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Latest Thermal conductivity Stories

2013-07-08 14:20:42

Boron arsenide may be of potential interest for cooling applications An unlikely material, cubic boron arsenide, could deliver an extraordinarily high thermal conductivity – on par with the industry standard set by costly diamond – researchers report in the current issue of the journal Physical Review Letters. The discovery that the chemical compound of boron and arsenic could rival diamond, the best-known thermal conductor, surprised the team of...

Boosting Heat Transfer With Nanoglue
2012-12-04 20:34:42

Rensselaer Polytechnic Institute A team of interdisciplinary researchers at Rensselaer Polytechnic Institute has developed a new method for significantly increasing the heat transfer rate across two different materials. Results of the team´s study, published in the journal Nature Materials, could enable new advances in cooling computer chips and lighting-emitting diode (LED) devices, collecting solar power, harvesting waste heat, and other applications. By sandwiching a layer of...

2012-09-19 16:25:53

Northwestern University scientists have developed a thermoelectric material that is the best in the world at converting waste heat to electricity. This is very good news once you realize nearly two-thirds of energy input is lost as waste heat. The material could signify a paradigm shift. The inefficiency of current thermoelectric materials has limited their commercial use. Now, with a very environmentally stable material that is expected to convert 15 to 20 percent of waste heat to useful...

2012-08-02 23:03:20

New silicone thermal interface material increases options for thermal management in electronic applications. Carpinteria, CA (PRWEB) August 02, 2012 NuSil Technology LLC (http://www.nusil.com), a global leader in silicone materials for the electronics and photonics industries, presents EPM1-2493, a low-viscosity, low modulus silicone elastomer with a nominal thermal conductivity of 1 W/mk. Offering bond lines as thin as 5 microns, EPM1-2493 can be used to adhere materials with differing...

2012-07-23 23:00:30

New one-part Liqui-Form 2000 is a high thermal conductivity liquid formable thermal interface material designed for demanding applications. Chanhassen, MN (PRWEB) July 23, 2012 The Bergquist Company is proud to introduce its first Liqui-Form product in a new Liqui-Form product line, Liqui-Form 2000. Liqui-Form 2000 is a highly conformable shear-thinning thermal interface material which requires no curing, mixing or refrigeration. Its unique formulation assures excellent thermal performance,...

2012-06-23 23:00:17

Gap Filler 1000SR is a new two-part Gap Filling Thermal Interface Material that dispenses precisely without slumping offering the ideal form-in-place thermal solution. Chanhassen, MN (PRWEB) June 22, 2012 The Bergquist Company is proud to introduce Gap Filler 1000SR (Two-Part), the latest member of its industry-leading Gap Filler family. Gap Filler 1000SR is a two-component, room temperature cure, liquid-dispensable thermal interface material that features superior slump resistance. As...

2012-01-09 19:13:48

Research by UT Dallas engineers could lead to more-efficient cooling of electronics, producing quieter and longer-lasting computers, and cellphones and other devices. Much of modern technology is based on silicon's use as a semiconductor material, but research recently published in the journal Nature Materials shows that graphene conducts heat about 20 times faster than silicon. "Heat is generated every time a device computes," said "Dr. Kyeongjae "KJ" Cho, associate professor of...


Word of the Day
caparison
  • A cloth or covering, more or less ornamented, laid over the saddle or furniture of a horse, especially of a sumpter-horse or horse of state.
  • Clothing, especially sumptuous clothing; equipment; outfit.
  • To cover with a caparison, as a horse.
  • To dress sumptuously; adorn with rich dress.
This word ultimately comes from the Medieval Latin 'cappa,' cloak.
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