Latest Thermal conductivity Stories
New silicone thermal interface material increases options for thermal management in electronic applications. Carpinteria, CA (PRWEB) August 02, 2012
New one-part Liqui-Form 2000 is a high thermal conductivity liquid formable thermal interface material designed for demanding applications. Chanhassen, MN (PRWEB)
Gap Filler 1000SR is a new two-part Gap Filling Thermal Interface Material that dispenses precisely without slumping offering the ideal form-in-place thermal solution. Chanhassen,
Research by UT Dallas engineers could lead to more-efficient cooling of electronics, producing quieter and longer-lasting computers, and cellphones and other devices.
A team of U.S. and Chinese researchers are claiming that they have developed a new type of graphene that could prevent laptops and other electronic devices from overheating.
Size matters… but apparently so does shape – when it comes to conducting heat in very small spaces.
The surprising discovery of a new way to tune and enhance thermal conductivity – a basic property generally considered to be fixed for a given material – gives engineers a new tool for managing thermal effects in smart phones and computers, lasers and a number of other powered devices.
Rensselaer Polytechnic Institute researchers create large marble-sized pellets of thermoelectric nanomaterials.
- Growing in low tufty patches.