Latest Thermal conductivity Stories
Rensselaer Polytechnic Institute researchers create large marble-sized pellets of thermoelectric nanomaterials.
LANCASTER, Pa., June 14, 2011 /PRNewswire/ -- Thermacore (www.thermacore.com), a leading provider of advanced thermal solutions, announced today that it recently delivered Constant Conductance Heat Pipes (CCHPs) to NASA in support of the agency's Global Precipitation Measurement (GPM) mission, as well as high thermally conductive k-CoreÂ® structural components for the agency's Thermal Infrared Sensor (TIRS) program supporting the Landsat Data Continuity Mission (LDCM).
Neutron analysis of the atomic dynamics behind thermal conductivity is helping scientists at the Department of Energy's Oak Ridge National Laboratory gain a deeper understanding of how thermoelectric materials work.
By combining high pressure with high temperature, Livermore researchers have created a nanocyrstalline diamond aerogel that could improve the optics for something as big as a telescope or as small as the lenses in eyeglasses.
HANFORD, Calif., May 16, 2011 /PRNewswire/ -- Thresher Industries (PinkSheets: THRR) announced today that it has received a purchase order from a California based aftermarket automotive company to further develop its ThermaLite metal matrix composite for use as an enclosure requiring superior thermal conductivity.
Optical data carriers such as DVDs, Blu-rays and CD-RWs store data in layers of so-called "phase change materials".
LANCASTER, Pa., March 15, 2011 /PRNewswire/ -- Thermacore (www.thermacore.com), a leading provider of advanced thermal solutions, introduces a new line of cold plates that meet the most recent VME64x/VPX standards and supports commercial off-the-shelf (COTS) packaging formats.
Researchers at the Georgia Tech Research Institute (GTRI) are developing a solid composite material to help cool small, powerful microelectronics used in defense systems.
Researchers from Boston College, MIT, Clemson University and the University of Virginia have used nanotechnology to achieve a 60-90 percent increase in the thermoelectric figure of merit of p-type half-Heusler, a common bulk semiconductor compound.