Latest Unisem Group Stories

2008-10-13 09:00:34

Unisem Group today announced that it has started volume shipment of packages using its industry-leading copper wirebonding technology. Unisem's copper wirebond process has been qualified by several IC manufacturers worldwide, including Integrated Device Technology (IDT), a leading provider of mixed-signal semiconductor solutions. The IDT thin shrink small outline packages (TSSOP) integrate Unisem's copper wirebonds for a wide range of applications, including clock devices for desktops and...

Word of the Day
  • Wasting away as a result of abstinence from food.
The word 'abrosia' comes from a Greek roots meaning 'not' and 'eating'.