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Last updated on April 20, 2014 at 5:20 EDT

Latest The Linley Group Stories

2013-10-16 08:31:39

Scalable multi-core architecture delivers unrivalled performance and power efficiency for software-defined wireless infrastructure applications, targeting macrocells, small cells, cloud-RAN, Digital Front-End and backhaul MOUNTAIN VIEW, Calif., Oct. 16, 2013 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of DSP cores and platform solutions, today introduced the CEVA-XC4500 DSP - the world's first vector floating-point DSP specifically designed for advanced wireless...

2013-06-10 20:23:25

SANTA CLARA, Calif., June 10, 2013 /PRNewswire/ -- Tabula Inc., announced today that it will present at the Linley Group's Carrier Conference 2013 on Wednesday, June 12(th) at 3:05 p.m. The conference will be held June 12 and 13 at the Hyatt Regency Hotel in Santa Clara, California. The two-day, single-track event will cover carrier-equipment design for both wired and wireless infrastructure. Nupur Shah, director of applications for Tabula, will discuss the challenges faced by designers of...

2013-03-26 20:25:03

SUNNYVALE, Calif., March 26, 2013 /PRNewswire/ -- Who: Laurent Moll, Chief Technology Officer, Arteris, Inc., Moving Beyond Symmetric Multiprocessing in Converging Mobile, Consumer Electronics and Embedded Worlds What: The Linley Tech Mobile Conference is a two-day, single track event focused on the processors, components, and interconnects for data-center networking and servers....

2013-02-19 08:38:56

MOUNTAIN VIEW, Calif., Feb. 19, 2013 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced a suite of advanced processor and multi-core technologies to further enhance the CEVA-XC DSP architecture framework for high performance wireless applications including wireless terminals, small cells, access points, metro and macro base-stations. Among the new enhancements are: comprehensive multi-core...

2012-10-16 07:31:17

MOUNTAIN VIEW, Calif., Oct. 16, 2012 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that it has reached a number of key milestones in relation to customer shipments and technology adoption, reaffirming CEVA's position as the world's leading DSP licensing company. (Logo: http://photos.prnewswire.com/prnh/20120808/SF53702LOGO) Milestone highlights include: More than 4 billion...

2012-05-14 02:30:54

MOUNTAIN VIEW, Calif., May 14, 2012 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for the mobile handset, portable and consumer electronics markets, today announced that it has been ranked by leading research firm The Linley Group as the worldwide leader in DSP IP shipments in 2011, with a 90% market share. The market share numbers were published in The Linley Group's recent report, titled 'A Guide to...

2012-04-04 02:33:34

MOUNTAIN VIEW, Calif., April 4, 2012 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA) the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that it will be participating in the 2012 edition of the Linley Tech Mobile Conference to be held April 16-17 in San Jose, California. The two-day event delivers in-depth information from industry leaders focused on system design for mobile devices such as tablet computers, smartphones, navigation devices,...

2012-02-07 07:05:00

IRVINE, Calif., Feb. 7, 2012 /PRNewswire/ -- News Highlights: High-density 40nm architecture delivers higher bandwidth while reducing printed circuit board (PCB) size and power consumption by approximately 25 percent Features Broadcom's fourth generation of all-DSP electronic dispersion compensation (EDC) technology Extends industry's broadest portfolio of single, dual, quad, and now octal channel SFP+ PHYs Industry's first Octal 10GbE PHY optimized for increasing data center and...

2011-11-07 06:00:00

MOUNTAIN VIEW, Calif., Nov. 7, 2011 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA); (LSE: CVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that CEVA-TeakLite-III DSP has been licensed by Toshiba Corporation to power its upcoming mobile audio chip and automotive audio DSP product lines. Delivering best-in-class performance for such intensive audio applications, the CEVA-TeakLite-III DSP provides Toshiba with the most advanced...

2010-12-06 06:00:00

MOUNTAIN VIEW, Calif., Dec. 6, 2010 /PRNewswire-FirstCall/ -- CEVA, Inc. (Nasdaq: CEVA); (LSE: CVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that it has been ranked by leading research firm The Linley Group as the worldwide leader in DSP licensing revenue and in licensable DSP unit shipments in 2009, with 78% and 80% market share, respectively. The market share numbers were published in The Linley Group's recent report,...