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Latest Three-dimensional integrated circuit Stories

2014-06-30 23:12:56

The report categorizes global market by product type, application, and geography and also provides a detailed analysis of the current market scenarios, and the market is estimated until the year 2020. (http://www.marketsandmarkets.com/Market-Reports/3d-4d-technology-market-646.html) (PRWEB) June 30, 2014 According to the recent market research report, "3D and 4D Technology Market by 3D Product Type (IC, Printer, Gaming, Cinema Screen, CAD, Navigation, Animation, Camera, Medical...

2014-06-30 08:37:09

GEMINI®FB XT surpasses ITRS requirements for wafer bonding with up to 3X improvement in wafer-to-wafer alignment; enhanced productivity enables 50 percent increased throughput ST. FLORIAN, Austria, June 30, 2014 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the GEMINI(®)FB XT--its next-generation fusion wafer bonding platform, which combines several performance...

2014-06-29 23:00:52

Transparency Market Research has published a new report titled "3D ICs Market: Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2013 - 2019" to its report store. Browse the full report: http://www.transparencymarketresearch.com/3d-ics-market.html. Albany, New York (PRWEB) June 29, 2014 This report analyzes the 3D ICs market on a global basis, with further breakdown into various sub-segments. It provides cross-sectional analysis of the market based on parameters...

2014-06-13 08:26:01

NEW TAIPEI CITY, June 13, 2014 /PRNewswire/ -- Kingyoup Optronics Co., Ltd. ("Kingyoup") during the IEEE Electronics Components and Technology Conference (ECTC) held at Orlando, Florida USA, in May 2014 show-cased their temporary bonding and debonding equipment developed in collaboration with IBM (NYSE:IBM). This equipment is specially designed to meet the microelectronics miniaturization needs of today's smart, mobile, consumer electronics devices. Specifically, it enables 3D...

2014-06-12 23:05:24

The total System in Package (SiP) market is estimated to reach $18.10 billion by 2020 at a higher single digit CAGR from 2013 to 2020. (http://www.marketsandmarkets.com/Market-Reports/System-In-Package-SIP-Market-Chip-Stack-Multi-Chip-Module-MCM-Market-625.html) (PRWEB) June 12, 2014 According to a new market research report "System in Package (SiP) Market by Technology (2D, 2.5D & 3D), Type (BGA, SMT, QFP, SOP), Interconnection Technology (Flip-Chip & Wire-bond),...

2014-06-01 23:00:47

System in Package market research report categorizes the “System in Package Market” on the basis of different packaging technology, packaging type, interconnection technology, applications, and geographical analysis, forecasting revenue, and analyzing trends in the market. (http://www.marketsandmarkets.com/Market-Reports/System-In-Package-SIP-Market-Chip-Stack-Multi-Chip-Module-MCM-Market-625.html) (PRWEB) June 01, 2014 According to a new market research report "System in Package...

2014-05-30 23:06:44

GIA announces the release of a trend report on 3D Packaging. Market for 3D Packaging is projected to witness strong growth driven by the growing trend towards miniaturization of electronic devices, and strong emphasis on product performance, power efficiency, and cost reduction. San Jose, California (PRWEB) May 30, 2014 Follow us on LinkedIn - 3D packaging technology is an advanced approach used to vertically stack semiconductor components such as diodes, ICs and MOSFETs for reducing the...

2014-05-21 23:11:15

System in Package (SiP) Market research report categorizes global market on the basis of different packaging technology, packaging type, interconnection technology, applications, and geographical analysis, forecasting revenue, and analyzing trends in the market. (http://www.marketsandmarkets.com/Market-Reports/System-In-Package-SIP-Market-Chip-Stack-Multi-Chip-Module-MCM-Market-625.html) (PRWEB) May 21, 2014 According to a new market research report "System in Package (SiP) Market by...

2014-05-19 12:26:31

LONDON, May 19, 2014 /PRNewswire/ -- Reportbuyer.com has added a new market research report:3D ICs (MEMS and sensors, RF SiP, Optoelectronics and imaging, Memories, Logic, HB LED) Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2013 - 2019http://www.reportbuyer.com/computing_electronics/manufacturing/3d_ics_mems_sensors_rf_sip_optoelectronics_imaging_memories_logic_hb_led_market_global_industry_analysis_size_share_growth_trends_forecast_2013_2019.html...

2014-04-30 16:35:25

DALLAS, May 1, 2014 /PRNewswire/ -- According to a new market research report "System in Package (SiP) Market by Technology (2D, 2.5D & 3D), Type (BGA, SMT, QFP, SOP), Interconnection Technology (Flip-Chip & Wire-bond), Applications (Communications, Consumer, Automotive, Medical) and Geography (N. America, Europe, APAC & ROW) - Global Trends & Forecasts to - 2014 - 2020", published by MarketsandMarkets, the total System in Package (SiP) market is expected to...


Latest Three-dimensional integrated circuit Reference Libraries

24_4ef309736f760441603afe03433e193d
2010-09-02 16:42:23

A chip, also known as an integrated circuit, is a miniaturized electronic circuit consisting mainly of semiconductor devices and passive components, that has been manufactured in the surface of a thin substrate of semiconductor material. There are many different types of chips: microcircuit, microchip, silicon chip, etc. Integrated circuits are regularly used in present-day electronic equipment and have modernized the world of electronics. Computers, cellular phones, and other electronic...

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Word of the Day
tesla
  • The unit of magnetic flux density in the International System of Units, equal to the magnitude of the magnetic field vector necessary to produce a force of one newton on a charge of one coulomb moving perpendicular to the direction of the magnetic field vector with a velocity of one meter per second. It is equivalent to one weber per square meter.
This word is named for Nikola Tesla, the inventor, engineer, and futurist.