Latest Thermal conductivity Stories

Rensselaer Polytechnic Institute A team of interdisciplinary researchers at Rensselaer Polytechnic Institute has developed a new method for significantly increasing the heat transfer rate across two different materials. Results of the team’s study, published in the journal Nature Materials, could enable new advances in cooling computer chips and lighting-emitting diode (LED) devices, collecting solar power, harvesting waste heat, and other applications. By sandwiching a layer of...

PALO ALTO, Calif., Oct. 24, 2012 /PRNewswire/ -- Scientists in the Advanced Materials and Nanosystems directorate at the Lockheed Martin Space Systems Advanced Technology Center (ATC) in Palo Alto have developed a revolutionary nanotechnology copper-based electrical interconnect material, or solder, that can be processed around 200 °C. Once fully optimized, the CuantumFuse(TM) solder material is expected to produce joints with up to 10 times the electrical and thermal conductivity...

Northwestern University scientists have developed a thermoelectric material that is the best in the world at converting waste heat to electricity. This is very good news once you realize nearly two-thirds of energy input is lost as waste heat. The material could signify a paradigm shift. The inefficiency of current thermoelectric materials has limited their commercial use. Now, with a very environmentally stable material that is expected to convert 15 to 20 percent of waste heat to useful...

New silicone thermal interface material increases options for thermal management in electronic applications. Carpinteria, CA (PRWEB) August 02, 2012 NuSil Technology LLC (http://www.nusil.com), a global leader in silicone materials for the electronics and photonics industries, presents EPM1-2493, a low-viscosity, low modulus silicone elastomer with a nominal thermal conductivity of 1 W/mk. Offering bond lines as thin as 5 microns, EPM1-2493 can be used to adhere materials with differing...

New one-part Liqui-Form 2000 is a high thermal conductivity liquid formable thermal interface material designed for demanding applications. Chanhassen, MN (PRWEB) July 23, 2012 The Bergquist Company is proud to introduce its first Liqui-Form product in a new Liqui-Form product line, Liqui-Form 2000. Liqui-Form 2000 is a highly conformable shear-thinning thermal interface material which requires no curing, mixing or refrigeration. Its unique formulation assures excellent thermal...

Gap Filler 1000SR is a new two-part Gap Filling Thermal Interface Material that dispenses precisely without slumping offering the ideal form-in-place thermal solution. Chanhassen, MN (PRWEB) June 22, 2012 The Bergquist Company is proud to introduce Gap Filler 1000SR (Two-Part), the latest member of its industry-leading Gap Filler family. Gap Filler 1000SR is a two-component, room temperature cure, liquid-dispensable thermal interface material that features superior slump resistance. As...

SANTA CLARA, Calif., May 22, 2012 /PRNewswire/ -- Three companies, Thermal Engineering Associates (TEA), Package Science Services (PSS), and Microsanj, have collaborated to form the Microelectronic Design and Measurement (MD&M) Group. The MD&M Group will better serve customers of the three companies with a broad range of complementary products and services in the very specialized field of semiconductor and systems thermal management. MD&M products and...

LONDON, March 7, 2012 /PRNewswire/ -- - Stand N250 at Ecobuild 2012 BASF, one of the leading providers of products, systems and solutions for sustainable construction, will be exhibiting at Ecobuild 2012. The BASF stand (N250) will feature projects in the UK which have been used to demonstrate how energy efficiency in buildings can be achieved through innovative, competent and reliable solutions. These projects - The BASF House in Nottingham, The Victorian...

Research by UT Dallas engineers could lead to more-efficient cooling of electronics, producing quieter and longer-lasting computers, and cellphones and other devices. Much of modern technology is based on silicon's use as a semiconductor material, but research recently published in the journal Nature Materials shows that graphene conducts heat about 20 times faster than silicon. "Heat is generated every time a device computes," said "Dr. Kyeongjae "KJ" Cho, associate professor of...

A team of U.S. and Chinese researchers are claiming that they have developed a new type of graphene that could prevent laptops and other electronic devices from overheating. Mechanical and electrical engineers from the University of Texas at Austin and the University of California - Riverside, along with colleagues from the University of Texas at Dallas and Xiamen University in China, have demonstrated that the thermal properties of isotopically engineered graphene far surpassed those of...