2009-07-30 02:01:00

HSIN-CHU, Taiwan, July 30 /PRNewswire-Asia-FirstCall/ -- TSMC (TAIEX: 2330; NYSE: TSM) today announced consolidated revenue of NT$74.21 billion, net income of NT$24.44 billion, and diluted earnings per share of NT$0.94 (US$0.14 per ADS unit) for the second quarter ended June 30, 2009. Year-over-year, second quarter revenue decreased 15.8% while net income and diluted EPS decreased 15% and 13.9%, respectively. Compared to first quarter of 2009, second quarter results represent an...

2009-07-22 03:00:00

HSINCHU, Taiwan, July 22 /PRNewswire-FirstCall/ -- Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE:2330, NYSE: TSM) today unveiled Reference Flow 10.0, the latest version of its industry-leading design methodology to lower design obstacles, improve design margins, and increase yields. Reference Flow 10.0 is one of the key collaborative components of the Open Innovation Platform(TM). The newest generation of the company's reference flow continues the tradition of driving advances in...

2009-07-21 03:00:00

HSINCHU, Taiwan, R.O.C., July 21 /PRNewswire-FirstCall/ -- Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced the release of the semiconductor industry's first interoperable process design kit (iPDK) for advanced technology. The kit is fully validated on TSMC's 65 nanometer (nm) process and represents the newest design initiative to come from the company's Open Innovation Platform(TM), focusing on enhancing innovation in custom, analog, mixed-signal...

2009-07-21 03:00:00

HSINCHU, Taiwan, R.O.C., July 21 /PRNewswire-FirstCall/ -- Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today unveiled interoperable design rule check (iDRC) and layout-versus-schematic (iLVS), two unified electronic design automation (EDA) data formats, for TSMC 40 nanometer (nm) process technology. TSMC iDRC and iLVS formats unify process design rules specification and technology file generation, simplify data delivery, and ensure data integrity and...

2009-07-09 04:00:00

EINDHOVEN, The Netherlands and HSINCHU, Taiwan, R.O.C., July 9 /PRNewswire-FirstCall/ -- NXP Semiconductors and Taiwan Semiconductor Manufacturing Company, Ltd. (NYSE: TSM) (TWSE: 2330) today announced their cooperation to deliver the industry's first single-chip 45nm global LCD TV platform, TV550. With NXP already delivering the engineering samples to its lead customers, NXP and TSMC have reached a major milestone in enabling the next generation of mainstream digital TV sets for TV...

2009-07-05 23:01:00

HSINCHU, Taiwan and GRENOBLE, France, July 6 /PRNewswire-FirstCall/ -- TSMC (TWSE: 2330; NYSE: TSM) and CEA-Leti, the leading French semiconductor research institute, signed an agreement today in which TSMC will join the new industrial program IMAGINE, led by CEA-Leti, on maskless lithography for IC manufacturing. Intended to operate for three years, this program allows companies to assess a maskless lithography infrastructure for IC manufacturing and use MAPPER Technology as a solution...

2009-06-29 04:00:00

Area reduction and performance gain with slim platform for analog and power management system-on-chip applications HSINCHU, Taiwan, R.O.C., June 29 /PRNewswire-FirstCall/ -- Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that it has released an enhanced version of its 0.13-micron process to benefit customers' cost and competition and to enable the integration of power management functions. The 0.13-micron/0.11-micron family now includes a slim...

2009-05-27 14:03:00

New iRCX Format Ensure Data Accuracy and Enables Extensive EDA Support of Interconnect Modeling Related Applications in TSMC 65nm and 40nm HSINCHU, Taiwan, May 27 /PRNewswire-FirstCall/ -- Taiwan Semiconductor Manufacturing Company, Ltd. (TSE: 2330, NYSE: TSM) today unveiled iRCX, an interoperable electronic design automation (EDA) data format, for TSMC 65 nanometer (nm) and 40nm technologies. iRCX format unifies interconnect modeling data delivery, ensures data integrity and...

2009-04-21 03:00:00

Silicon-proven Reference Design Approach Accelerates RF Designs and Enables Systems-on-Chip Integration HSINCHU, Taiwan, April 21 /PRNewswire-FirstCall/ -- Taiwan Semiconductor Manufacturing Company, Ltd. (TSE: 2330; NYSE: TSM) today unveiled the foundry industry's first Mixed Signal/Radio Frequency Reference Design Kit (MS/RF RDK) at its North American Technology Symposium in San Jose. The RDK initially targets 65nm process technology and aims to accelerate analog, mixed-signal, and RF...


Word of the Day
bodacious
  • Remarkable; prodigious.
  • Audacious; gutsy.
  • Completely; extremely.
  • Audaciously; boldly.
  • Impressively great in size; enormous; extraordinary.
This word is probably from the dialectal 'boldacious,' a blend of 'bold' and 'audacious.'
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