Latest Tektronix Component Solutions Stories
BEAVERTON, Ore., June 28, 2011 /PRNewswire/ -- International communications and information technology company Harris Corporation (NYSE: HRS) and Tektronix Component Solutions, a custom microelectronics services provider, announced the strengthening of their long-standing relationship via the establishment of a strategic partnership agreement.
BEAVERTON, Ore., June 7, 2011 /PRNewswire/ -- Tektronix Component Solutions announced today the investment in five new Teradyne J750EX semiconductor test systems to allow screening of a wider variety of complex ASICs, increase test capacity and enable faster development of new test programs.
BEAVERTON, Ore., May 24, 2011 /PRNewswire/ -- Vanguard EMS and Tektronix Component Solutions have signed a Joint Marketing Agreement to formalize their collaboration and the joint offering of their capabilities to customers in the defense, aerospace, medical and industrial equipment markets.
ORLANDO, Fla., March 22, 2011 /PRNewswire/ -- GOMAC Tech11-- Maxtek Components Corporation, doing business as Tektronix Component Solutions, has been accredited by the U.S.
LOS ANGELES, March 8, 2011 /PRNewswire/ -- OFC/NFOEC -- Leveraging the RF expertise and core microwave technologies developed for Tektronix instruments, Tektronix Component Solutions is announcing two new high-performance microwave modules, the TDRO-900A and TSFB-900A.
LOS ANGELES, March 8, 2011 /PRNewswire/ -- OFC/NFOEC -- Tektronix Component Solutions announced today its new 30 GHz leadless chip carrier (LCC) packaging platform to meet the broadband performance requirements demanded by telecommunications systems and modules, military/aerospace applications, and terrestrial communications.
BEAVERTON, Ore., Jan. 5, 2011 /PRNewswire/ -- Tektronix Component Solutions announced today that its ASIC design and custom IC packaging services are now validated by IBM Corporation as "Ready for IBM Technology" on silicon germanium (SiGe) 5HP, 7HP, 7WL, and 8HP process technologies.
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