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Last updated on April 20, 2014 at 8:28 EDT

Latest Tektronix Component Solutions Stories

2013-03-18 08:20:54

25 GS/s Digital-to-Analog Converter Powers New Tektronix AWG70000; Ideal for Next-Generation Defense Electronics, Aerospace, Optical Systems BEAVERTON, Ore., March 18, 2013 /PRNewswire/ -- Tektronix Component Solutions today announced availability of the world's fastest, most accurate 10-bit commercial digital-to-analog converter (DAC). This 25 GS/s application-specific integrated circuit (ASIC) enables the market-leading performance of the new Tektronix AWG70000 arbitrary waveform...

2013-02-11 08:21:03

BEAVERTON, Ore., Feb. 11, 2013 /PRNewswire/ -- Tektronix Component Solutions today announced that its Beaverton, Ore. manufacturing facility and headquarters has been certified to the standards of AS9100 Rev C for commercial aerospace, defense and space industries. In July of last year, Tektronix Component Solutions' component test laboratory in Orlando, Fla. achieved the same certification. (Logo: http://photos.prnewswire.com/prnh/20130211/SF56646LOGO) AS9100 is a quality management...

2012-07-10 02:21:54

BEAVERTON, Ore., July 10, 2012 /PRNewswire/ -- Tektronix Component Solutions today announced that its Orlando, FL. component test facility has been certified to the standards of AS9100 Rev C for commercial aviation, space and defense industries. (Logo: http://photos.prnewswire.com/prnh/20101025/SF86755LOGO) AS9100 is a quality management system created specifically to address the demanding quality and reliability requirements of the aerospace industry. AS9100 Rev C goes above and...

2011-06-28 08:15:00

BEAVERTON, Ore., June 28, 2011 /PRNewswire/ -- International communications and information technology company Harris Corporation (NYSE: HRS) and Tektronix Component Solutions, a custom microelectronics services provider, announced the strengthening of their long-standing relationship via the establishment of a strategic partnership agreement. The mutually beneficial relationship is intended to enhance both organizations' ability to deliver greater value to mutual customers in the defense...

2011-06-07 08:10:00

BEAVERTON, Ore., June 7, 2011 /PRNewswire/ -- Tektronix Component Solutions announced today the investment in five new Teradyne J750EX semiconductor test systems to allow screening of a wider variety of complex ASICs, increase test capacity and enable faster development of new test programs. Reducing development time will improve time-to-test for customers and reduce development cost. (Logo: http://photos.prnewswire.com/prnh/20101025/SF86755LOGO) The addition of the popular Teradyne...

2011-05-24 05:30:00

BEAVERTON, Ore., May 24, 2011 /PRNewswire/ -- Vanguard EMS and Tektronix Component Solutions have signed a Joint Marketing Agreement to formalize their collaboration and the joint offering of their capabilities to customers in the defense, aerospace, medical and industrial equipment markets. While companies in these markets frequently seek to control costs through outsourced manufacturing, finding suitable suppliers can be challenging due to the high-complexity and high-reliability...

2011-03-22 08:30:00

ORLANDO, Fla., March 22, 2011 /PRNewswire/ -- GOMAC Tech11-- Maxtek Components Corporation, doing business as Tektronix Component Solutions, has been accredited by the U.S. Department of Defense (DOD), Defense Microelectronics Agency (DMEA) as a Category 1A Microelectronics Trusted Source for IC packaging/assembly and test services. The accreditation certifies that Tektronix Component Solutions meets stringent product control and security standards in providing trusted microelectronic...

2011-03-08 08:30:00

LOS ANGELES, March 8, 2011 /PRNewswire/ -- OFC/NFOEC -- Leveraging the RF expertise and core microwave technologies developed for Tektronix instruments, Tektronix Component Solutions is announcing two new high-performance microwave modules, the TDRO-900A and TSFB-900A. Originally designed to meet the demanding signal integrity and performance requirements of RF test equipment, these modules enable transmitter and receiver system designers to bring a higher level of precision to...

2011-03-08 08:30:00

LOS ANGELES, March 8, 2011 /PRNewswire/ -- OFC/NFOEC -- Tektronix Component Solutions announced today its new 30 GHz leadless chip carrier (LCC) packaging platform to meet the broadband performance requirements demanded by telecommunications systems and modules, military/aerospace applications, and terrestrial communications. The LCC provides customers a new, lower-cost Surface Mount Technology (SMT)-compatible device to meet the needs of these applications. (Logo:...

2011-01-05 08:30:00

BEAVERTON, Ore., Jan. 5, 2011 /PRNewswire/ -- Tektronix Component Solutions announced today that its ASIC design and custom IC packaging services are now validated by IBM Corporation as "Ready for IBM Technology" on silicon germanium (SiGe) 5HP, 7HP, 7WL, and 8HP process technologies. Receiving this validation demonstrates that Tektronix Component Solutions offers customers the expertise, value and reliability required for high-performance SiGe devices. (Logo:...