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Latest Wafer-level Packaging Stories

2013-09-04 23:25:27

Yield Engineering Systems, Inc. Announced They Are Exhibiting at IWLPC. Livermore, CA (PRWEB) September 04, 2013 Yield Engineering Systems, Inc. (YES), a quality process equipment manufacturer, announced today that they will be exhibiting at The 10th Annual International Wafer Level Packaging Conference (IWLPC) being held at the Doubletree by Hilton Hotel in San Jose on November 6-7, 2013. YES will be located at Booth #6. IWLPC brings together some of the semiconductor industry's...

2012-03-07 04:20:01

3D Chip Packaging Expected to be a Major Inflection Point for the Semiconductor Industry, Allowing Smaller Packages, Lower Power Consumption and Higher Data BandwidthSingapore, Mar 7, 2012 - (ACN Newswire) - Applied Materials Inc., the global leader in providing manufacturing solutions for the semiconductor, flat panel display and solar photovoltaic industries, and the Institute of Microelectronics (IME), a world-renowned research institute under the Agency for Science, Technology and...

2011-04-13 04:35:01

Joint facility will develop new tools and integration schemes for growing wafer-level packaging marketSingapore, Apr 13, 2011 - (ACN Newswire) - Applied Materials, Inc., the global leader in providing manufacturing solutions for the semiconductor, flat panel display and solar photovoltaic industries, today signed an agreement with the Institute of Microelectronics (IME), a world-renowned research institute under the Agency for Science, Technology and Research (A*STAR), to set up a Center of...

2010-07-12 07:00:00

SAN JOSE, Calif., July 12 /PRNewswire-FirstCall/ -- Novellus Systems (Nasdaq: NVLS) today introduced the SABRE 3D electroplating system for the rapidly-growing advanced wafer-level packaging (WLP) market. Utilizing technology from Novellus' industry-leading SABRE Electrofill® copper damascene interconnect system, SABRE 3D's flexible and modular architecture delivers a range of high-productivity WLP processes, including copper through-silicon vias (TSV), copper...

2010-05-31 08:00:00

ST. FLORIAN, Austria, May 31 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that world-renowned research institute, Fraunhofer IZM-ASSID, has placed an order for two EVG temporary bonding and debonding (TB/DB) systems for thin-wafer handling and processing for 3D ICs. ASSID (All Silicon System Integration Dresden), a new project group of Fraunhofer IZM, will use EVG's...

2010-03-30 09:33:00

ST. FLORIAN, Austria, March 30 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Morocco-based wafer-level camera manufacturer Nemotek Technologie has placed a repeat order for EVG's bonding and UV nanoimprint lithography (UV-NIL) systems - the EVG520IS and IQ Aligner. Nemotek will use these systems to address its production demands for CMOS image sensors and...


Word of the Day
toccata
  • In music, a work for a keyboard-instrument, like the pianoforte or organ, originally intended to utilize and display varieties of touch: but the term has been extended so as to include many irregular works, similar to the prelude, the fantasia, and the improvisation.
This word is Italian in origin, coming from the feminine past participle of 'toccare,' to touch.
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