Latest Three-dimensional integrated circuit Stories
WUHAN, China, March 12, 2015 /PRNewswire/ -- XMC, a leading 300MM semiconductor manufacturing company, today announces it has shipped over 100 million Backside Illumination (BSI) CMOS Image
New UltraScale+ FPGA, SoC, and 3D IC applications include LTE Advanced and early 5G wireless, terabit wired communications, automotive ADAS, and industrial IoT SAN JOSE, Calif., Feb.
Fraunhofer IZM Selects SPTS' DRIE and Low Temperature CVD to Develop Next Generation Manufacturing Techniques YAVNE, Israel, Jan. 15, 2015 /PRNewswire/ -- ORBOTECH LTD.
ANSYS integrated circuit simulation tools help meet power and thermal requirementsfor 3D-IC development PITTSBURGH, Jan.
Enables Delivery of Accurate Sentaurus TCAD Models for Nanowire, FinFET and Tunnel-FET Transistors MOUNTAIN VIEW, Calif. and LEUVEN, Belgium, Dec.
DALLAS, December 15, 2014 /PRNewswire/ -- ReportsnReports.com adds Future Trends of the Worldwide TSV 3D IC Industry research report published in Dec 2014 and providing
In the upcoming 2014 IEEE S3S conference (October 6-9), MonolithIC 3D will unveil a breakthrough flow that is game-changing for 3D IC technology. San Jose, CA
System in Package market research report describes the value chain for SiP market by considering all the major stakeholders in the market and their role analysis & provides a detailed scrutiny
A chip, also known as an integrated circuit, is a miniaturized electronic circuit consisting mainly of semiconductor devices and passive components, that has been manufactured in the surface of a thin substrate of semiconductor material. There are many different types of chips: microcircuit, microchip, silicon chip, etc. Integrated circuits are regularly used in present-day electronic equipment and have modernized the world of electronics. Computers, cellular phones, and other electronic...