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Latest Wafer-level Packaging Stories

2014-08-18 16:25:28

LONDON, Aug. 18, 2014 /PRNewswire/ -- Reportbuyer.com has added a new market research report:Lithography, Deposition, and Etch Market Analysis for Flip Chip/WLP Manufacturinghttps://www.reportbuyer.com/product/2244721/Lithography-Deposition-and-Etch-Market-Analysis-for-Flip-Chip/WLP-Manufacturing.htmlFlip chips are appearing in a plethora of high-volume consumer products such as mobile phones, digital cameras, MP3 players, and computer peripherals. Wafer-level packaging (WLP), the...

2014-08-15 23:05:31

Yield Engineering Systems, Inc. Announced They Are Exhibiting at IWLPC Livermore, CA (PRWEB) August 15, 2014 Yield Engineering Systems, Inc. (YES), a wafer-level packaging equipment manufacturer, announced today that they will be exhibiting at the 11th Annual International Wafer Level Packaging Conference (IWLPC) being held at the Doubletree by Hilton Hotel in San Jose on November 11-12, 2014; YES will be located at Booth #6. IWLPC brings together some of the semiconductor industry's...

2013-09-04 23:25:27

Yield Engineering Systems, Inc. Announced They Are Exhibiting at IWLPC. Livermore, CA (PRWEB) September 04, 2013 Yield Engineering Systems, Inc. (YES), a quality process equipment manufacturer, announced today that they will be exhibiting at The 10th Annual International Wafer Level Packaging Conference (IWLPC) being held at the Doubletree by Hilton Hotel in San Jose on November 6-7, 2013. YES will be located at Booth #6. IWLPC brings together some of the semiconductor industry's...

2012-03-07 04:20:01

3D Chip Packaging Expected to be a Major Inflection Point for the Semiconductor Industry, Allowing Smaller Packages, Lower Power Consumption and Higher Data BandwidthSingapore, Mar 7, 2012 - (ACN Newswire) - Applied Materials Inc., the global leader in providing manufacturing solutions for the semiconductor, flat panel display and solar photovoltaic industries, and the Institute of Microelectronics (IME), a world-renowned research institute under the Agency for Science, Technology and...

2011-04-13 04:35:01

Joint facility will develop new tools and integration schemes for growing wafer-level packaging marketSingapore, Apr 13, 2011 - (ACN Newswire) - Applied Materials, Inc., the global leader in providing manufacturing solutions for the semiconductor, flat panel display and solar photovoltaic industries, today signed an agreement with the Institute of Microelectronics (IME), a world-renowned research institute under the Agency for Science, Technology and Research (A*STAR), to set up a Center of...

2010-07-12 07:00:00

SAN JOSE, Calif., July 12 /PRNewswire-FirstCall/ -- Novellus Systems (Nasdaq: NVLS) today introduced the SABRE 3D electroplating system for the rapidly-growing advanced wafer-level packaging (WLP) market. Utilizing technology from Novellus' industry-leading SABRE Electrofill® copper damascene interconnect system, SABRE 3D's flexible and modular architecture delivers a range of high-productivity WLP processes, including copper through-silicon vias (TSV), copper...


Word of the Day
vermicular
  • Like a worm in form or movement; vermiform; tortuous or sinuous; also, writhing or wriggling.
  • Like the track or trace of a worm; appearing as if worm-eaten; vermiculate.
  • Marked with fine, close-set, wavy or tortuous lines of color; vermiculated.
  • A form of rusticated masonry which is so wrought as to appear thickly indented with worm-tracks.
This word ultimately comes from the Latin 'vermis,' worm.
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