Latest Very-large-scale integration Stories

2013-11-08 23:23:53

Presenting at IP-SoC 2013 in France Milpitas, California (PRWEB) November 08, 2013 Open-Silicon, Inc., a leading semiconductor design and manufacturing company, announced today that it would present two technical papers at IP-SOC 2013 in Grenoble, France. Mrugesh Walimbe, MTS Function Manager, and Mahesh Penugonda, Senior Engineer VLSI for Open-Silicon, will present “Auto Clock Generation for an SoC”. This paper addresses the growing complexity of SoCs in terms of functionality and...

2011-02-22 08:00:00

SAN FRANCISCO, Feb. 22, 2011 /PRNewswire/ -- Texas Instruments Incorporated (TI) (NYSE: TXN) and the Massachusetts Institute of Technology (MIT) today presented a joint research paper detailing design methodologies for a 28-nanometer (nm) mobile applications processor at the 2011 International Solid-State Circuits Conference (ISSCC). The paper--"A 28nm 0.6V Low Power Digital Signal Processor (DSP) for Mobile Applications"--demonstrates that a DSP is capable of scaling from high-performance...

2011-01-18 04:35:03

Tokyo, Jan 18, 2011 - (ACN Newswire) - NEC Corporation (NEC; TSE: 6701) announced today to market its award-winning C and SystemC synthesis VLSI design suite, "CyberWorkBench" (CWB), in North America. NEC is partnering with EDATechForce, LLC for local distribution.CWB is a complete VLSI development suite comprised of a series of advanced LSI design tools using C or SystemC as input language that form an integrated design platform for ASICs, FPGAs and ASSPs. NEC group has been developing CWB...

2010-07-08 15:15:00

MILPITAS, Calif., July 8 /PRNewswire/ -- VLSI Standards, Inc. has announced that it has expanded its current portfolio of Solar Cell Certification Services to include ISO-17025 accredited certification of customer supplied production cells up to 156 mm x 156 mm in size. VLSI offers multiple traceability paths to globally recognize national metrology institutes and laboratories including the Physikalisch Technische Bundesanstalt (PTB) of Germany, the National Institute of Advanced...

2010-06-16 21:00:00

HSINCHU, Taiwan, June 16 /PRNewswire-Asia/ -- Macronix International Co., Ltd. (TSE: 2337), a leading provider of non-volatile memory semiconductor solutions, today announced its research results that provide a successful path to the most scalable and most efficient 3D NAND Flash using its patented BE- SONOS (barrier engineering) charge-trapping technology and 3D decoding architecture. Because of the important breakthrough, this Macronix's work addressing 3D NAND Flash has been chosen as...

2010-05-28 17:58:16

Presentation illustrates the power of applying atomistic simulation to microelectronics Materials Design (www.materialsdesign.com) announces a joint presentation with University of Texas at Dallas, KAUST, and Texas Instruments at the 2010 Symposia on VLSI Technology and Circuits on June 17th in Honolulu, Hawaii. The presentation will describe the results of a close collaboration including experiment and atomistic simulation, and illustrates the power of this complementarity in guiding the...

Latest Very-large-scale integration Reference Libraries

2010-09-02 16:42:23

A chip, also known as an integrated circuit, is a miniaturized electronic circuit consisting mainly of semiconductor devices and passive components, that has been manufactured in the surface of a thin substrate of semiconductor material. There are many different types of chips: microcircuit, microchip, silicon chip, etc. Integrated circuits are regularly used in present-day electronic equipment and have modernized the world of electronics. Computers, cellular phones, and other electronic...

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  • A small crescent-shaped structure or marking, especially the white area at the base of a fingernail that resembles a half-moon.
This word is a diminutive of the Latin 'luna,' moon.