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Latest Three-dimensional integrated circuit Stories

2014-08-08 04:22:28

SHANGHAI, Aug. 8, 2014 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) the largest and most advanced pure foundry provider in China; and Jiangsu Changjiang Electronics Technology Co., Ltd. ("JCET", SSE: 600584), the largest packaging service provider in China, jointly announced today the formation of a joint venture for 12-inch bumping and related testing, from the previously signed joint venture agreement, which will be established...

2014-08-05 12:36:06

DUBLIN, Aug. 5, 2014 /PRNewswire/ -- Research and Markets has announced the addition of the "3DIC & 2.5D TSV Interconnect for Advanced Packaging - 2014 Business Update" report to their offering. http://photos.prnewswire.com/prnh/20130307/600769 Through Silicon Vias (TSV) technology was adopted in production a few years ago for MEMS and CMOS Image Sensors (CIS). Driven by consumer applications such as smartphones and tablets, this market is expected to continue to grow over the next...

2014-07-23 04:22:27

SINGAPORE, July 23, 2014 /PRNewswire/ -- Public-Private Partnership to drive innovative solutions for complex micro chip manufacturing Four joint laboratories, representing a commitment of S$200m between private and public sectors, were launched today between A*STAR's Institute of Microelectronics (IME), and its 10 industry partners. The Advanced Semiconductor Joint Labs will develop and advance semiconductor technologies for future electronics markets. The industry...

2014-07-15 23:03:48

3D animation market has the highest global market share for the media and entertainment vertical. The different industries/ verticals based on which this report has been divided are architecture, building and construction, academia and education, defense and intelligence, healthcare and life sciences, manufacturing and design, and others. Dallas, TX (PRWEB) July 15, 2014 Global 3D animation market is estimated to grow from $21.06 billion in 2014 to $40.78 billion in 2019 at a Compound...

2014-06-30 23:12:56

The report categorizes global market by product type, application, and geography and also provides a detailed analysis of the current market scenarios, and the market is estimated until the year 2020. (http://www.marketsandmarkets.com/Market-Reports/3d-4d-technology-market-646.html) (PRWEB) June 30, 2014 According to the recent market research report, "3D and 4D Technology Market by 3D Product Type (IC, Printer, Gaming, Cinema Screen, CAD, Navigation, Animation, Camera, Medical...

2014-06-30 08:37:09

GEMINI®FB XT surpasses ITRS requirements for wafer bonding with up to 3X improvement in wafer-to-wafer alignment; enhanced productivity enables 50 percent increased throughput ST. FLORIAN, Austria, June 30, 2014 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the GEMINI(®)FB XT--its next-generation fusion wafer bonding platform, which combines several performance...

2014-06-29 23:00:52

Transparency Market Research has published a new report titled "3D ICs Market: Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2013 - 2019" to its report store. Browse the full report: http://www.transparencymarketresearch.com/3d-ics-market.html. Albany, New York (PRWEB) June 29, 2014 This report analyzes the 3D ICs market on a global basis, with further breakdown into various sub-segments. It provides cross-sectional analysis of the market based on parameters...

2014-06-13 08:26:01

NEW TAIPEI CITY, June 13, 2014 /PRNewswire/ -- Kingyoup Optronics Co., Ltd. ("Kingyoup") during the IEEE Electronics Components and Technology Conference (ECTC) held at Orlando, Florida USA, in May 2014 show-cased their temporary bonding and debonding equipment developed in collaboration with IBM (NYSE:IBM). This equipment is specially designed to meet the microelectronics miniaturization needs of today's smart, mobile, consumer electronics devices. Specifically, it enables 3D...

2014-06-12 23:05:24

The total System in Package (SiP) market is estimated to reach $18.10 billion by 2020 at a higher single digit CAGR from 2013 to 2020. (http://www.marketsandmarkets.com/Market-Reports/System-In-Package-SIP-Market-Chip-Stack-Multi-Chip-Module-MCM-Market-625.html) (PRWEB) June 12, 2014 According to a new market research report "System in Package (SiP) Market by Technology (2D, 2.5D & 3D), Type (BGA, SMT, QFP, SOP), Interconnection Technology (Flip-Chip & Wire-bond),...

2014-06-01 23:00:47

System in Package market research report categorizes the “System in Package Market” on the basis of different packaging technology, packaging type, interconnection technology, applications, and geographical analysis, forecasting revenue, and analyzing trends in the market. (http://www.marketsandmarkets.com/Market-Reports/System-In-Package-SIP-Market-Chip-Stack-Multi-Chip-Module-MCM-Market-625.html) (PRWEB) June 01, 2014 According to a new market research report "System in Package...


Latest Three-dimensional integrated circuit Reference Libraries

24_4ef309736f760441603afe03433e193d
2010-09-02 16:42:23

A chip, also known as an integrated circuit, is a miniaturized electronic circuit consisting mainly of semiconductor devices and passive components, that has been manufactured in the surface of a thin substrate of semiconductor material. There are many different types of chips: microcircuit, microchip, silicon chip, etc. Integrated circuits are regularly used in present-day electronic equipment and have modernized the world of electronics. Computers, cellular phones, and other electronic...

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Word of the Day
mallemaroking
  • Nautical, the visiting and carousing of sailors in the Greenland ships.
This word is apparently from a confusion of two similar Dutch words: 'mallemerok,' a foolish woman, and 'mallemok,' a name for some persons among the crew of a whaling vessel.