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Latest TSMC Stories

2014-04-21 04:21:32

Innovative Copper Bump Package Technology Improves Quality, Reliability and Performance in Altera's 20 nm Device Family SAN JOSE, Calif. and HSINCHU, Taiwan, R.O.C., April 21, 2014 /PRNewswire/ -- Altera Corporation (NASDAQ: ALTR) and TSMC (TWSE: 2330, NYSE: TSM) today announced the two companies have worked together to bring TSMC's patented, fine-pitch copper bump-based packaging technology to Altera's 20 nm Arria 10 FPGAs and SoCs. Altera is the first company to adopt this...

2014-04-15 12:34:10

Full certification enables customers to tape out 16nm FinFET designs using Cadence tools SAN JOSE, Calif., April 15, 2014 /PRNewswire/ -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced its digital, custom and signoff tools have received V1.0 Design Rule Manual (DRM) and SPICE certification for TSMC's 16nm FinFET process, enabling joint customers to begin taping out FinFET-based designs using Cadence® tools. Cadence's...

2014-04-15 08:38:50

WILSONVILLE, Ore., April 15, 2014 /PRNewswire/ -- Mentor Graphics Corp. (NASDAQ: MENT) today announced that its IC design to silicon solution has achieved certification for TSMC's Design Rule Manual (DRM) and SPICE model version 1.0 for its 16nm FinFET process. The certification includes tools in the Calibre® physical verification and design-for-manufacturing (DFM) platform, as well as the Olympus-SoC(TM) place and route system, the Pyxis(TM) custom IC design platform, and Eldo®...

2014-04-15 08:20:32

PITTSBURGH, April 15, 2014 /PRNewswire/ -- ANSYS, Inc. (NASDAQ: ANSS) announced today that its RedHawk(TM) and Totem(TM) products are certified for production version 1.0 of Design Rule Manual (DRM) and SPICE model tool certification for TSMC 16-nanometer (nm) FinFET technology. TSMC has certified these solutions for static and dynamic voltage drop analysis and signal and power electromigration (EM) verification. http://photos.prnewswire.com/prnvar/20130430/NE03388LOGO FinFET...

2014-04-14 20:21:27

DUBLIN, April 14, 2014 /PRNewswire/ -- Research and Markets (http://www.researchandmarkets.com/research/tp2v8h/global) has announced the addition of the "Global Semiconductor Stepper Equipment Market Report" [http://www.researchandmarkets.com/research/tp2v8h/global ] report to their offering. (Logo: http://photos.prnewswire.com/prnh/20130307/600769 ) The analysts forecast the Global Semiconductor Stepper Equipment market to grow at a CAGR of 12.37 percent over...

2014-04-12 12:20:12

ChinaMarketResearchReports.com adds Latest Report on "Research Report on China Integrated Circuit (IC) Industry, 2014-2018" to its store. DALLAS, April 12, 2014 /PRNewswire-iReach/ -- The growth rate of China integrated circuit industry ranks the first in the world after China joined WTO. The average annual growth rate of the production volume and sales revenue of integrated circuits exceeded 20% in 20012012. The proportion of domestic industry scale in the global industry scale increased...

2014-04-11 08:26:14

DUBLIN, Ireland, April 11, 2014 /PRNewswire/ -- Research and Markets ( http://www.researchandmarkets.com/research/t97xjx/mainland_chinas) has announced the addition of the "Mainland China's Semiconductor and Equipment Markets: A Complete Analysis of the Technical, Economic, and Political Issues" [http://www.researchandmarkets.com/research/t97xjx/mainland_chinas ] report to their offering. <start_newscom> (Logo: http://photos.prnewswire.com/prnh/20130307/600769 )...

2014-04-02 16:25:44

Sandlerresearch.org adds Review on the Development of Cross-Strait Semiconductor Industries in 2013 research report to its store. DALLAS, April 2, 2014 /PRNewswire-iReach/ -- Driven by the Chinese government's preferential policies and enormous domestic market needs, international semiconductor vendors have constantly set up plants in China to strengthen their deployment. The movement has also contributed to the development of Chinese IC design houses, manufacturers, and packaging and...

2014-03-26 08:22:31

SUNNYVALE, California and AHMEDABAD, India, March 26, 2014 /PRNewswire/ -- eInfochips, a leading semiconductor and product engineering company, today launched design services for chips based on 16nm geometry. The comprehensive suite of services includes Netlist to GDSII, Sign-off, and Design for Testability. eInfochips is one of the few engineering services companies in the world capable of delivering 16nm chip designs which reduce a chip's power consumption by half, while...

2014-03-24 23:22:09

GIA announces the release of a comprehensive global report on System-on-a-Chip (SoC) markets. Global market for System-on-a-Chip is projected to approximate to over US$300 billion by 2020, driven by strong growth in consumer, automotive and industrial electronics, especially in developing countries. San Jose, California (PRWEB) March 24, 2014 Follow us on LinkedIn - System-on-a-Chip (SoC), a cutting-edge semiconductor packaging technology, represents the integration of computer hardware...


Word of the Day
monteith
  • A large punch-bowl of the eighteenth century, usually of silver and with a movable rim, and decorated with flutings and a scalloped edge. It was also used for cooling and carrying wine-glasses.
  • A kind of cotton handkerchief having white spots on a colored ground, the spots being produced by a chemical which discharges the color.
This word is possibly named after Monteith (Monteigh), 'an eccentric 17th-century Scotsman who wore a cloak scalloped at the hem.'
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