Latest Thermal copper pillar bump Stories

Nanoscale Pillars Could Radically Improve Thermoelectric Materials
2014-02-21 13:46:23

University of Colorado at Boulder University of Colorado Boulder scientists have found a creative way to radically improve thermoelectric materials, a finding that could one day lead to the development of improved solar panels, more energy-efficient cooling equipment, and even the creation of new devices that could turn the vast amounts of heat wasted at power plants into more electricity. The technique—building an array of tiny pillars on top of a sheet of thermoelectric...

2013-12-27 23:02:51

This report from BCC Research provides an overview of the global market for flip-chip technologies. It examines, quantifies, and forecasts the growth of the market and offers guidance to interested parties. Wellesley, Mass (PRWEB) December 27, 2013 According to a new technical market research report Flip Chip Technologies and Global Markets from BCC Research (http://www.bccresearch.com) the global market for flip chip technology was valued at $18.9 billion in 2012 and is expected to...

2010-09-28 21:00:00

TOKYO, Sept. 28 /PRNewswire/ -- OKI Engineering, an OKI Group company offering reliability assessments and technical solutions in the field of environmental protection announced that today it has expanded its range of thermal characteristics analysis services for semiconductor devices. A service that measures the thermal resistance and heat capacity of power devices and optical devices will be available from today. (Photo: http://photos.prnewswire.com/prnh/20100928/NY72627-a ) (Photo:...

2010-05-18 03:00:00

GENEVA and FREIBURG, Germany, May 18 /PRNewswire-FirstCall/ -- STMicroelectronics (NYSE: STM), the world's number one supplier of semiconductors for power and power management applications, and Micropelt GmbH, a young German company specializing in novel thin film thermoelectric devices, have announced a jointly-developed autonomous wireless sensor evaluation kit. The TE-Power NODE evaluation kit combines Micropelt's Thermogenerator and ST's EnFilm(TM) solid-state thin-film battery as...

2009-03-16 09:00:00

Improved thermal material significantly decreases use of lead in semiconductor- power/discrete devices, helping to meet growing demand for more environmentally friendly solutions MORRIS TOWNSHIP, N.J., March 16 /PRNewswire/ -- Honeywell (NYSE: HON) announced today that it has developed a new lead-free packaging technology that improves the thermal management of semiconductor chips. The new product, called Honeywell Pb-free Die Attach Solder, is a lead-free thermal interface material that...

2008-06-30 12:03:07

Nextreme Thermal Solutions, the leader in microscale thermal and power management products for the electronics industry, has been awarded a grant from the North Carolina Green Business Fund to enhance the efficiency of thin-film thermoelectrics used to convert waste heat into electricity. Efficiency of power conversion is becoming increasingly important across all market segments, including IT, automotive, and industrial manufacturing. As energy costs continue to skyrocket, the...

2008-02-12 10:30:00

Connections fabricated between computer chips, external circuitry and processorsAs computers become more complex, the demand increases for more connections between computer chips and external circuitry such as a motherboard or wireless card. And as the integrated circuits become more advanced, maximizing their performance requires better connections that operate at higher frequencies with less loss.Improving these two types of connections will increase the amount and speed of information that...

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