Latest SUSS MicroTec Stories
ST. FLORIAN, Austria, March 13, 2013 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has installed a fully automated 300-mm system from EVG's Gemini(®) product family of integrated wafer bonding clusters to a leading Chinese semiconductor foundry. This customer will use the system for 3D IC integration and advanced packaging--two high-volume applications for...
Pleasanton, Ca., Mar 7, 2013 - (ACN Newswire) - Rolith, Inc., the leader in developing advanced nanostructured coatings and devices, today announces the successful installation of a 2nd-generation nanostructuring prototype tool built by SUSS MicroTec AG under exclusive license from Rolith, Inc. - the RML-2 tool. This prototype is based on a disruptive nanolithography method (Rolling Mask Lithography - RML(TM)) developed by Rolith, Inc. It enables users to create nanostructures over large...
ST. FLORIAN, Austria, March 5, 2013 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is developing equipment and process technology to enable covalent bonds at room temperature. This breakthrough technology will be available on a new equipment platform, called EVG580(®) ComBond(®), which will include process modules that are designed to perform surface...
Exclusive agreement with one of the world's largest glass companies to develop anti-reflective glass technology for architectural glass marketPleasanton, Ca., Jan 22, 2013 - (ACN Newswire) - Rolith, Inc., the leader in developing advanced nanostructured coatings and devices, today announces partnership with Asahi Glass Company (AGC), one of the world's largest glass manufacturers. The joint development agreement reflects a continued partnership between the two...
ST. FLORIAN, Austria and SAN MARCOS, Texas, Nov. 14, 2012 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has installed an EVG501 wafer bonding system at Texas State University. The highly flexible R&D system, which is configurable for a variety of wafer bonding processes, has been installed in the university's cleanroom facilities to support advanced...
ST. FLORIAN, Austria, Oct. 9, 2012 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Shenyang Silicon Technology Co. Ltd. (SST) has successfully installed an EVG850LT 300-mm, low-temperature automated production bonding system for silicon-on-insulator (SOI) materials. The China-U.S. joint-venture SOI wafer provider selected the 300-mm bonder as a follow-on to its...
SUSS MicroTec (FWB:SMH)(GER:SMH), supplier of innovative solutions for the 3D, MEMS, Advanced Packaging and Nanotechnology markets, announced today that it has shipped and successfully installed a Gamma coating cluster at Replisaurus Technologies, a provider of a revolutionary metallization technology called "ElectroChemical Pattern Replication" (ECPR(TM)), which offers a simple and cost effective integrated solution eliminating several traditional process steps thereby reducing complexity....
