Quantcast

Latest SUSS MicroTec Stories

2014-06-30 08:37:09

GEMINI®FB XT surpasses ITRS requirements for wafer bonding with up to 3X improvement in wafer-to-wafer alignment; enhanced productivity enables 50 percent increased throughput ST. FLORIAN, Austria, June 30, 2014 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the GEMINI(®)FB XT--its next-generation fusion wafer bonding platform, which combines several performance...

2014-04-23 04:22:23

DUBLIN, April 23, 2014 /PRNewswire/ -- Dublin - Research and Markets ( http://www.researchandmarkets.com/research/mn5dtf/led_frontend) has announced the addition of the "LED Front-End Equipment Market" [http://www.researchandmarkets.com/research/mn5dtf/led_frontend ] report to their offering. (Logo: http://photos.prnewswire.com/prnh/20130307/600769 ) THE NEXT INVESTMENT CYCLE HAS ALREADY STARTED Driven by the fanfare over (and overestimation of) the LCD...

2014-03-10 04:21:49

PHOENIX, March 10, 2014 /PRNewswire/ -- FlipChip International - (FCI), the global technology leader in flip chip bumping and Wafer Level Packaging announced they will give the following paper at the IMAPS - 10(th) International Conference and Exhibition on Device Packaging 2014 in Scottsdale Arizona, USA. http://photos.prnewswire.com/prnvar/20120306/LA64593LOGO-a Dielectric Laser Via Drilling for Next Generation Wafer Level Processing Jim Zaccardi, FlipChip International (Guy...

2014-02-08 23:01:33

ASML Holding N.V., Canon Inc., Nikon Corp., and NuFlare Technology Inc. are the key vendors analyzed in the report Global Lithography Systems Market 2014-2018. Dallas, Texas (PRWEB) February 08, 2014 The short replacement cycle of portable electronic devices is another major trend witnessed in the Global Lithography Systems market (http://www.sandlerresearch.org/global-lithography-systems-market-2014-2018.html). In the current scenario, portable electronic devices such as smartphones and...

2014-02-04 16:31:42

ReportsnReports.com adds Global Wafer-level Packaging Equipment Market 2014-2018 and Global Wafer Level Packaging Inspection Systems Market 2014-2018 research report to its store. DALLAS, Feb. 4, 2014 /PRNewswire-iReach/ -- To sustain the competition in the market, semiconductor manufacturers are continuously introducing innovative products, reducing manufacturing costs, and improving product efficiency. For instance, they have introduced chips that are available in smaller sizes; the sizes...

2013-11-24 23:02:55

Rolith, Inc., a leader in advanced nanostructured devices, is pleased to announce that Printed Electronics Industry selected Rolith for the Best Manufacturing Technology award based on its production of transparent metal mesh conductors for large touch screen displays, OLED lighting and photovoltaics. Pleasanton, CA (PRWEB) November 24, 2013 Each year the Printed Electronics industry recognizes and awards outstanding achievement to those involved in the rapidly growing printed electronics...

2013-03-07 00:20:07

Pleasanton, Ca., Mar 7, 2013 - (ACN Newswire) - Rolith, Inc., the leader in developing advanced nanostructured coatings and devices, today announces the successful installation of a 2nd-generation nanostructuring prototype tool built by SUSS MicroTec AG under exclusive license from Rolith, Inc. - the RML-2 tool. This prototype is based on a disruptive nanolithography method (Rolling Mask Lithography - RML(TM)) developed by Rolith, Inc. It enables users to create nanostructures over large...


Word of the Day
bodacious
  • Remarkable; prodigious.
  • Audacious; gutsy.
  • Completely; extremely.
  • Audaciously; boldly.
  • Impressively great in size; enormous; extraordinary.
This word is probably from the dialectal 'boldacious,' a blend of 'bold' and 'audacious.'
Related