Latest Wafer-level Packaging Stories
LONDON, Oct. 13, 2014 /PRNewswire/ -- Flip chips are appearing in a plethora of high-volume consumer products such as mobile phones, digital cameras, MP3 players, and computer peripherals.
Yield Engineering Systems, Inc. Announced They Are Exhibiting at IWLPC Livermore, CA (PRWEB) August 15, 2014 Yield Engineering Systems, Inc.
Yield Engineering Systems, Inc. Announced They Are Exhibiting at IWLPC. Livermore, CA (PRWEB) September 04, 2013 Yield Engineering Systems, Inc.
3D Chip Packaging Expected to be a Major Inflection Point for the Semiconductor Industry, Allowing Smaller Packages, Lower Power Consumption and Higher Data BandwidthSingapore,
Joint facility will develop new tools and integration schemes for growing wafer-level packaging marketSingapore, Apr 13, 2011 - (ACN Newswire) - Applied Materials, Inc., the global leader in providing manufacturing solutions for the semiconductor, flat panel display and solar photovoltaic industries, today signed an agreement with the Institute of Microelectronics (IME), a world-renowned research institute under the Agency for Science, Technology and Research (A*STAR), to set up a Center of...
- A small wooded valley; a dell.
- The protecting weather-shed built around the entrance to a house.
- The roofed-over space between the kitchen and the sleeping-quarters in a logging-camp, commonly used as a storeroom.