Latest Unisem Group Stories

2008-10-13 09:00:34

Unisem Group today announced that it has started volume shipment of packages using its industry-leading copper wirebonding technology. Unisem's copper wirebond process has been qualified by several IC manufacturers worldwide, including Integrated Device Technology (IDT), a leading provider of mixed-signal semiconductor solutions. The IDT thin shrink small outline packages (TSSOP) integrate Unisem's copper wirebonds for a wide range of applications, including clock devices for desktops and...

Word of the Day
  • A vial or small glass bottle, especially one for holding vinegar, oil, etc.; a caster for liquids.
This word is Middle English in origin, and ultimately comes from the Old French, diminutive of 'crue,' flask.